Package for optical semiconductor

• US 20030189213A1
• Filed: 04/03/2003
• Published: 10/09/2003
• Est. Priority Date: 04/05/2002
• Status: Active Grant

• Current Assignee: Canon Ayutthaya Limited (Canon Inc.)
• Original Assignee: Canon Ayutthaya Limited (Canon Inc.)
• Inventors: Igaki, Masahiko, Atsuta, Akio, Ogura, Makoto, Kosaka, Tadashi
• Granted Patent: US 7,026,654 B2
• Time in Patent Office: Days
• US Class Current: 257/81
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H01L 31/167 the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers

Abstract

To provide a package for an optical semiconductor having a light-emitting device and a light-receiving device in one package, in which a groove is provided between the light-emitting device and the light-receiving device to thereby avoid rays of light from the light-emitting device to directly enter the light-receiving device.

Claims

1. A package for an optical semiconductor comprising:

a wiring board on which a light-emitting device and a light-receiving device are mounted; and

a surrounding member layer made of a resin material having a light transmittance property so as to cover outer surfaces of the light-emitting device and the light-receiving device,

wherein a groove is provided for the surrounding member layer between the light-emitting device and the light-receiving device.

2. A package for an optical semiconductor according to claim 1,

wherein a glass substrate layer having a light transmittance property is provided on the surrounding member layer.

3. A package for an optical semiconductor according to claim 1,

wherein a material having a light-shielding property is filled into the groove.

4. A package for an optical semiconductor according to claim 2,

wherein the glass substrate layer is a light diffraction member.

5. A package for an optical semiconductor according to claim 1,

wherein a sheet member having a light-shielding property is inserted into the groove.

6. A package for an optical semiconductor according to claim 1,

wherein the light-emitting device and the light-receiving device are connected electrically on the wiring board.