Close packing LED assembly with versatile interconnect architecture

• US 20030193789A1
• Filed: 04/16/2002
• Published: 10/16/2003
• Est. Priority Date: 04/16/2002
• Status: Active Grant

• Current Assignee: Gelcore (General Electric Company)
• Original Assignee: Gelcore (General Electric Company)
• Inventors: Karlicek, Robert F. Jr.
• Granted Patent: US 6,851,831 B2
• Time in Patent Office: Days
• US Class Current: 361/760
• CPC Class Codes: F21S 2/005 of modular construction
• CPC Class Codes: F21S 4/10 with light sources attached to loose electric cables, e.g. Christmas tree lights
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21Y 2113/13 comprising an assembly of point-like light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01R 12/52 connecting to other rigid printed circuits or like structures
• CPC Class Codes: H01R 29/00 Coupling parts for selective co-operation with a counterpart in different ways to establish different circuits, e.g. for voltage selection, for series-parallel selection, programmable connectors
• CPC Class Codes: H05K 1/142 Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A modular mounting assembly (10) for connecting a plurality of LED'"'"'s in a selectable electrical and spatial arrangement includes a plurality of substrates (12) each having at least one LED (14a, 14b) fixedly arranged thereon, and a plurality of connectors (16) arranged thereon that are in operative communication with the at least one LED (14a, 14b) fixedly arranged thereon. The plurality of substrates (12) are arranged in a selected spatial arrangement having selected pairs of connectors (16) in operative communication with each other to effectuate electrical connection therebetween, whereby an electrical arrangement of the plurality of LED'"'"'s is effectuated. A plurality of interconnecting elements (50A, 50D, 50S, 50P) electrically and structurally interconnect selected spatially adjacent substrates (12) in cooperation with the selected pairs of connectors. A connector (16) has a plurality of electrical conductor members (1, 2, 3, 4, 5), and an interconnecting element (50) has a selected electrical configuration that effectuates a selected interconnection of conductor members (1, 2, 3, 4, 5).

Claims

1. A mounting structure for assembling a plurality of optoelectronic components, comprising:

a first substrate on which at least one first optoelectronic component is arranged, the first substrate being in the shape of a rhombus and having an edge connector disposed on an edge thereof; and

a second substrate on which at least one second optoelectronic component is arranged, the second substrate being in the shape of a rhombus and having an edge connector disposed on an edge thereof which operatively connects with the edge connector of the first substrate to form an arrangement of the at least one first optoelectronic component and the at least one second optoelectronic component.

2. The mounting structure as set forth in claim 1, wherein:

at least one of the first substrate and the second substrate has a rhombus shape that corresponds to a primitive unit cell of a hexagon.

3. The mounting structure as set forth in claim 1, further comprising:

an interconnecting element that connects with the edge connector of the first substrate and that connects with the edge connector of the second substrate to connect the edge connector of the first substrate with the edge connector of the second element.

4. The mounting structure as set forth in claim 3, wherein:

the first substrate further includes an electrical connection between the at least one first component and the edge connector of the first substrate;

the second substrate further includes an electrical connection between the at least one second component and the edge connector of the second substrate; and

the interconnecting element electrically connects the edge connector of the first substrate with the edge connector of the second substrate to form an electrical arrangement of the at least one first component and the at least one second component.

5. The mounting structure as set forth in claim 1, wherein the first substrate includes:

a thermally conductive layer; and

a printed circuit board into which the edge connector is formed, the printed circuit board including an electrical path connecting the at least one first optoelectronic component with the edge connector.

6. The mounting structure as set forth in claim 5, wherein:

the at least one first optoelectronic component includes at least one light emitting diode (LED); and

the first substrate includes a lens in operative communication with the at least one LED.

7. The mounting structure as set forth in claim 5, wherein:

the at least one first optoelectronic component includes a plurality of light emitting diodes (LED'"'"'s) disposed on the substrate; and

the printed circuit board includes an electrical path that electrically interconnects the LED'"'"'s disposed on the substrate.

8. The mounting structure as set forth in claim 7, wherein:

the thermally conductive layer has depressions in which the LED'"'"'s are arranged; and

the printed circuit board has holes arranged to allow the LED light emission to pass through.

9. The mounting structure as set forth in claim 1, further comprising:

a third substrate on which at least one third component is arranged, the third substrate being in the shape of a rhombus and having a first edge connector disposed on an edge thereof which operatively connects with a second edge connector of the first substrate, and having a second edge connector disposed on an edge thereof which operatively connects with a second edge connector of the second substrate, the first, second, and third rhombus-shaped substrates being arranged to form a hexagonally shaped mounting structure.

10. The mounting structure as set forth in claim 1, further comprising:

at least one terminating element that completes an electrical circuit.

11. The mounting structure as set forth in claim 1, further comprising:

at least one terminating element which supplies electrical power to the mounting structure.

12. A modular mounting assembly for connecting a plurality of light emitting diodes (LED'"'"'s) in a selectable electrical and spatial arrangement, the mounting assembly comprising:

a plurality of substrates, each substrate having;

at least one LED fixedly arranged thereon, and

a plurality of connectors arranged thereon that are in electrical communication with the at least one LED fixedly arranged thereon,

wherein the plurality of substrates are arranged in a spatial arrangement having selected pairs of connectors in electrical communication with each other providing an electrical arrangement between the plurality of LED'"'"'s.

13. The modular mounting assembly as set forth in claim 12, further comprising:

an interconnecting element that electrically and structurally interconnects selected substrates through pairs of connectors.

14. The modular mounting assembly as set forth in claim 13, wherein:

the interconnecting element cooperates with the selected substrates to form one of a series LED electrical interconnection and a parallel LED electrical interconnection.

15. The modular mounting assembly as set forth in claim 12,wherein:

at least one of the plurality of substrates has a rhombic shape.

16. An extensible LED structure comprising:

an LED supported by a rhomboidal shaped substrate; and

at least one electrical socket disposed on the rhomboidal shaped substrate and shaped to receive an electrical plug, the electrical socket providing electrical communication to the LED.

17. The extensible LED structure as set forth in claim 16, further comprising:

a discrete plug which mechanically connects the electrical socket to an electrical socket disposed on a second substrate.

18. The extensible LED structure as set forth in claim 16, further comprising:

a plug integral with the substrate, the plug mechanically connectable to an electrical socket disposed on a second substrate.

19. The extensible LED structure as set forth in claim 16, where the plug comprises electrical paths and when the plug is seated in the socket, the electrical paths place the LED in a predetermined electrical relationship with an LED on the second substrate.