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Method for manufacturing a dynamic quantity detection device

  • US 20030203528A1
  • Filed: 04/21/2003
  • Published: 10/30/2003
  • Est. Priority Date: 04/24/2002
  • Status: Active Grant
First Claim
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1. A method for manufacturing a dynamic quantity detection device that is formed by bonding a semiconductor chip that includes a detection element for detecting a dynamic quantity to a stand using a bonding layer, the method comprising:

  • forming a semiconductor chip that includes a detection element used for correlating a dynamic quantity to be detected to an electric quantity and a plurality of processing circuit elements used for making up a circuit that processes the electric quantity;

    placing a bonding layer on a stand;

    placing the semiconductor chip on the bonding layer;

    bonding the semiconductor chip to the stand by sintering the bonding layer; and

    annealing the semiconductor chip in an atmosphere that contains hydrogen in order to cure a change in a characteristic of one of the processing circuit elements, wherein the change is caused during the bonding the semiconductor chip.

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