Method of manufacturing semiconductor device capable of sensing dynamic quantity
First Claim
1. A method of manufacturing a semiconductor device having a semiconductor substrate in which an insulation layer is layered on a first semiconductor layer and a second semiconductor layer is layered on the insulation layer, and a movable section formed in the second semiconductor layer and displaceable in response to a dynamic quantity to be applied, the method comprising the steps of:
- preparing the semiconductor substrate;
forming a trench to demarcate the movable section within the prepared semiconductor substrate so that the trench reaches the insulation layer form a surface of the second semiconductor layer; and
forming the movable section by performing dry etching on the trench-formed semiconductor substrate, during which the dry etching the insulation layer located at a bottom of the trench is charged to force etching ions of the dry etching to impinge onto part of the second semiconductor layer located laterally to the bottom of the trench, thus the laterally located part of the second semiconductor layer being removed, wherein electric charges caused due to the charging of the insulation layer during the movable-section forming step are removed from at least one of the movable section, a region, which faces the movable section, of the second semiconductor layer, and a region, which faces the movable section, of the insulation layer.
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Abstract
A method of manufacturing a semiconductor device is provided. The device is manufactured with use of an SOI (Silicon On Insulator) substrate having a first silicon layer, an oxide layer, and a second silicon layer laminated in this order. After forming a trench reaching the oxide layer from the second silicon layer, dry etching is performed, thus allowing the oxide layer located at the trench bottom to be charged at first. This charging forces etching ions to impinge upon part of the second silicon layer located laterally to the trench bottom. Such part is removed, forming a movable section. For example, ions to neutralize the electric charges are administered into the trench, so that the electric charges are removed from charged movable electrodes and their charged surrounding regions. Removing the electric charges prevents the movable section to stick to its surrounding portions.
16 Citations
13 Claims
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1. A method of manufacturing a semiconductor device having a semiconductor substrate in which an insulation layer is layered on a first semiconductor layer and a second semiconductor layer is layered on the insulation layer, and a movable section formed in the second semiconductor layer and displaceable in response to a dynamic quantity to be applied, the method comprising the steps of:
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preparing the semiconductor substrate;
forming a trench to demarcate the movable section within the prepared semiconductor substrate so that the trench reaches the insulation layer form a surface of the second semiconductor layer; and
forming the movable section by performing dry etching on the trench-formed semiconductor substrate, during which the dry etching the insulation layer located at a bottom of the trench is charged to force etching ions of the dry etching to impinge onto part of the second semiconductor layer located laterally to the bottom of the trench, thus the laterally located part of the second semiconductor layer being removed, wherein electric charges caused due to the charging of the insulation layer during the movable-section forming step are removed from at least one of the movable section, a region, which faces the movable section, of the second semiconductor layer, and a region, which faces the movable section, of the insulation layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of manufacturing a semiconductor device having a semiconductor substrate in which an insulation layer is layered on a first semiconductor layer and a second semiconductor layer is layered on the insulation layer, and a movable section formed in the second semiconductor layer and displaceable in response to a dynamic quantity to be applied, the method comprising the steps of:
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preparing the semiconductor substrate;
forming a trench to demarcate the movable section within the prepared semiconductor substrate so that the trench reaches the insulation layer form a surface of the second semiconductor layer;
forming the movable section by performing dry etching on the trench-formed semiconductor substrate, during which the dry etching the insulation layer located at a bottom of the trench is charged to force etching ions of the dry etching to impinge onto part of the second semiconductor layer located laterally to the bottom of the trench, thus the laterally located part of the second semiconductor layer being removed; and
cleaning a region, which faces the insulation layer, of the movable section. - View Dependent Claims (9)
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10. A method of manufacturing a semiconductor device having a semiconductor substrate in which an insulation layer is layered on a first semiconductor layer and a second semiconductor layer is layered on the insulation layer, and a movable section formed in the second semiconductor layer and displaceable in response to a dynamic quantity to be applied, the method comprising the steps of:
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preparing the semiconductor substrate;
forming a trench to demarcate the movable section within the prepared semiconductor substrate so that the trench reaches the insulation layer form a surface of the second semiconductor layer;
forming the movable section by performing dry etching on the trench-formed semiconductor substrate, during which the dry etching the insulation layer located at a bottom of the trench is charged to force etching ions of the dry etching to impinge onto part of the second semiconductor layer located laterally to the bottom of the trench, thus the laterally located part of the second semiconductor layer being removed; and
roughing at least one of facing surfaces of both the movable section and the insulation layer, the facing surfaces are opposed to each other between the movable section and the insulation layer face. - View Dependent Claims (11, 12)
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13. A semiconductor device manufactured by the manufacturing method according to claim.
Specification