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Selective deposition of abarrier layer on a metal film

  • US 20030181035A1
  • Filed: 12/18/2002
  • Published: 09/25/2003
  • Est. Priority Date: 12/21/2001
  • Status: Active Grant
First Claim
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1. A method of selectively forming a barrier layer on a metal feature, comprising:

  • providing a substrate having exposed metal features surrounded by a dielectric material to a process environment;

    forming a barrier layer on the exposed metal features using a cyclical deposition process wherein the cyclical deposition process includes a predetermined number of deposition cycles followed by a purge step, and wherein each deposition cycle comprises alternately providing a refractory metal-containing precursor and a reducing gas to the process environment; and

    repeating the cyclical deposition process until a desired thickness for the barrier layer is formed.

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