Barrier coatings and methods of making same

• US 20030203210A1
• Filed: 04/30/2002
• Published: 10/30/2003
• Est. Priority Date: 04/30/2002
• Status: Abandoned Application

• Current Assignee: Vitex Systems, Inc.
• Original Assignee: Vitex Systems, Inc.
• Inventors: Pagano, John Chris, Rutherford, Nicole, Bennett, Wendy D., Zumhoff, Mac R., Hall, Michael Gene, Gross, Mark Edward, Martin, Peter Maclyn, Graff, Gordon Lee, Mast, Eric Sidney
• Application Number:
  US10/135,272
• Publication Number:
  US 20030203210A1
• Time in Patent Office: Days
• US Class Current: 428/412
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 59/8731 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 77/111 Flexible substrates
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 428/31507 Of polycarbonate

Abstract

A multi-layer barrier coating on a flexible substrate exhibits improved resistance to gas and liquid permeation. The multi-layer barrier coating generally comprises alternating polymer and inorganic layers, and the layer immediately adjacent to the flexible substrate and the topmost isolation layer may both be inorganic layers. The surface of each deposited inorganic layers may be plasma-treated prior to the deposition of the polymer layer thereon, while the surfaces of the polymer layers are generally not plasma-treated. The multi-layer barrier coating is lightweight, preferably transparent, and has improved flexibility and resiliency, as well as resistance to cracking and delaminating

Claims

1. A multi-layer environmental barrier coating, comprising:

a flexible substrate;

a foundation stack, comprising;

a foundation barrier layer comprising at least one ply of a first inorganic material deposited over the flexible substrate, and

an organic layer comprising at least one ply of an organic material deposited over the foundation barrier layer,

at least one barrier stack deposited over the foundation stack, the barrier stack comprising;

a barrier-stack barrier layer comprising at least one ply of a second inorganic material, and

an organic layer comprising at least one ply of an organic material deposited over the barrier-stack barrier layer; and

a topmost isolation layer comprising a third inorganic material deposited over the barrier stack, wherein at least one of the inorganic plies is plasma-treated.

2. The coating of claim 1 wherein the barrier-stack barrier layer further comprises at least one ply of a plasma-treated fourth inorganic material.

3. The coating of claim 1 wherein the flexible substrate is selected from the group consisting of polynorbornene, polyamide, polyethersulfone, polyimide, polyetherimide, polycarbonate, polyethelene naphthalate, polyester, and nylon.

4. The coating of claim 1 wherein the flexible substrate is substantially transparent.

5. The coating of claim 1 wherein the flexible substrate is plasma-treated.

6. The coating of claim 5 wherein the flexible substrate comprises a polyester film.

7. The coating of claim 6 wherein at least one side of the flexible substrate includes a functional coating selected from the group consisting of an adhesion-enhancing coating, scratch-resistant coating, anti-fingerprint coating, anti-static coating, slip control coating, anti-reflective coating, viewing angle control coating, and conductive coating.

8. The coating on claim 1 wherein the foundation organic layer and the barrier-stack organic layer are not plasma-treated.

9. The coating of claim 8 wherein the foundation organic layer and the barrier-stack organic layer comprise an unsaturated organic material capable of polymerization.

10. The coating of claim 9 wherein the foundation organic layer and the barrier-stack organic layer comprise polymerization products of at least one monomer.

11. The coating of claim 10 wherein at least one of the organic layers comprises a cross-linked acrylate layer.

12. The coating of claim 8 wherein the foundation organic layer and the barrier-stack organic layer are both selected from the group consisting of low-molecular-weight addition-type polymers, natural oils, silicones, and condensation polymers.

