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Specific bonding analysis method and device therefor

  • US 20030190759A1
  • Filed: 04/02/2003
  • Published: 10/09/2003
  • Est. Priority Date: 04/05/2002
  • Status: Abandoned Application
First Claim
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1. A specific bonding analysis method comprising the steps of:

  • preparing a specific bonding analysis device comprising a sample adhering part for adding a liquid sample containing an analyte, a space forming part exerting capillary phenomenon connected with said sample adhering part and a detection part capable of detecting a signal derived from a specific bonding reaction in said space forming part;

    making said sample adhere to said sample adhering part to transfer said sample into said detection part in said space forming part by capillary phenomenon, thereby causing a specific bonding reaction;

    detecting a signal derived from the specific bonding reaction to qualify or quantify said analyte; and

    controlling liquid transportation force by capillary phenomenon in said space forming part in the downstream side from said detection part along the transferring direction of said sample.

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