Semiconductor package
First Claim
Patent Images
1. A semiconductor package comprising:
- a first IC device;
a second IC device; and
a substrate;
wherein the first IC device is attached to the substrate and the second IC device is attached to the first IC device;
the semiconductor package further comprising a first electrical connection between the first IC device and the substrate and a second electrical connection between the second IC device and the substrate.
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Abstract
A semiconductor package, containing two or more stacked IC devices attached to a substrate. Each of the IC devices has a plurality of electrical contact regions which are connected to the substrate by means of electrical connections.
111 Citations
14 Claims
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1. A semiconductor package comprising:
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a first IC device;
a second IC device; and
a substrate;
wherein the first IC device is attached to the substrate and the second IC device is attached to the first IC device;
the semiconductor package further comprising a first electrical connection between the first IC device and the substrate and a second electrical connection between the second IC device and the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification