Organic electronic devices with pressure sensitive adhesive layer

• US 20030197197A1
• Filed: 04/12/2002
• Published: 10/23/2003
• Est. Priority Date: 04/12/2002
• Status: Active Grant

• Current Assignee: Universal Display Corporation
• Original Assignee: Universal Display Corporation
• Inventors: Weaver, Michael Stuart, Brown, Julia J., Chwang, Anna, Silvernail, Jeffrey Alan
• Granted Patent: US 6,835,950 B2
• Time in Patent Office: Days
• US Class Current: 257/200
• CPC Class Codes: H10K 2102/311 Flexible OLED
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 59/874 including getter material or desiccant
• CPC Class Codes: Y10S 257/918 Light emitting regenerative switching device, e.g. light emitting scr arrays, circuitry

Abstract

An organic electronic device structure and a method of making the same. According to a first aspect of the invention, an organic electronic device structure is provided, which comprises: (a) a substrate layer; (b) an organic electronic region disposed over the substrate layer; (c) a pressure sensitive adhesive layer disposed over the organic electronic device; and (d) a barrier layer disposed over the adhesive layer. According to a second aspect of the present invention, an organic electronic device structure is provided, which comprises: (a) a substrate layer; (b) an organic electronic region disposed over the substrate layer; (c) a barrier layer disposed over the organic electronic region; (d) a pressure sensitive adhesive layer disposed over the substrate layer and over the barrier layer; and (e) an additional layer disposed over the adhesive layer. According to yet another aspect of the invention, a method for providing an organic electronic device structure of provided. The method comprises: (1) providing a first region comprising (a) a substrate layer and (b) an organic electronic region provided over the substrate layer; (2) providing a second region comprising at least one additional layer; and (3) adhering the first region to the second region using a pressure sensitive adhesive layer. In many preferred embodiments, the organic electronic device region is an OLED region.

Claims

1. An organic electronic device structure comprising:

a substrate, layer;

an organic electronic region disposed over the substrate layer;

a pressure sensitive adhesive layer disposed over the substrate layer and over the organic electronic region; and

a barrier layer disposed over the adhesive layer.

2. The organic electronic device structure of claim 1, wherein said organic electronic region is an OLED region.

3. The organic electronic device structure of claim 2, wherein said organic electronic device structure is a flexible OLED device structure.

4. The organic electronic device structure of claim 1, wherein said organic electronic device structure is a flexible organic electronic device structure.

5. The organic electronic device structure of claim 1, wherein said adhesive layer is a low-temperature-curable adhesive layer.

6. The organic electronic device structure of claim 2, wherein said adhesive layer is a low-temperature-curable adhesive layer.

7. The organic electronic device structure of claim 1, wherein said adhesive layer is a radiation-curable adhesive layer.

8. The organic electronic device structure of claim 2, wherein said adhesive layer is a radiation-curable adhesive layer.

9. The organic electronic device structure of claim 1, wherein said adhesive layer is an ultraviolet-radiation-curable adhesive layer.

10. The organic electronic device structure of claim 2, wherein said adhesive layer is an ultraviolet-radiation-curable adhesive layer.

11. The organic electronic device structure of claim 1, wherein said adhesive layer displays low out-gassing of harmful species.

12. The organic electronic device structure of claim 2, wherein said adhesive layer displays low out-gassing of harmful species.

13. The organic electronic device structure of claim 1, wherein said adhesive layer is in the form a continuous layer that is disposed over the entire organic electronic region.

14. The organic electronic device structure of claim 2, wherein said adhesive layer is in the form a continuous layer that is disposed over the entire OLED region.

15. The organic electronic device structure of claim 1, wherein said adhesive layer is in the form of a ring that is disposed over only a portion of the organic electronic region.

16. The organic electronic device structure of claim 2, wherein said adhesive layer is in the form of a ring that is disposed over only a portion of the OLED region.

17. The organic electronic device structure of claim 1, further comprising a getter material.

18. The organic electronic device structure of claim 17, wherein the getter material is provided in said adhesive layer.

19. The organic electronic device structure of claim 2, further comprising a getter material.

20. The organic electronic device structure of claim 19, wherein the getter material is provided in said adhesive layer.

21. The organic electronic device structure of claim 1, wherein said substrate layer is selected from a metal layer, a semiconductor layer, a glass layer, a ceramic layer, a polymer layer and a composite material layer.

22. The organic electronic device structure of claim 2, wherein said substrate layer is selected from a metal layer, a semiconductor layer, a glass layer, a ceramic layer, a polymer layer and a composite material layer.

23. The organic electronic device structure of claim 1, wherein said substrate layer is a composite material layer that comprises (a) a polymer substrate sub-layer and (b) at least two alternating pairs of high-density sub-layers and planarizing sub-layers, which high-density sub-layers may be the same or different from each other and which planarizing sub-layers may be the same or different from each other.

