Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's undergo, such as additional repairs
First Claim
1. A manufacturing process for a memory device having a substantially unique identification code using data for manufacturing processes for a plurality of memory devices to select manufacturing processes for each of the memory devices, the process comprising:
- storing data using a substantially unique identification code of each of said memory devices for identifying manufacturing processes for the memory devices, the storing data including storing data for identifying repairs performed on each of said memory devices and for identifying spare rows and columns available to effect repairs in each of said memory devices;
automatically reading the substantially unique identification code of each said memory devices;
accessing the data stored in association with the substantially unique identification code of each of said memory devices;
selecting manufacturing processes for each of said memory devices using the accessed data; and
assembling acceptable memory devices of said memory devices into packaged memory devices.
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Accused Products
Abstract
An inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on IC'"'"'s at probe to determine whether any further repairs will be conducted later in the manufacturing process includes storing the data in association with a fuse ID of each of the IC'"'"'s. The ID codes of the IC'"'"'s are automatically read, for example, at an opens/shorts test during the manufacturing process. The data stored in association with the ID codes of the IC'"'"'s is then accessed, and additional repair procedures the IC'"'"'s may undergo are selected in accordance with the accessed data. Thus, for example, the accessed data may indicate that an IC is unrepairable, so the IC can proceed directly to a scrap bin without having to be queried to determine whether it is repairable, as is necessary in traditional IC manufacturing processes.
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Citations
20 Claims
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1. A manufacturing process for a memory device having a substantially unique identification code using data for manufacturing processes for a plurality of memory devices to select manufacturing processes for each of the memory devices, the process comprising:
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storing data using a substantially unique identification code of each of said memory devices for identifying manufacturing processes for the memory devices, the storing data including storing data for identifying repairs performed on each of said memory devices and for identifying spare rows and columns available to effect repairs in each of said memory devices;
automatically reading the substantially unique identification code of each said memory devices;
accessing the data stored in association with the substantially unique identification code of each of said memory devices;
selecting manufacturing processes for each of said memory devices using the accessed data; and
assembling acceptable memory devices of said memory devices into packaged memory devices. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A manufacturing process for integrated circuit devices from semiconductor wafers comprising:
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fabricating a plurality of devices on each semiconductor wafer of the plurality of semiconductor wafers;
storing in each device of the devices on each semiconductor wafer of the plurality of semiconductor wafers a substantially unique identification code;
storing data using the substantially unique identification code of each device of the devices for identifying manufacturing procedures for the devices;
separating each of the devices on each semiconductor wafer of the plurality of semiconductor wafers for forming one die of a plurality of dice;
assembling each die of the plurality of dice into a semiconductor device, the assembling including;
picking each die of the plurality of dice from its semiconductor wafer;
placing each die of the plurality of dice onto an epoxy-coated bonding site of one lead frame of a plurality of lead frames;
curing the epoxy on the bonding site of each lead frame of the plurality of lead frames;
connecting each die of the plurality of dice to an associated member;
encapsulating each die of the plurality of dice and its associated member for forming one package of a plurality of packages;
automatically reading the substantially unique identification code associated with each semiconductor device package of the plurality of semiconductor devices packages; and
accessing the data stored using the substantially unique identification code associated with each semiconductor device package of the plurality of semiconductor device packages. - View Dependent Claims (13, 14, 15, 16, 19, 20)
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17. A method of manufacturing Multi-Chip Modules from semiconductor wafers comprising:
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fabricating a plurality of semiconductor devices on each semiconductor wafer of a plurality of semiconductor wafers, each semiconductor device comprising a Dynamic Random Access Memory;
storing in each of the semiconductor devices on each semiconductor wafer of the plurality of semiconductor wafers a substantially unique identification code;
storing data in association with the substantially unique identification code of each semiconductor device of the plurality of semiconductor devices for identifying manufacturing procedures for the plurality of semiconductor devices, the storing data including storing data for identifying repairs performed on each semiconductor device and for identifying spare rows and columns available to effect repairs in each semiconductor device;
separating each semiconductor device of the plurality of semiconductor devices on each semiconductor wafer of the plurality of semiconductor wafers from its semiconductor wafer for forming one semiconductor device of the plurality of semiconductor devices;
assembling at least two semiconductor devices into each Multi-Chip-Module of a plurality of Multi-Chip-Modules;
automatically reading the substantially unique identification code of each semiconductor device of the semiconductor devices in each Multi-Chip-Module of the plurality of Multi-Chip-Modules; and
accessing the data stored using the substantially unique identification code of each semiconductor device of the plurality of semiconductor devices in each Multi-Chip-Module of the plurality of Multi-Chip-Modules. - View Dependent Claims (18)
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Specification