Specific bonding analysis method and device therefor

• US 20030190759A1
• Filed: 04/02/2003
• Published: 10/09/2003
• Est. Priority Date: 04/05/2002
• Status: Abandoned Application

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Kawamura, Tatsurou
• Application Number:
  US10/404,563
• Publication Number:
  US 20030190759A1
• Time in Patent Office: Days
• US Class Current: 436/514
• CPC Class Codes: G01N 33/54366 Apparatus specially adapted for solid-phase testing

Abstract

A specific bonding analysis method by which sensitivity and concentration range in analysis can be freely set, and a device using this are provided. The intended analysis is optimized by using a specific bonding analysis device capable of controlling the velocity of a sample passing through a detection part and causing no remaining of unnecessary components on a detection part.

Claims

1. A specific bonding analysis method comprising the steps of:

preparing a specific bonding analysis device comprising a sample adhering part for adding a liquid sample containing an analyte, a space forming part exerting capillary phenomenon connected with said sample adhering part and a detection part capable of detecting a signal derived from a specific bonding reaction in said space forming part;

making said sample adhere to said sample adhering part to transfer said sample into said detection part in said space forming part by capillary phenomenon, thereby causing a specific bonding reaction;

detecting a signal derived from the specific bonding reaction to qualify or quantify said analyte; and

controlling liquid transportation force by capillary phenomenon in said space forming part in the downstream side from said detection part along the transferring direction of said sample.

2. The specific bonding analysis method in accordance with to claim 1, wherein a duration time of said specific bonding reaction is controlled by controlling a passing rate of said sample through said detection part.

3. The specific bonding analysis method in accordance with claim 2, wherein said passing rate of said sample through said detection part is controlled by controlling the distance and cross-sectional area of a part communicating with the outer atmosphere of said space forming part.

4. The specific bonding analysis method in accordance with claim 2, wherein said passing rate of said sample through said detection part is controlled by placing a first gas permeable member at a part communicating with the outer atmosphere of said space forming part.

5. The specific bonding analysis method in accordance with claim 4, wherein liquid transportation force by capillary phenomenon is controlled by placing a second gas permeable member having a water absorbing property exerted by capillary phenomenon at the downstream from said detection part side along the transferring direction of said sample.

6. The specific bonding analysis method in accordance with claim 1, comprising the steps of;

(A) bonding a first specific bonding substance capable of being specifically bonded to said analyte, which is labeled with a detectable labeling material, to said analyte,

(B) bonding a second specific bonding substance capable of being specifically bonded to said analyte, which is substantially immobilized on said detection part, to said analyte,

(C) measuring the strength of a signal generated in said detection part and derived from said labeling material; and

(D) qualifying or quantifying said analyte in said sample based on said strength measured in said step (C).

7. The specific bonding analysis method in accordance with claim 6, wherein after a predetermined volume of said sample is adhered to said sample adhering part, a component not bonded to said second specific bonding substance in said step (B) is transferred to the downstream side from said detection part in said space forming part along the transferring direction of said sample by capillary phenomenon.

8. The specific bonding analysis method in accordance with claim 6, wherein in said step (C), said first specific bonding substance and said second specific bonding substance are bonded via said analyte.

9. The specific bonding analysis method in accordance with claim 1, wherein said first specific bonding substance is held on a contact surface of said space forming part in contact with said sample between said sample adhering part and said detection part, and said first specific bonding substance is mobilized in the wet condition with said adhered sample on said contact surface and transferred to said detection part.

10. The specific bonding analysis method in accordance with claim 1, wherein said signal is coloring, fluorescence or luminescence.

11. The specific bonding analysis method in accordance with claim 1, wherein at least one of said first specific bonding substance and said second specific bonding substance is an antibody.

12. The specific bonding analysis method in accordance with claim 6, wherein said labeling material is a particle containing metal sol, dye sol or fluorescent substance or a colored latex particle.

13. A specific bonding analysis device comprising:

a sample adhering part for adding a liquid sample containing an analyte;

a space forming part exerting capillary phenomenon connected with said sample adhering part;

a detection part capable of detecting a signal derived from a specific bonding reaction in said space forming part; and

a means for controlling liquid transportation force by capillary phenomenon exerted in said space forming part in the downstream side from said detection part along the transferring direction of said sample,

whereby said sample is transferred to said detection part in said space forming part by capillary phenomenon to cause a specific bonding reaction and a signal derived from the specific bonding reaction is detected to qualify or quantify said analyte.

14. The specific bonding analysis device in accordance with claim 13, comprising a first gas permeable member placed at a part communicating with the outer atmosphere of said space forming part.

15. The specific bonding analysis device in accordance with claim 13, said means is a second gas permeable member having a water absorbing property exerted by capillary phenomenon and placed at the downstream side from said detection part along the transferring direction of said sample.

16. The specific bonding analysis device in accordance with claim 13, wherein said first specific bonding substance is held on a contact surface of said space forming part in contact with said sample between said sample adding part and said detection part, and said first specific bonding substance is mobilized in the wet condition with said adhered sample on said contact surface and transferred to said detection part.

17. The specific bonding analysis device in accordance with claim 13, wherein said space forming part is constituted of two flat plates and a spacer regulating the interval of said flat plates, said detection part is provided on said flat plate, and a signal derived from said specific bonding reaction is detected via said flat plate.