24. The organic electronic device structure of claim 2, wherein said substrate layer is a composite material layer that comprises (a) a polymer substrate sub-layer and (b) at least two alternating pairs of high-density sub-layers and planarizing sub-layers, which high-density sub-layers may be the same or different from each other and which planarizing sub-layers may be the same or different from each other.

25. The organic electronic device structure of claim 1, wherein the barrier layer is selected from a metal layer, a semiconductor layer, a glass layer, a ceramic layer, a polymer layer and a composite material layer.

26. The organic electronic device structure of claim 2, wherein the barrier layer is selected from a metal layer, a semiconductor layer, a glass layer, a ceramic layer, a polymer layer and a composite material layer.

27. The organic electronic device structure of claim 1, wherein the barrier layer is a composite material layer that comprises (a) a polymer substrate sub-layer and (b) at least two alternating pairs of high-density sub-layers and planarizing sub-layers, which high-density sub-layers may be the same or different from each other and which planarizing sub-layers may be the same or different from each other.

28. The organic electronic device structure of claim 2, wherein the barrier layer is a composite material layer that comprises (a) a polymer substrate sub-layer and (b) at least two alternating pairs of high-density sub-layers and planarizing sub-layers, which high-density sub-layers may be the same or different from each other and which planarizing sub-layers may be the same or different from each other.

29. The organic electronic device structure of claim 1, further comprising a protective layer between said organic electronic region and said adhesive layer.

30. The organic electronic device structure of claim 29, wherein said protective layer comprises a material selected from a silicon oxide, a silicon nitride, a silicon oxynitride, a metal oxide, an organic compound and an organometallic compound.

31. The organic electronic device structure of claim 29, wherein said protective layer comprises one or more high-density sub-layers and one or more planarizing sub-layers.

32. The organic electronic device structure of claim 2, further comprising a protective layer between said OLED region and said adhesive layer.

33. The organic electronic device structure of claim 32, wherein said protective layer comprises a material selected from a silicon oxide, a silicon nitride, a silicon oxynitride, a metal oxide, an organic compound and an organometallic compound.

85. The organic electronic device structure of claim 2, further comprising one or more spacer structures between said substrate layer and said adhesive layer, said spacer structures preventing said adhesive layer from physically damaging said OLED region.

86. The organic electronic device structure of claim 32, wherein said protective layer comprises one or more high-density sub-layers and one or more planarizing sub-layers.

34. An organic electronic device comprising:

a substrate layer;

an organic electronic region disposed over the substrate layer;

a barrier layer disposed over the organic electronic region;

a pressure sensitive adhesive layer disposed over the substrate layer and over the barrier layer; and

an additional layer disposed over the adhesive layer.

35. The organic electronic device structure of claim 34, wherein said organic electronic region is an OLED region.

36. The organic electronic device structure of claim 35, wherein said organic electronic device structure is a flexible OLED device structure.

37. The organic electronic device structure of claim 34, wherein said organic electronic device structure is a flexible organic electronic device structure.

38. The organic electronic device structure of claim 34, wherein said adhesive layer is a low-temperature-curable adhesive layer.

39. The organic electronic device structure of claim 35, wherein said adhesive layer is a low-temperature-curable adhesive layer.

40. The organic electronic device structure of claim 34, wherein said adhesive layer is a radiation-curable adhesive layer.

41. The organic electronic device structure of claim 35, wherein said adhesive layer is a radiation-curable adhesive layer.

42. The organic electronic device structure of claim 34, wherein said adhesive layer is an ultraviolet-radiation-curable adhesive layer.

43. The organic electronic device structure of claim 35, wherein said adhesive layer is an ultraviolet-radiation-curable adhesive layer.

44. The organic electronic device structure of claim 34, wherein said adhesive layer displays low out-gassing of harmful species.

45. The organic electronic device structure of claim 35, wherein said adhesive layer displays low out-gassing of harmful species.

46. The organic electronic device structure of claim 34, wherein said adhesive layer is in the form a continuous layer that is disposed over the entire barrier layer.

47. The organic electronic device structure of claim 35, wherein said adhesive layer is in the form a continuous layer that is disposed over the entire barrier layer.

48. The organic electronic device structure of claim 34, wherein said adhesive layer is in the form of a ring that is disposed over only a portion of the barrier layer.

49. The organic electronic device structure of claim 35, wherein said adhesive layer is in the form of a ring that is disposed over only a portion of the barrier layer.

50. The organic electronic device structure of claim 34, wherein said substrate layer is selected from a metal layer, a semiconductor layer, a glass layer, a ceramic layer, a polymer layer and a composite material layer.

51. The organic electronic device structure of claim 35, wherein said substrate layer is selected from a metal layer, a semiconductor layer, a glass layer, a ceramic layer, a polymer layer and a composite material layer.

52. The organic electronic device structure of claim 34, wherein said substrate layer is a composite material layer that comprises (a) a polymer substrate sub-layer and (b) at least two alternating pairs of high-density sub-layers and planarizing sub-layers, which high-density sub-layers may be the same or different from each other and which planarizing sub-layers may be the same or different from each other.

