Electrical circuit and substrate therefor

• US 20030183405A1
• Filed: 12/20/2002
• Published: 10/02/2003
• Est. Priority Date: 03/07/2000
• Status: Abandoned Application

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Heider, Frank, Haugeneder, Andreas, Rautzenberg, Bernd, Hoebel, Albert-Andreas, Raica, Thomas
• Application Number:
  US10/221,009
• Publication Number:
  US 20030183405A1
• Time in Patent Office: Days
• US Class Current: 174/52.1
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 2201/09381 Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
• CPC Class Codes: H05K 2201/0969 Apertured conductors
• CPC Class Codes: H05K 2201/098 Special shape of the cross-section of conductors, e.g. very thick plated conductors
• CPC Class Codes: H05K 3/341 Surface mounted components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An electrical circuit on a substrate (10), having at least one component (30, 40) attached to a conductor layer (20, 21, 22, 23, 24, 25), is proposed; the component is surrounded by depressions (50, 51, 60) in the conductor layer. In addition, a substrate having at least one conductor layer for attaching at least one electrical component is proposed, the conductor layer having depressions to provide a flow barrier for a connecting material which is used for attaching the component; the depressions surround an area for attaching the component, and are positioned at a distance from each other such that the component has room between them, without the depressions having to be covered by the component.

Claims

1. An electrical circuit on a substrate (10), having at least one component (30, 40) attached to a conductor layer (20, 21, 22, 23, 24, 25),

wherein the component is surrounded by depressions (50, 51, 60) in the conductor layer.

2. The electrical circuit as recited in claim 1,

wherein the component is soldered or bonded onto the conductor layer.

3. The electrical circuit as recited in one of the preceding claims,

wherein the depressions are designed in particular in the form of round holes or in the form of trenches.

4. The electrical circuit as recited in one of the preceding claims,

wherein the floor of the depressions is formed by the substrate.

5. The electrical circuit as recited in claim 4,

wherein the side walls of the depressions are formed partially by the substrate.

6. The electrical circuit as recited in one of the preceding claims,

wherein the substrate is a circuit board or a ceramic board.

7. The electrical circuit as recited in one of the preceding claims,

wherein the conductor layer includes a copper layer, a nickel layer, and a gold layer, the copper layer being applied to the substrate, the nickel layer to the copper layer, and the gold layer to the copper layer.

8. A substrate having at least one conductor layer for attaching at least one electrical component,

wherein the conductor layer has depressions to provide a flow barrier for a bonding material which is used to attach the component, the depressions surrounding an area for attaching the component and being positioned at a distance from each other in such a way that the component has room between them, without the depressions having to be covered by the component.

9. The substrate as recited in claim 8,

wherein the depressions are designed in particular in the form of round holes or in the form of trenches.

10. The substrate as recited in claim 8 or 9,

wherein the floor of the depressions is formed by the substrate.

11. The substrate as recited in claim 8, 9 or 10,

wherein the side walls of the depressions are formed partially by the substrate.

12. The substrate as recited in one of claims 8 through 11,

wherein the conductor layer includes a copper layer, a nickel layer, and a gold layer, the copper layer being applied to the substrate, the nickel layer to the copper layer, and the gold layer to the copper layer.