Solventless photo-sensitive thermosetting-type ink

• US 20030203994A1
• Filed: 04/26/2002
• Published: 10/30/2003
• Est. Priority Date: 04/26/2002
• Status: Abandoned Application

• Current Assignee: TeamChem Company
• Original Assignee: TeamChem Company
• Inventors: Chen, Michael, Yeh, Todd
• Application Number:
  US10/132,183
• Publication Number:
  US 20030203994A1
• Time in Patent Office: Days
• US Class Current: 523/466
• CPC Class Codes: C08G 59/1461 Unsaturated monoacids
• CPC Class Codes: C08G 59/1494 followed by a further chemical treatment thereof
• CPC Class Codes: C08G 59/4292 together with monocarboxylic acids
• CPC Class Codes: G03F 7/038 Macromolecular compounds which are rendered insoluble or differentially wettable G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021
• CPC Class Codes: H05K 3/287 Photosensitive compositions

Abstract

The present invention relates to a solventless photo-sensitive thermosetting type of material, a method for manufacturing the same, and its use; wherein said solventless photo-sensitive thermosetting type of material mainly comprises an aqueous alkaline-developable photo-sensitive resin, unsaturated monomer(s), epoxy resin(s), photo initiator(s), and is manufactured through a ring-opening condensation reaction as an initiation step, which is characterized in that a photo-sensitive monomer containing an unsaturated bond is used to replace organic solvent(s) regularly used in conventional solder mask products.

Claims

1. A method for producing a solventless photo-sensitive thermosetting-type ink, which comprises the following steps:

synthesizing step;

Using an epoxy resin as a base to perform a ring-opening condensation reaction with an unsaturated acid, adding suitable unsaturated monomer(s) into the mixture for dilution;

wherein said epoxy resin at least includes;

Bisphenol-A epoxy resin, Bisphenol-F epoxy resin, Phenol novolac epoxy resin, Cresol novolac epoxy resin;

Allowing the reaction mixture from the synthesizing step, poly-anhydride(s), and suitable monomer(s) to perform reactions;

mixing and milling step;

Adding the photo-sensitive resin obtained from the intermediate step with suitable photo initiator(s), curing agent(s), inorganic filler(s), pigment(s), de-foamer, and rheological agent(s).

2. The method according to claim 1, wherein said monomer at least includes:

polyethylene glycol diacrylate, diacrylate, trimethylopropane triacrylate, triethylene glycol diacrylate, tripropylene glycol diacrylate and other unsaturated photo-sensitive monomers.

3. The method according to claim 1, wherein said epoxy resin thermal curing agent at least includes:

Bisphenol-A epoxy resin, Bisphenol-F epoxy resin, Phenol novolac epoxy resin, Cresol novolac epoxy resin, or insoluble or slightly soluble powder epoxy resins and other hetero-ring type epoxy resins, wherein the amount of the epoxy resin is determined according to the actual need and can be based on 100 parts for calculating the ratio of other components.

4. The method according to claim 1, wherein said unsaturated acid at least includes:

acrylic acid, methacrylic acid, crotonic acid and other double-bond unsaturated acids.

5. The method according to claim 1, wherein said polyanhydride at least includes:

tetrahydrophthalic anhydride, maleic anhydride, succinic anhydride, phthalic anhydride and other polyanhydride.

6. The method according to claim 1, wherein the photo initiator at least includes:

2-methyl-1-(└

4-(methylthio)phenyl┐

-2-morpholinopropanone), 2-isopropylthioxanthone and other photo initiators.

7. The method according to claim 1, wherein said inorganic filler is optionally added with silicon dioxide, barium sulfate, quartz powder, mica powder, etc. for adjusting the physical properties, such as dielectric properties, acid resistance, and rheological properties, etc., of the ink.

8. The method according to claim 1, wherein said organic agents for assisting the processing properties required by via filling are optionally added and include:

de-foamer(s), Theological agent(s), and other diluents, etc.

9. The method according to claim 1, wherein said initiation step takes 24-96 hrs at 80-110°

C., and said intermediate step takes 6-24 hrs at 80-110°

C.

10. A method of using a solventless photo-sensitive thermosetting type of material, which comprises using said material as solder mask, and using a projection-type UV exposure and an aqueous alkali developing step to eliminate the pre-baking process, so as to simplify the production process and improve the yield.