Optoelectronic component and method for the production thereof

• US 20030185526A1
• Filed: 01/16/2003
• Published: 10/02/2003
• Est. Priority Date: 05/12/2000
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: OSRAM GmbH (Ams-Osram AG)
• Inventors: Höhn, Klaus, Sorg, J?ouml;rg
• Granted Patent: US 7,455,461 B2
• Time in Patent Office: Days
• US Class Current: 385/93
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

To secure an optical lens over an optoelectronic transmitter or receiver, it is proposed to use a UV-initiated or photoinitiated, cationically curing epoxy resin, by means of which the bonded joint can be set and thereby fixed in a few seconds. Also proposed, for use as adhesives, are resin compositions that can be applied as liquids, are optically matched, and are optimized for durable, reliable use in optoelectronic components and for the large-scale manufacture thereof.

Claims

1. An optoelectronic component

comprising a support body on which an optoelectronic transmitter or receiver is arranged,

comprising a transparent layer placed over and encapsulating said transmitter or receiver,

comprising an optical element arranged over said transparent layer,

characterized in that

said optical element is bonded to said transparent layer by means of an adhesive layer composed of a single-component resin.

2. The component as recited in claim 1,

wherein said adhesive layer is a UV-initiated or photoinitiated, cationically cured epoxy resin.

3. The component as recited in claim 1 or 2,

wherein said adhesive layer has a glass transition temperature of more than 100°

C.

4. The component as recited in any of claims 1 to 3,

comprising an adhesive layer that is optically matched to said transparent layer.

5. The component as recited in any of claims 1 to 4,

wherein said transparent layer and said optical element are made of glass, of polyacrylate, of polyurethane, or of epoxy resin molding compound.

6. The component as recited in any of claims 1 to 5,

wherein said optical element has a defined roughness or waviness on its joint surface.

7. The component as recited in any of claims 1 to 6,

wherein a keying is realized on the joint side of said optical component.

8. The component as recited in claim 7,

wherein said keying is realized by means of indentations or projections, particularly in the form of nub- or lug-like structures formed on said optical element.

9. The component as recited in claims 1 to 8,

wherein spacing elements are arranged between said optical element and said transparent layer and are preferably formed on said optical element.

10. A method for the precision-fit bonding of transparent parts of optoelectronic components, comprising the steps of:

applying a thin resin layer of a cationically initiated, curable epoxy resin to one surface of one of the transparent parts to be bonded,

placing and orienting a further transparent part on said resin layer,

exposing the assembly to UV or visible radiation in order to set said resin layer,

curing said resin layer completely.

11. The method as recited in claim 10,

wherein the complete cure of said resin layer is performed at elevated temperature.

12. The method as recited in claim 10 or 11,

wherein the exposure to UV radiation is effected for less than 5 s at an irradiance of less than 100 mW/cm².

13. The method as recited in claim 12,

wherein said exposure to UV radiation is effected by means of a UV flash and curing is performed at temperatures above 120°

C.

14. The method as recited in any of claims 10 to 13,

wherein an epoxy resin comprising a diglycidyl ether of bisphenol A as its chief constituent and a cation-releasing photoinitiator is used for the resin layer.

15. The method as recited in claim 14,

wherein an epoxy resin is used that includes the following constituents, stated in weight-percent:

80 to 99% bi- and multifunctional epoxy resins

0 to 10% monofunctional epoxy resin

0-19% vinyl ether

0-10% aliphatic or cycloaliphatic alcohol

0-5% bonding agent

0.1-5% photoinitiator for cationically initiated curing.

16. The use of a cationically initiated, curable epoxy resin having a diglycidyl ether of bisphenol A as its chief constituent for the positionally precise bonding of transparent parts of optoelectronic components to additional optical elements such as mirrors or lenses.

17. The use as recited in claim 16 for reliably bonding the following combinations of materials constituting parts to be joined:

plastic/plastic, plastic/glass, glass/glass.

18. The use as recited in claim 17 for the functionally reliable bonding of SMD-capable optoelectronic components for the automotive industry.