Platinum electrode and method for manufacturing the same

• US 20030192784A1
• Filed: 08/23/2002
• Published: 10/16/2003
• Est. Priority Date: 04/11/2002
• Status: Active Grant

• Current Assignee: Cortigent Incorporated
• Original Assignee: Second Sight Enterprises Incorporated
• Inventors: Zhou, Dao Min
• Granted Patent: US 6,974,533 B2
• Time in Patent Office: Days
• US Class Current: 205/109
• CPC Class Codes: A61N 1/0543 Retinal electrodes
• CPC Class Codes: C25D 3/50 of platinum group metals
• CPC Class Codes: Y10S 428/935 Electroplating
• CPC Class Codes: Y10T 428/12875 Platinum group metal-base component
• CPC Class Codes: Y10T 428/12993 Surface feature [e.g., rough, mirror]

Abstract

An improved electrode and method for manufacturing the improved electrode wherein the electrode having a fractal surface coating of platinum [which the present inventor refers to as “platinum gray”] with a increase in surface area of at least 5 times when compared to shiny platinum of the same geometry and also having improved resistance to physical stress when compared to platinum black having the same surface area. The process of electroplating the surface coating of platinum gray comprising plating at a moderate rate, i.e., at a rate that is faster than the rate necessary to produce shiny platinum and that is less than the rate necessary to produce platinum black.

Claims

1. An electrode comprising:

an electrode body; and

a surface coating of platinum having a fractal configuration.

2. The electrode of claim 1 wherein said surface coating has at least 5 times the surface area of that for the corresponding surface area resulting from the basic geometric shape of the electrode.

3. The electrode of claim 1 wherein said surface coating is biocompatible.

4. The electrode of claim 3 wherein said surface coating does not contain lead.

5. The electrode of claim 3 wherein said surface coating consists essentially of pure platinum.

6. The electrode of claim 2 wherein said surface coating has a surface area of less than 500 times the corresponding surface area resulting from the basic geometric shape.

7. The electrode of claim 2 wherein said surface coating has a surface area of less than 200 times the corresponding surface are resulting from the basic geometric shape.

8. The electrode of claim 7 wherein said surface coating has a thickness of at least 10 microns.

9. The electrode of claim 1 wherein said surface coating has an adhesive strength as measured by critical load greater than 35 millinewtons.

10. The electrode of claim 1 wherein said surface coating appears gray in color.

11. The electrode of claim 1 wherein said surface coating has a lightness (l*) greater than 30 on the CIELAB color scale.

12. The electrode of claim 1 wherein said surface coating has a color density (D) greater than 0.25D but less than 1.3D.

13. A method for electroplating a platinum surface coating such that surface has a rough surface coating comprising:

electroplating the surface of a conductive substrate at a rate such that the particles of platinum form on the conductive substrate faster than necessary to form shiny platinum and slower than necessary to form platinum black.

14. The method of claim 13, wherein at least a portion of said rough surface coating has a fractal geometry.

15. The method of claim 13, wherein said step of electroplating is accomplished at a rate of more than 0.05 microns per minute, but less than 1 micron per minute.

16. The method of claim 13, wherein said step of electroplating is accomplished at a rate of greater or equal to 1 microns per minute, but less than 10 microns per minute.

17. The method of claim 13 wherein the electroplating process is controlled by electrode voltage.

18. The method of claim 17 wherein said voltage is constant voltage.

19. The method of claim 17 wherein the controlled voltage causes at least a partially diffusion-limited plating reaction.

20. The method of claim 13 wherein the voltage of the electroplating process is less than 0.2 Volts and greater than −

1 Volts vs. Ag/AgCl Reference electrode.

21. The method of claim 13 wherein the electroplating solution is at least 3 mM but less than 30 mM ammonium hexachloroplatinate in about 0.4 M disodium hydrogen phosphate.

22. An electrode with a rough surface coating of platinum wherein:

the surface coating is electroplated to the surface of a conductive substrate at a rate such that the particles of platinum form on the conductive substrate faster than necessary to form shiny platinum and slower than necessary to form platinum black.

23. The method of claim 22, wherein at least a portion of said rough surface coating has a fractal geometry.

24. The electrode of claim 22 wherein the electroplating process is controlled by electrode voltage.

25. The electrode of claim 24 wherein the voltage is constant voltage.

26. The method of claim 24 wherein the controlled voltage causes at least a partially diffusion-limited plating reaction.

27. The electrode of claim 24 wherein the voltage of the electroplating process is less than 0.2 Volts and greater than −

1 Volts.

28. The electrode of claim 24 wherein the voltage of the electroplating process is less than −

0.25 Volts and greater than −

1 Volts.

29. The electrode of claim 22 wherein the electroplating solution is at least 3 mM but less than 30 mM ammonium hexachloroplatinate in about 0.4 M disodium hydrogen phosphate.

30. An implantable electrode comprising:

a conductive substrate; and

a rough surface coating having a fractal configuration with between 5 times the surface area and 500 times the surface area of that for the corresponding surface area resulting from the basic geometric shape of the electrode.

31. The implantable electrode of claim 30 wherein the rough surface coating is less than 200 times the surface area of that for the corresponding surface area resulting from the basic geometric shape of the electrode.

32. The implantable electrode of claim 30 wherein the rough surface coating is comprised of platinum.

33. The implantable electrode of claim 31 wherein the rough surface coating is electroplated to the surface of a conductive substrate at a rate such that the particles of platinum form on the conductive substrate faster than necessary to form shiny platinum and slower than necessary to form platinum black.

34. The implantable electrode of claim 33 wherein said rough surface coating has an adhesive strength as measured by a critical load of greater than 35 millinewtons.

35. The implantable electrode of claim 33 wherein said rough surface coating appears gray in color.

36. The electrode of claim 33 wherein said rough surface coating has a lightness (l*) greater than 30 on the CIELAB color scale.

37. The electrode of claim 33 wherein said rough surface coating has a color density (D) greater than 0.25D but less than 1.3D.

38. The electrode of claim 33 wherein said rough surface coating having a thickness of at least 10 microns.