Printed circuit board assembly and method therefor

• US 20030206404A1
• Filed: 04/28/2003
• Published: 11/06/2003
• Est. Priority Date: 11/04/1998
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Ruff, Charles C.
• Granted Patent: US 6,831,840 B2
• Time in Patent Office: Days
• US Class Current: 361/759
• CPC Class Codes: H05K 7/1405 by clips or resilient members, e.g. hooks

Abstract

A bracket assembly includes a bracket which readily and easily couples with a printed circuit board. The bracket includes at least one tab assembly foldably attached with a support flange for supporting the printed circuit board. The bracket also includes an outer flange which is coupled with the computer chassis. Alignment apertures on the support flange and the printed circuit board facilitate the alignment of the printed circuit board, and allow for rework of the printed circuit board. Each tab assembly is adapted to frictionally engage with corresponding features on the printed circuit board.

Claims

1. A method comprising:

placing a circuit board on a support flange of a bracket assembly, the bracket assembly including at least one assembly tab;

folding the at least one assembly tab over the circuit board toward the support flange, where the at least one assembly tab is folded from a first unfolded position to a second folded position; and

disposing at least a portion of the at least one assembly tab into a portion of the circuit board in the second folded position.

2. The method as recited in claim 1, further comprising coupling the at least one assembly tab with the support flange.

3. The method as recited in claim 2, further comprising disposing the at least one assembly tab in a portion of the support flange.

4. The method as recited in claim 1, further comprising aligning features of the circuit board with alignment features on the support flange.

5. The method as recited in claim 1, further comprising folding two or more assembly tabs over the circuit board.

6. The method as recited in claim 5, wherein the two or more assembly tabs are folded over the circuit board simultaneously.

7. The method as recited in claim 1, further comprising covering side edges of the circuit board with a shoulder portion.

8. A method for forming a bracket assembly, the method comprising:

placing a circuit board adjacent to a bracket, the bracket including a support flange, the circuit board having a planar surface and at least one side edge;

deforming at least one portion of the bracket over the at least one side edge of the circuit board; and

coupling the portion of the bracket within a portion of the circuit board.

9. The method as recited in claim 8, further comprising disposing the circuit board within a computer chassis.

10. The method as recited in claim 8, further comprising coupling the portion of the bracket with coupling features of the bracket.

11. The method as recited in claim 8, further comprising electrically grounding the circuit board to the bracket.

12. The method as recited in claim 8, wherein deforming at least one portion of the bracket includes deforming two or more portions of the bracket into the circuit board.

13. A method for forming a bracket assembly, the method comprising:

placing a circuit board directly adjacent to a bracket, the bracket including a support flange;

deforming at least a portion of the bracket over the circuit board;

coupling the at least one portion of the bracket within coupling features of the support flange.

14. The method as recited in claim 13, wherein coupling the at least one portion of the bracket includes coupling the at least one portion of the bracket within one or more apertures formed in the support flange.

15. The method as recited in claim 13, wherein coupling the at least one portion of the bracket includes coupling a slender flexible finger with the support flange.

16. The method as recited in claim 13, wherein deforming at least the portion of the bracket includes deforming the portion over a side edge of the circuit board.

17. The method as recited in claim 13, further comprising aligning features of the circuit board with alignment features on the support flange.

18. The method as recited in claim 13, further comprising folding two or more assembly tabs over the circuit board.

19. The method as recited in claim 18, wherein the two or more assembly tabs are folded over the circuit board simultaneously.

20. The method as recited in claim 13, further comprising electrically grounding the circuit board to the bracket.