13. The coating of claim 9 wherein the foundation organic layer has a thickness ranging from 0.25 to 0.75 micrometer.

14. The coating of claim 13 wherein the foundation organic layer has a thickness of about 0.5 micrometer.

15. The coating of claim 9 wherein the barrier-stack organic layer has a thickness ranging from 0.15 to 0.35 micrometer.

16. The coating of claim 15 wherein the barrier-stack organic layer has a thickness of about 0.25 micrometer.

17. The coating of claim 1 wherein at least one barrier layer is substantially transparent.

18. The coating of claim 1 wherein at least one organic layer is substantially transparent

19. The coating of claim 1 wherein each of the inorganic materials are selected from the group consisting of metal oxides, metal nitrides, metal carbides, metal oxynitrides, metal oxyborides, and combinations thereof.

20. The coating of claim 1 wherein each of the inorganic materials comprise a metal oxide selected from the group consisting of:

silicon oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, zirconium oxide, niobium oxide, and combinations thereof.

21. The coating of claim 1 wherein the first inorganic material, the second inorganic material and the third inorganic material are the same inorganic material

22. The coating of claim 19 wherein the first inorganic material, the second inorganic material and the third inorganic material comprise aluminum oxide.

23. The coating of claim 1 wherein the first inorganic material, the second inorganic material and the third inorganic material are deposited by thermal evaporation, electron beam evaporation, sputtering, reactive sputtering, chemical vapor deposition, plasma enhanced chemical vapor deposition, or electron cyclotron resonance source plasma enhanced chemical vapor deposition.

24. The coating of claim 1 wherein the first inorganic material, the second inorganic material and the third inorganic material are deposited by reactive sputtering.

25. The coating of claim 1 wherein each of the barrier layers has a thickness in the range from 50 to 500 Å

.

26. The coating of claim 25 wherein each of the barrier layers has a thickness of about 300 Å

.

27. The coating of claim 26 wherein the barrier-stack barrier layer comprises three plies of second inorganic material, each ply of second inorganic material having a thickness of about 100 Å

.

28. The coating of claim 25 wherein the foundation barrier layer has a thickness of about 100 Å

.

29. The coating of claim 1 wherein the topmost isolation layer has a thickness in the range from 50 to 400 Å

.

30. The coating of claim 29 wherein the topmost isolation layer has a thickness of about 100 Å

.

31. A multi-layer environmental barrier coating, comprising:

a flexible substrate;

a foundation barrier layer comprising at least one ply of a first inorganic material deposited over the flexible substrate; and

at least two barrier stacks deposited over the foundation barrier layer, each barrier stack comprising, in sequence;

an organic layer comprising at least one ply of an organic material; and

thereover, a barrier-stack barrier layer comprising at least one ply of a second inorganic material.

32. The coating of claim 31 wherein the first inorganic material and the second inorganic material is the same inorganic material.

33. The coating of claim 31 wherein the flexible substrate, the foundation barrier layer, and the at least two barrier stacks deposited over the foundation barrier layer are substantially transparent.

34. A method of manufacturing a multi-layer environmental barrier coating, the method comprising the steps of:

(a) providing a flexible substrate;

(b) depositing a foundation stack over the flexible substrate, comprising the steps of;

(i) depositing a foundation barrier layer comprising at least one ply of a first inorganic material over the flexible substrate,

(ii) depositing over the foundation barrier layer a foundation organic layer comprising at least one ply of an organic material, and

(iii) polymerizing the foundation organic layer;

(c) depositing at least one barrier stack over the foundation stack, comprising the steps of;

(i) depositing a barrier-stack barrier layer,

(ii) depositing a barrier-stack organic layer over the barrier-stack barrier layer, and

(iii) polymerizing the barrier-stack organic layer; and

(d) depositing over the at least one barrier stack a topmost isolation layer, the topmost isolation layer comprising at least one ply of a third inorganic material.

35. The method of claim 34 further comprising, prior to step (b), the step of plasma treating the flexible substrate.

36. The method of claim 34 wherein step (b) further comprises plasma-treating the foundation barrier layer prior to depositing over the foundation barrier layer a foundation organic layer.

37. The method of claim 34 wherein the step of depositing a barrier-stack barrier layer comprises depositing over the foundation stack a first ply of a second inorganic material and plasma treating the first ply.

