Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same
First Claim
1. A method of fabricating a substrate, comprising:
- providing at least one substrate having contact pads exposed at a surface thereof; and
disposing at least one collar comprising a plurality of at least partially superimposed, contiguous, mutually adhered layers around at least one contact pad of said contact pads.
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Accused Products
Abstract
Dielectric collars to be disposed around contact pads on a surface of a semiconductor device or another substrate and methods of fabricating and disposing the collars on semiconductor devices and other substrates are disclosed. Semiconductor devices including the collars and having contact pads exposed through the collars are also disclosed. One or more of the collars are disposed around the contact pads of a semiconductor device or other substrate before or after conductive structures are secured to the contact pads. Upon connecting the semiconductor device face down to a higher level substrate and establishing electrical communication between contact pads of the semiconductor device and contacts pads of the substrate, the collars prevent the material of conductive structures protruding from the semiconductor device from contacting regions of the surface of the semiconductor device that surround the contact pads thereof. The collars may be preformed structures which are attached to a surface of a semiconductor device or other substrate. Alternatively, the collars can be fabricated on the surface of the semiconductor device or other substrate. A stereolithographic method of fabricating the collars is disclosed. The stereolithographic method may include use of a machine vision system including at least one camera operably associated with a computer controlling a stereolithographic application of material so that the system may recognize the position and orientation of a semiconductor device or other substrate on which the collar is to be fabricated.
73 Citations
49 Claims
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1. A method of fabricating a substrate, comprising:
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providing at least one substrate having contact pads exposed at a surface thereof; and
disposing at least one collar comprising a plurality of at least partially superimposed, contiguous, mutually adhered layers around at least one contact pad of said contact pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method of fabricating a semiconductor device component, comprising:
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providing at least one substrate with contact pads exposed at a surface thereof; and
sequentially forming layers of at least one collar on said surface around at least one contact pad of said contact pads, said at least one collar protruding from said surface. - View Dependent Claims (20, 21, 22, 23)
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24. A method of fabricating a semiconductor device component, comprising:
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placing at least one substrate with contact pads in a horizontal plane;
recognizing a location and orientation of said at least one substrate; and
stereolithographically fabricating at least one collar comprising at least one layer of at least semisolid material on a surface of said at least one substrate, said at least one collar laterally surrounding at least one contact pad of said contact pads. - View Dependent Claims (25, 26, 27, 28, 29, 30)
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31. A method of connecting a semiconductor device to a carrier substrate, comprising:
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providing a semiconductor device having contact pads exposed at a surface thereof;
selecting a carrier substrate having contact pads on a surface thereof, said contact pads being located correspondingly to at least selected ones of said contact pads of said semiconductor device;
securing at least one collar to said surface of said semiconductor device around at least one contact pad of said contact pads, said at least one collar including a plurality of at least partially superimposed, contiguous, mutually adhered layers;
securing at least one conductive structure to said at least one contact pad; and
disposing said semiconductor device face down on said carrier substrate with said at least one contact pad in communication with a corresponding one of said contact pads of said carrier substrate. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39)
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40. A method for fabricating a substrate, comprising:
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providing at least one substrate having contact pads exposed at a surface thereof; and
placing at least one preformed collar around at least one contact pad of said contact pads. - View Dependent Claims (41, 42, 43, 44, 45, 46, 47, 48, 49)
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Specification