Electroless deposition method

• US 20030190426A1
• Filed: 04/03/2002
• Published: 10/09/2003
• Est. Priority Date: 04/03/2002
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Dixit, Girish, Padhi, Deenesh, Gandikota, Srinivas, Yahalom, Joseph, McGuirk, Chris R., Ramanathan, Sivakami
• Application Number:
  US10/117,710
• Publication Number:
  US 20030190426A1
• Time in Patent Office: Days
• US Class Current: 427/307
• CPC Class Codes: C23C 18/1651 Two or more layers only obtained by electroless plating
• CPC Class Codes: C23C 18/1694 Sequential heat treatment
• CPC Class Codes: C23C 18/1834 Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
• CPC Class Codes: C23C 18/1844 with use of organic or inorganic compounds other than metals, first
• CPC Class Codes: C23C 18/1879 Use of metal, e.g. activation, sensitisation with noble metals
• CPC Class Codes: C23C 18/1882 Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
• CPC Class Codes: C23C 18/32 Coating with nickel, cobalt or mixtures thereof with phosphorus or boron C23C18/50 takes precedence
• CPC Class Codes: C23C 18/50 with alloys based on iron, cobalt or nickel
• CPC Class Codes: H01L 28/84 being a rough surface, e.g. using hemispherical grains

Abstract

Methods and apparatus are provided for forming a metal or metal silicide layer by an electroless deposition technique. In one aspect, a method is provided for processing a substrate including depositing an initiation layer on a substrate surface, cleaning the substrate surface, and depositing a conductive material on the initiation layer by exposing the initiation layer to an electroless solution. The method may further comprise etching the substrate surface with an acidic solution and cleaning the substrate of the acidic solution prior to depositing the initiation layer. The initiation layer may be formed by exposing the substrate surface to a noble metal electroless solution or a borane-containing solution. The conductive material may be deposited with a borane-containing reducing agent. The conductive material may be used as a passivation layer, a barrier layer, a seed layer, or for use in forming a metal silicide layer.

Claims

1. A method of processing a substrate, comprising:

polishing a substrate surface to expose a first conductive material disposed in a dielectric material;

etching the substrate surface with an acidic solution;

cleaning the substrate surface of the acidic solution;

depositing an initiation layer selectively on the first conductive material by exposing the substrate surface to a first electroless solution having a pH of about 7 or less;

cleaning the substrate surface of the first electroless solution; and

depositing a second conductive material on the initiation layer by exposing the initiation layer to a second electroless solution.

2. The method of claim 1, wherein the acidic solution comprises between about 0.2 wt. % and about 5 wt. % of hydrofluoric acid.

3. The method of claim 1, wherein the substrate surface is exposed to the acidic solution for about 300 seconds or less.

4. The method of claim 1, wherein the acidic solution has a temperature between about 15°

C. and about 60°

C.

5. The method of claim 1, wherein the etching the substrate surface comprises exposing the substrate surface to an acidic solution comprising between about 0.2 wt. % and about 5 wt. % of hydrofluoric acid for about 300 seconds or less at a temperature between about 15°

C. and about 60°

C.

6. The method of claim 15 wherein the acidic solution removes between about 10 Å

and about 50 Å

of dielectric material disposed on the substrate surface.

7. A method of processing a substrate, comprising:

polishing a substrate surface to expose copper features formed in a dielectric material;

etching the substrate surface with an acidic solution;

cleaning the substrate of the acidic solution;

depositing a noble metal selected from the group of palladium, platinum, and combinations thereof, selectively on the exposed copper features by exposing the substrate surface to an acidic electroless solution containing a noble metal salt, an inorganic acid, and having a pH between about 1 and about 3;

removing copper oxides from the exposed copper features;

cleaning the substrate surface of the acidic electroless solution; and

depositing cobalt or cobalt alloy on the noble metal by a cobalt electroless composition.

8. The method of claim 7, wherein the acidic solution comprises between about 0.2 wt. % and about 5 wt. % of hydrofluoric acid.

9. The method of claim 7, wherein the substrate surface is exposed to the acidic solution for about 300 seconds or less.

10. The method of claim 7, wherein the acidic solution has a temperature between about 15°

C. and about 60°

C.

11. The method of claim 7, wherein the etching the substrate surface comprises exposing the substrate surface to an acidic solution comprising between about 0.2 wt. % and about 5 wt. % of hydrofluoric acid for about 300 seconds or less at a temperature between about 15°

C. and about 60°

C.

12. The method of claim 11, wherein the acidic solution removes between about 10 Å

and about 50 Å

of dielectric material disposed on the substrate surface.

13. A method of processing a substrate, comprising:

polishing a substrate surface to expose a first conductive material disposed in a dielectric material;

exposing the substrate surface to an acidic solution comprising between about 0.2 wt. % and about 5 wt. % of hydrofluoric acid for about 300 seconds or less at a temperature between about 15°

C. and about 60°

C.;

cleaning the substrate of the acidic solution;

depositing an initiation layer selectively on the first conductive material by exposing the substrate surface to a first electroless solution having a pH of about 7 or less;

removing copper oxides from the exposed copper features;

cleaning the substrate surface of the acidic electroless solution; and

depositing cobalt or cobalt alloy on the noble metal by a cobalt electroless composition.

14. The method of claim 13, wherein the acidic solution removes between about 10 Å

and about 50 Å

of dielectric material disposed on the substrate surface.