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Method of cleaning a semiconductor processing chamber

  • US 20030183244A1
  • Filed: 04/02/2002
  • Published: 10/02/2003
  • Est. Priority Date: 04/02/2002
  • Status: Active Grant
First Claim
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1. A method of operating a substrate processing chamber, said method comprising:

  • (a) processing one or more substrates in said substrate processing chamber;

    (b) cleaning said chamber using a dry cleaning process;

    (c) repeating steps (a) and (b) one or more times; and

    (d) thereafter, performing an extended cleaning process by flowing a cleaning gas into said chamber and forming a plasma within said chamber from said cleaning gas, wherein said plasma is maintained for a total of at least 5 minutes before said chamber is reused to process a substrate.

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