Exposure apparatus, exposure method, and device manufacturing method

• US 20030197848A1
• Filed: 05/22/2003
• Published: 10/23/2003
• Est. Priority Date: 11/22/2000
• Status: Abandoned Application

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Shiraishi, Naomasa
• Application Number:
  US10/443,034
• Publication Number:
  US 20030197848A1
• Time in Patent Office: Days
• US Class Current: 355/67
• CPC Class Codes: G03F 7/70358 Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
• CPC Class Codes: G03F 7/707 Chucks, e.g. chucking or un-chucking operations or structural details
• CPC Class Codes: G03F 7/70708 being electrostatic; Electrostatically deformable vacuum chucks
• CPC Class Codes: G03F 7/70866 of mask or workpiece
• CPC Class Codes: G03F 7/70983 Optical system protection, e.g. pellicles or removable covers for protection of mask
• CPC Class Codes: G03F 9/7026 Focusing

Abstract

In an exposure apparatus, a main controller calculates the thickness of a light transmitting protective member that protects a pattern surface of a mask, based on detection signals of a first and second reflection beams of a detection beam irradiated from an irradiation system, reflected off the front and back surfaces of the protective member, and received by a photodetection system. This makes exposure that takes into account the variation in the image forming state of the image pattern depending on the calculated thickness of the protective member possible. Accordingly, exposure with high precision is possible, without the difference in thickness of the protective member protecting the pattern surface of the mask affecting the exposure. In addition, when the incident angle of the detection beam is optimized, setting a detection offset in the photodetection system, or resetting the origin will not be necessary.

Claims

1. An exposure apparatus that irradiates an energy beam on a mask and transfers a pattern formed on said mask onto a substrate, said exposure apparatus comprising:

a detection unit that detects the thickness of a light transmitting protective member protecting a pattern surface of said mask on which said pattern is formed.

2. The exposure apparatus of claim 1 wherein

said light transmitting protective member is made from a transparent plate made of a parallel plate, and

said detection unit has

an irradiation system that irradiates a detection beam with respect to said pattern surface from an oblique direction at a predetermined angle via said transparent plate,

a first photodetection unit that receives a first reflection beam and a second reflection beam reflected off a surface facing said pattern surface of said transparent plate and a surface on the opposite side of said surface, respectively, and outputs detection signals, respectively, and

a computing unit that calculates the thickness of said transparent plate based on said detection signals output from said first photodetection unit.

3. The exposure apparatus of claim 2 wherein

said detection unit further has a second photodetection unit that receives a third reflection beam reflected off said pattern surface and outputs its detection signal, and

said computing unit further calculates a position of said pattern surface in a normal direction, based on detection signals output from said first photodetection unit and detection signal output from said second photodetection unit.

4. The exposure apparatus of claim 3 wherein said computing unit includes

a first calculation unit that calculates the thickness of said transparent plate, based on detection signals output from said first photodetection unit, and

a second calculation unit that calculates a position of said pattern surface in a normal direction, based on the thickness of said transparent plate calculated by said first calculation unit and detection signal output from said second photodetection unit.

5. The exposure apparatus of claim 3 wherein

said detection unit further has a calibration unit that calibrates said second photodetection unit, based on detection signals output from said first photodetection unit.

6. The exposure apparatus of claim 5 wherein

said calibration unit calibrates said second photodetection unit by shifting an optical axis of a reflection beam reflected off said pattern surface.

7. The exposure apparatus of claim 6 wherein

said calibration unit includes a parallel plate arranged along an optical path of said reflection beam from said pattern surface to said second photodetection unit, and inclination of said parallel plate can be changed with respect to said optical axis of said reflection beam.

8. The exposure apparatus of claim 2, further comprising:

a projection optical system which is arranged so that its optical axis is made to match said normal direction, and projects said energy beam outgoing from said mask onto said substrate; and

a correction unit that corrects at least one of a positional relationship between said mask and said substrate and optical properties of said projection optical system, based on the thickness of said transparent plate calculated by said computing unit.

9. The exposure apparatus of claim 8 wherein

said irradiation system irradiates detection beams onto each of a plurality of detection points within an area on said pattern surface that corresponds to an exposure area of said projection optical system illuminated by said energy beam,

said first photodetection units are arranged in plurals, individually corresponding to each of said plurality of detection points,

said computing unit calculates a distribution of thickness of said transparent plate, based on detection signals from said plurality of first detection units, and

said correction unit adjusts an inclination of at least one of said mask and said substrate with respect to a surface perpendicular to said optical direction of said projection optical system.

