Use of printing and other technology for micro-component placement
First Claim
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1. A method for adhering micro-components to a partially conductive substrate having conductive areas printed thereon, comprising:
- passing the partially conductive substrate within printing view of a first insertion tool containing an adherent;
depositing a portion of the adherent onto the conductive areas of the partially conductive substrate;
passing the partially conductive substrate having the portion of adherent thereon within printing view of a second insertion tool containing at least one micro-component; and
depositing the at least one micro-component onto the portion of adherent located on the conductive area of the partially conductive substrate.
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Abstract
An improved light-emitting panel having a plurality of micro-components sandwiched between two substrates is disclosed. Each micro-component contains a gas or gas-mixture capable of ionization when a sufficiently large voltage is supplied across the micro-component via at least two electrodes. An improved method of manufacturing a light-emitting panel is also disclosed, which uses a web fabrication process to manufacturing light-emitting displays as part of a high-speed, continuous inline process.
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Citations
29 Claims
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1. A method for adhering micro-components to a partially conductive substrate having conductive areas printed thereon, comprising:
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passing the partially conductive substrate within printing view of a first insertion tool containing an adherent;
depositing a portion of the adherent onto the conductive areas of the partially conductive substrate;
passing the partially conductive substrate having the portion of adherent thereon within printing view of a second insertion tool containing at least one micro-component; and
depositing the at least one micro-component onto the portion of adherent located on the conductive area of the partially conductive substrate. - View Dependent Claims (2, 3, 4)
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5. A method for depositing a plurality of micro-components onto predetermined portions of a substrate comprising:
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charging the predetermined portions of the substrate with a first charge;
introducing the third set of charged micro-components to the third charged portion of the substrate wherein the third set of charged micro-components is electrostatically attracted to the third charged portion of the substrate; and
applying force to the substrate in order to remove micro-components from the third set of charged micro-components that did not adhere to the third charged portion of the substrate.
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6. A method for depositing a plurality of micro-components onto predetermined portions of a substrate comprising:
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charging a first predetermined portion of the substrate with a first charge;
charging a first set of the plurality of micro-components with a second charge, wherein the first charge and the second charge are opposite charges;
introducing the first set of charged micro-components to the first charged portion of the substrate wherein the first set of charged micro-components is electrostatically attracted to the first charged portion of the substrate;
facilitating removal of micro-components from the first set of charged micro-components that did not adhere to the first charged portion of the substrate by means of a force applied to the substrate;
charging a second predetermined portion of the substrate with the first charge;
charging a second set of the plurality of micro-components with the second charge, wherein the first charge and the second charge are opposite charges;
introducing the second set of charged micro-components to the second charged portion of the substrate wherein the second set of charged micro-components is electrostatically attracted to the second charged portion of the substrate;
applying force to the substrate in order to remove micro-components from the second set of charged micro-components that did not adhere to the second charged portion of the substrate;
charging a third predetermined portion of the substrate with the first charge;
charging a third set of the plurality of micro-components with the second charge, wherein the first charge and the second charge are opposite charges;
means for charging the predetermined portions of the substrate with a second charge, wherein the first charge and the second charge are opposite;
means for introducing the multiple micro-components to the predetermined charged portions of the substrate, wherein an electrostatic force therebetween attracts the multiple micro-components to the predetermined portions of the substrate; and
means for removing any of the multiple micro-components that are not placed within the predetermined charged portions of the substrate. - View Dependent Claims (7, 8, 9, 10, 11, 12)
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13. A system for placing multiple micro-components into predetermined portions of a substrate comprising:
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means for charging the multiple micro-components with a first charge;
charging the plurality of micro-components with a second charge, wherein the first charge and the second charge are opposite charges; and
introducing the plurality of charged micro-components to the charged substrate wherein the charged micro-components are electrostatically attracted to the charged predetermined portions of the substrate. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21)
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22. A method for placing micro-components into the sockets of a substrate comprising:
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placing a first mask having first holes in predetermined locations over the substrate, wherein the first holes are positioned over a first set of sockets within the substrate;
introducing multiple micro-components for emitting a first color to the mask;
applying force to at least one of the first mask and the substrate in order to facilitate placement of the micro-components into the first set of sockets within the substrate;
placing a second mask having second holes in predetermined locations over the substrate, wherein the second holes are positioned over a second set of sockets within the substrate;
introducing multiple micro-components for emitting a second color to the mask;
applying force to at least one of the second mask and the substrate in order to facilitate placement of the micro-components into the second set of sockets within the substrate;
placing a third mask having third holes in predetermined locations over the substrate, wherein the third holes are positioned over a third set of sockets within the substrate;
introducing multiple micro-components for emitting a third color to the mask; and
applying force to at least one of the third mask and the substrate in order to facilitate placement of the micro-components into the third set of sockets within the substrate. - View Dependent Claims (23, 24)
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25. A continuous process for fabricating a plurality of light-emitting panels comprising:
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providing a first continuous line of substrate having a plurality of parallel conductors thereon;
disposing a plurality of micro-components on the plurality of parallel conductors through an electrostatic transfer process;
disposing a second substrate over the first substrate such that the plurality of micro-components are sandwiched between the first substrate and the second substrate; and
cutting the first substrate and the second substrate to form the plurality light-emitting panels. - View Dependent Claims (26, 27)
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28. A continuous process for fabricating a plurality of light-emitting panels comprising:
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providing a first continuous line of substrate having a plurality of parallel conductors thereon;
passing the substrate within printing view of a first insertion tool containing an adherent;
depositing portions of the adherent onto areas of the parallel conductors;
passing the substrate having the portions of adherent thereon within printing view of a second insertion tool containing multiple micro-components; and
depositing the multiple micro-components onto the portions of adherent located on the parallel conductors;
disposing a second substrate over the first substrate such that the plurality of micro-components are sandwiched between the first substrate and the second substrate; and
cutting the first substrate and the second substrate to form the plurality light-emitting panels.
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29. A continuous process for fabricating a plurality of light-emitting panels comprising:
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providing a first substrate in a continuous moving line having micro-components removably adhered thereto;
providing a second substrate in a continuous moving line parallel to the first substrate, wherein the first substrate and the second substrate are forcibly contacted to one another at at least one point during the continuous moving line, such that the micro-components form sockets in the second substrate and are removed from the first substrate and remain in the formed sockets.
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Specification