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Installation for processing a semiconductor wafer and method for operating the installation

  • US 20030187537A1
  • Filed: 03/27/2003
  • Published: 10/02/2003
  • Est. Priority Date: 03/27/2002
  • Status: Active Grant
First Claim
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1. An installation for processing a semiconductor wafer, comprising:

  • a device for processing the semiconductor wafer, said device having at least one loading device for supplying the semiconductor wafer;

    said loading device having;

    interface elements for coupling to a container adapted to transport the semiconductor wafer; and

    an identification device storing an identity code representing said loading device and being fitted to said loading device; and

    a mobile unit interacting with said identification device, said mobile unit registering said identity code and digitally storing and making available said identity code for further use.

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