10. A device manufacturing method including a lithographic process, wherein in said lithographic process exposure is performed using said exposure apparatus of claim 1.

35. The exposure apparatus of claim 1 wherein

said detection unit further detects a position of said pattern surface in a normal direction.

36. The exposure apparatus of claim 35 wherein

said light transmitting protective member is made from a transparent plate made of a parallel plate, and

said detection unit has

an irradiation system that irradiates a detection beam with respect to said pattern surface from an oblique direction at a predetermined angle via said transparent plate,

a photodetection unit that receives a reflection beam reflected off said pattern surface and outputs its detection signal, and

a computing unit that calculates a position of said pattern surface in a normal direction, based on the thickness of said protective member and detection signal output from said photodetection unit.

37. The exposure apparatus of claim 1 wherein said detection unit detects the thickness of said light transmitting protective member at a plurality of points.

38. The exposure apparatus of claim 37, further comprising:

a correction unit that corrects at least one of a positional relationship between said mask and said substrate and optical properties of said projection optical system, based on the thickness of said protective member detected by said detection unit at said plurality of points.

39. The exposure apparatus of claim 38 wherein said correction unit corrects at least one of a positional relationship between said mask and said substrate and optical properties of said projection optical system, based on an average value of the thickness of said protective member thickness detected at said plurality of points.

11. An exposure apparatus that irradiates an energy beam on a mask and transfers a pattern formed on said mask onto a substrate, said exposure apparatus comprising:

a position detection system that has

an irradiation system that irradiates a detection beam on a pattern surface of said mask on which said pattern is formed at an incident angle α

via a light transmitting transparent plate, which has a predetermined thickness and protects said pattern surface,

a photodetection unit that receives a reflection beam reflected off said pattern surface and outputs its detection signal, and

a calculation unit that calculates a position of said pattern surface in a normal direction of said pattern surface, based on an output of said photodetection unit; and

a projection optical system which optical axis is in said normal direction and projects said energy beam outgoing from said mask onto said substrate, whereby

when an outgoing angle of said detection beam entering said transparent plate is expressed as β

, a maximum angle of an incident angle of said energy beam to said transparent plate is expressed as α

′

, said maximum angle of said incident angle of said energy beam being set by a numeric aperture and a projection magnification of said projection optical system, and an outgoing angle of said energy beam entering said transparent plate is expressed as β

′

, said incident angle α

is set to satisfy a relation expressed as;

tan β

/tan α

=tan β

′

/tan α

′

.

12. The exposure apparatus of claim 11 wherein said energy beam is an F₂ laser beam having a wavelength of 157 nm, and

said incident angle α

is set within the range of 30°

to 50°

.

13. The exposure apparatus of claim 12 wherein said incident angle α

is set within the range of 35°

to 40°

.

14. The exposure apparatus of claim 12 wherein

said detection beam is a red light that belongs to the wavelength bandwidth of 600 nm to 800 nm, and

said transparent plate is made of a fluorine-doped quartz.

15. The exposure apparatus of claim 11, further comprising:

a correction unit that corrects optical properties of said projection optical system based on a thickness t of said transparent plate.

16. The exposure apparatus of claim 15, further comprising:

a detection unit that detects said thickness t.

17. A device manufacturing method including a lithographic process, wherein in said lithographic process exposure is performed using said exposure apparatus of claim 11.

18. An exposure apparatus that irradiates an energy beam on a mask and transfers a pattern formed on said mask onto a substrate, said exposure apparatus comprising:

an irradiation system that irradiates a detection beam on a pattern surface of said mask on which said pattern is formed from a direction of a predetermined angle of inclination via a light transmitting transparent plate, which has a predetermined thickness and protects said pattern surface;

a position detection unit that receives a reflection beam reflected off said pattern surface, and detects a position of said pattern surface in a normal direction, and

a calibration unit that calibrates said position detection unit, based on the thickness of said transparent plate.

19. The exposure apparatus of claim 18, further comprising:

a thickness detection unit that detects the thickness of said transparent plate, wherein

said calibration unit calibrates said position detection unit, based on detection results of said thickness detection unit.

20. A device manufacturing method including a lithographic process, wherein in said lithographic process exposure is performed using said exposure apparatus of claim 18.

40. The exposure apparatus of claim 18, further comprising:

a barcode reader that reads information on the thickness of said transparent plate stored in said mask as a barcode, and

said calibration unit calibrates said position detection unit, based on results read by said barcode reader.

41. The exposure apparatus of claim 19 wherein said calibration unit corrects a position of said pattern surface in a normal direction detected by said position detection unit.

