Light-receiving module

• US 20030183894A1
• Filed: 02/26/2003
• Published: 10/02/2003
• Est. Priority Date: 02/27/2002
• Status: Active Grant

• Current Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Original Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Inventors: Ito, Makoto, Sekiguchi, Takeshi, Tanaka, Motoyoshi, Kohmoto, Kenichiro
• Granted Patent: US 6,900,512 B2
• Time in Patent Office: Days
• US Class Current: 257/435
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/30111 matching
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

This invention relates to a light-receiving module in which transmission impedance of lead terminals are matched by simple method. The module has a semiconductor light-receiving device, such as a photo diode, a plurality of lead terminals for transmitting an electrical signal converted by the semiconductor device, and a metal base with a plurality of through holes, the lead terminals passes therethrough. The diameter of the lead terminal for signal transmission is smaller as compared with that of other lead terminal and the diameter of the through holes is adjusted and filled by a sealant glass with a dielectric constant so as to match the impedance thereof

Claims

1. An light-receiving module comprising:

a semiconductor light-receiving device for converting an optical signal to an electrical signal;

a first lead terminal for outputting the electrical signal converted by the semiconductor light-receiving device;

a second lead terminal for providing an power supply to the semiconductor light-receiving device; and

a metal body for installing the semiconductor light-receiving device, the metal body having a plurality of through holes having an inner surface for passing the first lead terminal and the second lead terminal,

wherein the light-receiving module is sealed by filling up a sealant only in an opening between the first lead terminal and the inner surface of the through hole and between the second terminal and the inner surface of the through hole.

2. The light-receiving module according to claim 1, wherein the first lead terminal has a first diameter and the second lead terminal has a second diameter greater than the first diameter.

3. The light-receiving module according to claim 2, further includes a cylindrical member on the metal base, a portion of the first lead frame protruding from the base being surrounded with the cylindrical member.

4. The light-receiving module according to claim 2, wherein the first lead terminal has a tip portion protruding from the base, the tip portion having a diameter greater than the first diameter.

5. The light-receiving module according to claim 1, wherein the first lead terminal is impedance matching at the through hole through which the first lead terminal passes.

6. A light-receiving assembly comprising:

a light-receiving module for converting an optical signal to an electrical signal, comprises;

a semiconductor light-receiving device for converting an optical signal to an electrical signal;

a first lead terminal for outputting the electrical signal converted by the semiconductor light-receiving device;

a second lead terminal for providing an power supply to the semiconductor light-receiving device; and

a metal body for mounting the semiconductor light-receiving device thereon, the metal body providing a plurality of through holes having an inner surface for passing the first lead terminal and the second lead terminal, the light-receiving module is sealed by filling up a sealant only in an opening between the first lead terminal and the inner surface of the through hole and between the second terminal and the inner surface of the through hole, and

a substrate having a transmission line for transmitting the electrical signal on a first surface and a power supply line for supplying an electrical power to the light-receiving module on a second surface opposing to the first surface,

wherein the first lead terminal is connected to the transmission line on the substrate such that the first lead terminal is straitened and the second lead terminal is connected to the power supply line, and

wherein the substrate is sandwiched by the first lead terminal and the second lead terminal.

7. The light-receiving assembly according to claim 6, wherein the second lead terminal is connected to the substrate such that the second lead terminal is bent.

8. The light-receiving assembly according to claim 6, further comprising a third lead terminal fixed nearly to the center of the body, at leas a portion of the third lead terminal being connected to the second surface of the substrate such that at least of a portion of the third lead terminal is buried within the substrate.