Circuit board with via through surface mount device contact
First Claim
Patent Images
1. A circuit board comprising:
- a first layer and a second layer;
a substrate between the first layer and the second layer;
a first surface mount device pad on the first layer of the substrate; and
a first via, the first via being formed partially or wholly through the first surface mount device pad, the first via passing through the substrate between the first layer and the second layer.
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Abstract
According to the invention, an embodiment of a circuit board includes a substrate having a first layer and a second layer; a surface mount device pad on the first layer of the substrate; and a via, the via being formed wholly or partially through the surface mount device contact and passing through the substrate between the first layer and the second layer.
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Citations
30 Claims
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1. A circuit board comprising:
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a first layer and a second layer;
a substrate between the first layer and the second layer;
a first surface mount device pad on the first layer of the substrate; and
a first via, the first via being formed partially or wholly through the first surface mount device pad, the first via passing through the substrate between the first layer and the second layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A circuit board comprising:
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a first layer and a second layer, the first layer including a first pad for installation of an electronic component to the first layer; and
a first via in the first pad, the first via passing partially or wholly through the first pad and passing through the circuit board between the first layer and the second layer. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method comprising:
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creating a first surface mount device contact as a part of a first layer of a circuit board; and
forming a first via through the first surface mount device contact, the first via electrically connecting the first surface mount device contact to a second layer of the circuit board. - View Dependent Claims (16, 17, 18, 19, 20)
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21. A circuit board produced by a process comprising:
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creating a first surface mount device contact as a part of a first layer on a surface of a substrate; and
forming a first via through the first surface mount device contact, the first via electrically connecting the first surface mount device contact to a second layer. - View Dependent Claims (22, 23, 24, 25, 26)
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27. A contact for a surface mount device comprising:
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a coupling to a printed circuit board, the printed circuit board including at least a first layer and a second layer, the contact being a part of the first layer;
a first via passing through the contact, the via electrically connecting the contact to the second layer; and
a coupling to a lead of a surface mount device. - View Dependent Claims (28, 29, 30)
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Specification