21. An exposure method in which an energy beam exposes a substrate via a mask on which a pattern is formed to transfer an image of said pattern on said substrate, said exposure method including:

a detection process in which the thickness of a light transmitting protective member protecting a pattern surface of said mask where said pattern is formed is detected; and

a correction process in which an image forming state of said pattern is corrected, based on said thickness of said light transmitting protective member detected in said detection process.

22. The exposure method of claim 21 wherein

said light transmitting protective member is made from a transparent plate made of a parallel plate, and

said detection process includes

an irradiation process in which a detection beam is irradiated from a direction of a predetermined inclination with respect to a normal line of said pattern surface via said transparent plate

a photodetection process in which a first reflection beam and a second reflection beam reflected off a surface facing said pattern surface of said transparent plate and a surface on the opposite side of said surface facing said pattern surface are received, respectively, and

a calculation process in which said thickness of said transparent plate is calculated based on detection results of said first and second reflection beams.

23. The exposure method of claim 22 wherein

in said photodetection process,;

a third reflection beam from said pattern surface is further received, and

in said calculation process, a position of said pattern surface in said normal direction is further calculated, based on photodetection results of said first, second, and third reflection beams.

24. The exposure method of claim 23 wherein

calculating a position of said pattern surface in said normal direction includes

a first calculation process in which the thickness of said transparent plate is calculated, based on said photodetection results of said first and second reflection beams,

a second calculation process in which said position of said pattern surface in said normal direction is calculated, based on said calculated thickness of said transparent plate and photodetection result of said third reflection beam.

25. A device manufacturing method including a lithographic process, wherein in said lithographic process exposure is performed using said exposure method of claim 21.

26. An exposure method in which an energy beam is irradiated on a mask, and a pattern formed on said mask is transferred onto a substrate via a projection optical system, said exposure method including:

a process of irradiating a detection beam on a pattern surface of said mask on which said pattern is formed at an incident angle α

via a light transmitting transparent plate, which has a predetermined thickness and protects said pattern surface; and

a process of calculating a position of said pattern surface in an optical axis direction of said projection optical system, which is a normal direction of said pattern surface, when a reflection beam reflected off said pattern surface is received, based on its results, whereby

when an outgoing angle of said detection beam entering said transparent plate is expressed as β

, a maximum angle of an incident angle of said energy beam to said transparent plate is expressed as α

′

, said maximum angle of said incident angle of said energy beam being set by a numeric aperture and a projection magnification of said projection optical system, and an outgoing angle of said energy beam entering said transparent plate is expressed as β

′

, said incident angle α

is set to satisfy a relation expressed as;

tan β

/tan α

=tan β

′

/tan α

′

.

27. A device manufacturing method including a lithographic process, wherein in said lithographic process exposure is performed using said exposure method of claim 26.

28. An exposure method in which an energy beam having a wavelength of 157 nm is irradiated on a mask, and a pattern formed on said mask is transferred onto a substrate via a projection optical system, said exposure method including:

a process of irradiating a detection beam on a pattern surface of said mask on which said pattern is formed in an incident angle range of 30°

to 50°

; and

a process of calculating a position of said pattern surface in an optical axis direction of said projection optical system when a reflection beam of said detection beam reflected off said pattern surface is received, based on its results.

29. The exposure method of claim 28 wherein

said incident angle is an angle in the range of 35°

to 40°

.

30. A device manufacturing method including a lithographic process, wherein in said lithographic process exposure is performed using said exposure method of claim 28.

31. An exposure method in which an energy beam is irradiated on a mask, and a pattern formed on said mask is transferred onto a substrate, said exposure method including:

an irradiation process in which a detection beam is irradiated on a pattern surface of said mask on which said pattern is formed from a direction of a predetermined angle of inclination via a light transmitting transparent plate, which has a predetermined thickness and protects said pattern surface; and

a position detection/correction process in which a position of said pattern surface in a normal direction is detected when a reflection beam reflected off said pattern surface is received and said position of said pattern surface in said normal direction is corrected, based on the thickness of said transparent plate.

32. The exposure method of claim 31, further including:

a detection process detecting the thickness of said transparent plate, and

in said position detection/correction process, correcting said position of said pattern surface in said normal direction is performed, based on the thickness of said transparent plate detected in said detection process.

33. The exposure method of claim 31 wherein in said position detection/correction process, said position of said pattern surface in said normal direction is detected using a position detection unit, and said position detection unit is calibrated to correct said position, based on the thickness of said transparent plate.

34. A device manufacturing method including a lithographic process, wherein in said lithographic process exposure is performed using said exposure method of claim 31.