53. The organic electronic device structure of claim 35, wherein said substrate layer is a composite material layer that comprises (a) a polymer substrate sub-layer and (b) at least two alternating pairs of high-density sub-layers and planarizing sub-layers, which high-density sub-layers may be the same or different from each other and which planarizing sub-layers may be the same or different from each other.

54. The organic electronic device structure of claim 34, wherein the barrier layer is a composite barrier layer that comprises at least two alternating pairs of high-density sub-layers and planarizing sub-layers, which high-density sub-layers may be the same or different from each other and which planarizing sub-layers may be the same or different from each other.

55. The organic electronic device structure of claim 35, wherein the barrier layer is a composite barrier layer that comprises at least two alternating pairs of high-density sub-layers and planarizing sub-layers, which high-density sub-layers may be the same or different from each other and which planarizing sub-layers may be the same or different from each other.

56. The organic electronic device structure of claim 34, wherein said additional layer has barrier properties, scratch resistant properties, or both barrier and scratch resistant properties.

57. The organic electronic device structure of claim 35, wherein said additional layer has barrier properties, scratch resistant properties, or both barrier and scratch resistant properties.

58. The organic electronic device structure of claim 35, wherein the organic electronic device structure is a transparent OLED device structure or a top-emitting OLED device structure, and wherein the additional layer has one or more of barrier properties, scratch resistant properties, antireflective properties, and circular polarizing properties.

87. The organic electronic device structure of claim 34, wherein the additional layer has one or more of barrier properties, scratch resistant properties, antireflective properties, and circular polarizing properties.

59. A method for providing an organic electronic device structure comprising:

providing a first region comprising (a) a substrate layer and (b) an organic electronic region provided over said substrate layer;

providing a second region comprising at least one additional layer; and

adhering the first region to the second region using a pressure sensitive adhesive layer;

wherein said organic electronic region is provided over said substrate layer prior to contacting said first region with said adhesive layer.

60. The method of claim 59, wherein said structure is an OLED structure.

61. The method of claim 59, wherein said method is a roll-to-roll processing method.

62. The method of claim 60, wherein said method is a roll-to-roll processing method.

63. The method of claim 59, wherein said first region is adhered to said second region by a method comprising:

(a) providing an adhesive-primed region comprising (i) said adhesive layer and (ii) one of said first and second regions; and

(b) contacting said adhesive-primed region with the other of said first and second regions.

64. The method of claim 63, wherein the adhesive layer is transferred from a release liner to one of the first and second regions to form said adhesive primed region.

65. The method of claim 60, wherein said first region is adhered to said second region by a method comprising:

(a) providing an adhesive-primed region comprising (i) said adhesive layer and (ii) one of said first and second regions; and

(b) contacting said adhesive-primed region with the other of said first and second regions.

66. The method of claim 65, wherein the adhesive layer is transferred from a release liner to one of the first and second regions to form said adhesive primed region.

67. The method of claim 59, further comprising removing gas bubbles that are trapped (a) within the adhesive layer or (b) between said adhesive layer and either or both of the first and second regions.

68. The method of claim 67, wherein said bubbles are removed by one or more of (a) heat, (b) pressure and (c) vacuum.

69. The method of claim 60, further comprising removing gas bubbles that are trapped (a) within the adhesive layer or (b) between said adhesive layer and either or both of the first and second regions.

70. The method of claim 69, wherein said bubbles are removed by one or more of (a) heat, (b) pressure and (c) vacuum.

71. The method of claim 59, wherein the adhesive layer is cured without the application of high temperatures.

72. The method of claim 60, wherein the adhesive layer is cured without the application of high temperatures.

73. The method of claim 59, wherein the adhesive layer is cured using a radiation-curing step.

74. The method of claim 60, wherein the adhesive layer is cured using a radiation-curing step.

75. The method of claim 59, wherein the adhesive layer is cured using an ultra-violet-radiation-curing step.

76. The method of claim 60, wherein the adhesive layer is cured using an ultraviolet-radiation-curing step.

77. The method of claim 59, wherein the second region comprises a barrier layer.

78. The method of claim 60, wherein the second region comprises a barrier layer.

79. The method of claim 59, wherein said first region comprises a barrier layer, and wherein the organic electronic region is positioned between the substrate layer and the barrier layer.

80. The method of claim 79, wherein the second region comprises a layer having barrier properties, scratch resistant properties or both barrier and scratch resistant properties.

81. The method of claim 79, wherein the second region comprises a layer having one or more of barrier properties, scratch resistant properties, antireflective properties and circular polarizing properties.

82. The method of claim 60, wherein said first region comprises a barrier layer, and wherein the organic electronic region is positioned between the substrate layer and the barrier layer.

83. The method of claim 82, wherein the second region comprises a layer having barrier properties, scratch resistant properties or both barrier and scratch resistant properties.

84. The method of claim 82, wherein the organic electronic device structure is a transparent OLED device structure or a top-emitting OLED device structure, and wherein the second region comprises a layer having one or more of barrier properties, scratch resistant properties, antireflective properties, and circular polarizing properties.