Alignment and orientation features for a semiconductor package

• US 20030205795A1
• Filed: 05/16/2003
• Published: 11/06/2003
• Est. Priority Date: 01/21/2000
• Status: Active Grant

• Current Assignee: Leonard E. Mess, Stuart L. Roberts, William J. Reeder
• Original Assignee: Leonard E. Mess, Stuart L. Roberts, William J. Reeder
• Inventors: Roberts, Stuart L., Mess, Leonard E., Reeder, William J.
• Granted Patent: US 6,869,869 B2
• Time in Patent Office: Days
• US Class Current: 257/678
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19043 being a resistor

Abstract

A semiconductor device formed by an automated wire bonding system. The semiconductor device comprises a lead frame having a plurality of lead fingers and a die paddle, and a semiconductor die mounted to the die paddle. The die paddle comprises a plurality of eyepoint features that extend from the die. The die comprises a first plurality of bonding pads and the lead fingers comprise a second plurality of bonding pads. The first and second bonding pads are interconnected by a plurality of connecting wires which are installed by the automated wire bonding system. The wire bonding system obtains an image of the lead frame and identifies the eyepoint features of the die paddle within the image so as to more accurately determine the positions of the second wire bonding pads of the lead frame with respect to the wire bonding system

Claims

1. A method of electrically connecting a first plurality of bonding pads of a semiconductor die to a second plurality of bonding pads located on lead fingers of a lead frame of a semiconductor device, the method comprising:

obtaining an image of the lead frame;

identifying the location of at least one eyepoint feature formed on a die paddle of the lead frame adapted to receive the semiconductor die;

determining the relative locations of the second plurality of bonding pads from the identified location of the eyepoint feature located on the die paddle of the lead frame;

directing a wire bonding device to form wire bonds between the first and second pluralities of bonding pads using the determined relative locations of the second plurality of bonding pads.

2. The method of claim 1, further comprising first determining the positions of the second plurality of bonding pads with respect to the eyepoint features.

3. The method of claim 2, wherein obtaining an image of the lead frame comprises:

requesting a digitized image from a digital imaging device;

retrieving the digitized image from the imaging device; and

storing the digitized image.

4. The method of claim 3, wherein identifying the location of the at least one eyepoint feature comprises identifying the location of a first and second eyepoint feature.

5. The method of claim 3, wherein identifying the location of the at least one eyepoint feature comprises:

using an edge detection algorithm to locate a plurality of edges of the at least one eyepoint feature within the stored digitized image.

using the located edges to compute the positions of the at least one eyepoint feature with respect to an origin.

6. The method of claim 5, wherein determining the relative location of the second plurality of bonding pads from the identified location of the at least one eyepoint feature located on the die paddle of the lead frame comprises:

using the computed position of the at least one eyepoint feature to compute an average position of the at least one eyepoint feature with respect to the origin;

using at least one of the located edges of the at least one eyepoint features to compute an orientation of the at least one eyepoint feature with respect to the orientation of the image; and

using the computed average position and orientation of the at least one eyepoint feature to compute the positions of the second plurality of bonding pads with respect to the origin.

7. The method of claim 6, wherein using the computed average position and orientation of the at least one eyepoint feature to compute the positions of the second plurality of bonding pads with respect to the origin comprises using the computed average position and orientation of the at least one eyepoint feature with respect to the origin in conjunction with the positions of the second plurality of bonding pads with respect to at least one eyepoint feature.

8. The method of claim 1, wherein directing a wire bonding device to form wire bonds between the first and second pluralities of bonding pads comprises:

disposing a first end of at least one wire adjacent a corresponding first bonding pad of the first plurality of bonding pads;

bonding the first end of the at least one wire to the corresponding first bonding pad;

disposing a second end of the at least one wire adjacent a corresponding second bonding pad of the second plurality of bonding pads; and

bonding the second end of the at least on wire to the corresponding second bonding pad.