38. The method of claim 34 wherein the step of depositing a barrier-stack barrier layer further comprises depositing over the first ply a second ply of a fourth inorganic material and plasma treating the second ply.

39. The method of claim 38 wherein the second inorganic material and the fourth inorganic material is the same inorganic material.

40. The method of claim 34 wherein each of the barrier layers and the topmost isolation layer are deposited using thermal evaporation, electron beam evaporation, sputtering, reactive sputtering, chemical vapor deposition, plasma enhanced chemical vapor deposition, or electron cyclotron resonance source plasma enhanced chemical vapor deposition.

41. The method of claim 34 wherein each of the barrier layers and the topmost isolation layer are deposited using reactive sputtering.

42. The method of claim 34 wherein the organic layer is polymerized using ultraviolet curing.

43. A method of fabricating a multi-layer environmental barrier coating on a flexible web substrate, the method comprising the steps of:

(a) providing first and second bi-directional rollers for handling the flexible web substrate, a travel path extending between the rollers;

(b) providing, in series along the travel path, a sequence of process stations comprising (i) a first surface treater,

(ii) at least one first inorganic deposition system,

(iii) a second surface treater,

(iv) a first curing system,

(v) a monomer deposition system,

(vi) a second curing system,

(vii) a third surface treater,

(viii) at least one second inorganic deposition system, and

(ix) a fourth surface treater;

(c) operating the rollers to alternately draw the flexible web substrate across the travel path in opposite directions; and

(d) operating the process stations to apply a series of organic and inorganic plies on the flexible web substrate, the applied plies being arranged as a series of adjacent organic and inorganic layers each comprising at least one ply.

44. The method of claim 43 wherein a first applied layer is an inorganic layer.

45. The method of claim 44 wherein a final applied layer is an inorganic layer.

46. The method of claim 43 wherein all steps occur within a single vacuum chamber under vacuum conditions.

47. The method of claim 43 wherein a surface treater operates on each inorganic ply following deposition thereof and before deposition of an organic ply thereover.

48. The method of claim 43 wherein the step of operating the process stations causes sequential deposition of an inorganic layer, a organic layer, and another inorganic layer during a first travel of the flexible web substrate between the rollers, followed by successive depositions of an organic layer followed by an inorganic layer during subsequent travels of the flexible web substrate between the rollers.

49. The method of claim 48 wherein the step of operating the process stations comprises:

(a) during a forward travel of the flexible web substrate from the first roller to the second roller, sequentially activating the at least one first inorganic deposition system, the second surface treater, the monomer deposition system, the second curing system, the at least one second inorganic deposition system, and the fourth surface treater so as to sequentially deposit an inorganic layer, an organic layer, and another inorganic layer;

(b) during a reverse travel of the flexible web substrate from the second roller to the first roller, sequentially activating at least one of the third and fourth surface treaters, the monomer deposition system, the first curing system, the at least one first inorganic deposition system, and the first surface treater so as to apply a organic layer followed by an inorganic layer;

(c) during a forward travel of the flexible web substrate from the first roller to the second roller, sequentially activating at least one of the first and second surface treaters, the monomer deposition system, the second curing system, the at least one second inorganic deposition system, and the fourth surface treater so as to apply a organic layer followed by an inorganic layer; and

(d) repeating steps (b) and (c) at least once.

50. The method of claim 49 wherein the step of operating the process stations further comprises activating the first surface treater prior to activating the at least one first inorganic deposition system during a forward travel of the flexible web substrate from the first roller to the second roller.

51. The method of claim 43 wherein each of the surface treaters is a plasma source.

52. The method of claim 43 wherein each of the curing systems is an ultraviolet radiation generator.

53. The method of claim 43 wherein the at least one first inorganic deposition system and the at least one second inorganic deposition system each comprise a sequential series of inorganic deposition systems that themselves each apply an inorganic ply.

54. The method of claim 43 wherein the flexible substrate is selected from the group consisting of polynorbornene, polyamide, polyethersulfone, polyimide, polyetherimide, polycarbonate, polyethelene naphthalate, polyester, and nylon.