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Silicon mirrors having reduced hinge stress from temperature variations

  • US 20030206356A1
  • Filed: 05/03/2002
  • Published: 11/06/2003
  • Est. Priority Date: 05/03/2002
  • Status: Active Grant
First Claim
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1. A torsional hinge apparatus having minimal hinge stress due to temperature variations comprising:

  • a support substrate having a first coefficient of expansion;

    an integral torsional hinge device formed from a material having a different coefficient of expansion, and having an inside portion attached to a support portion along an axis by at least one pair of torsional hinges; and

    an anchor for attaching said support portion of said integral torsional hinge device to said support substrate at a single location to allow substantially unrestricted expansion and retraction along two dimensions of said integral torsional hinge device.

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