Use of printing and other technology for micro-component placement

• US 20030207645A1
• Filed: 08/09/2002
• Published: 11/06/2003
• Est. Priority Date: 10/27/2000
• Status: Active Grant

• Current Assignee: Leidos, Inc. (Leidos Holdings, Inc.)
• Original Assignee: Science Applications International Corporation
• Inventors: Green, Albert M., Wyeth, N. Convers, George, E. Victor
• Granted Patent: US 6,796,867 B2
• Time in Patent Office: Days
• US Class Current: 445/24
• CPC Class Codes: A61L 2/10 Ultraviolet radiation
• CPC Class Codes: A61L 9/20 Ultraviolet radiation
• CPC Class Codes: G02B 6/0033 Means for improving the coupling-out of light from the light guide
• CPC Class Codes: G02B 6/0036 2-D arrangement of prisms, protrusions, indentations or roughened surfaces
• CPC Class Codes: G02B 6/0065 Manufacturing aspects; Material aspects
• CPC Class Codes: H01J 11/18 containing a plurality of independent closed structures for containing the gas, e.g. plasma tube array [PTA] display panels
• CPC Class Codes: H01J 17/16 Vessels; Containers
• CPC Class Codes: H01J 17/49 Display panels, e.g. with crossed electrodes , e.g. making use of direct current display panels making use of alternating current H01J11/00
• CPC Class Codes: H01J 2217/49264 Vessels
• CPC Class Codes: H01J 2217/49285 Associated optical means
• CPC Class Codes: H01J 65/046 the field being produced by using capacitive means around the vessel
• CPC Class Codes: H01J 9/185 of flat panel display devices, e.g. by using spacers
• CPC Class Codes: H01J 9/241 the vessel being for a flat panel display H01J9/261 takes precedence; flat discharge lamps H01J9/248
• CPC Class Codes: H01J 9/245 specially adapted for gas discharge tubes or lamps H01J9/241, H01J9/26 take precedence
• CPC Class Codes: H01J 9/395 Filling vessels
• CPC Class Codes: H01J 9/48 with automatic transfer of workpieces between operating stations

Abstract

An improved light-emitting panel having a plurality of micro-components sandwiched between two substrates is disclosed. Each micro-component contains a gas or gas-mixture capable of ionization when a sufficiently large voltage is supplied across the micro-component via at least two electrodes. An improved method of manufacturing a light-emitting panel is also disclosed, which uses a web fabrication process to manufacturing light-emitting displays as part of a high-speed, continuous inline process.

Claims

1. A method for adhering micro-components to a partially conductive substrate having conductive areas printed thereon, comprising:

passing the partially conductive substrate within printing view of a first insertion tool containing an adherent;

depositing a portion of the adherent onto the conductive areas of the partially conductive substrate;

passing the partially conductive substrate having the portion of adherent thereon within printing view of a second insertion tool containing at least one micro-component; and

depositing the at least one micro-component onto the portion of adherent located on the conductive area of the partially conductive substrate.

2. The method according to claim 1, wherein the first and second insertion tools utilize piezoelectric actuators during the deposition of the portion of the adherent and the at least one micro-component.

3. The method according to claim 1, wherein the partially conductive substrate contains a socket therein for receiving the portion of the adherent and the at least one micro-component.

4. The method according to claim 1, wherein the at least one micro-component contains a rare gas halide.

5. A method for depositing a plurality of micro-components onto predetermined portions of a substrate comprising:

charging the predetermined portions of the substrate with a first charge;

introducing the third set of charged micro-components to the third charged portion of the substrate wherein the third set of charged micro-components is electrostatically attracted to the third charged portion of the substrate; and

applying force to the substrate in order to remove micro-components from the third set of charged micro-components that did not adhere to the third charged portion of the substrate.

6. A method for depositing a plurality of micro-components onto predetermined portions of a substrate comprising:

charging a first predetermined portion of the substrate with a first charge;

charging a first set of the plurality of micro-components with a second charge, wherein the first charge and the second charge are opposite charges;

introducing the first set of charged micro-components to the first charged portion of the substrate wherein the first set of charged micro-components is electrostatically attracted to the first charged portion of the substrate;

facilitating removal of micro-components from the first set of charged micro-components that did not adhere to the first charged portion of the substrate by means of a force applied to the substrate;

charging a second predetermined portion of the substrate with the first charge;

charging a second set of the plurality of micro-components with the second charge, wherein the first charge and the second charge are opposite charges;

introducing the second set of charged micro-components to the second charged portion of the substrate wherein the second set of charged micro-components is electrostatically attracted to the second charged portion of the substrate;

applying force to the substrate in order to remove micro-components from the second set of charged micro-components that did not adhere to the second charged portion of the substrate;

charging a third predetermined portion of the substrate with the first charge;

charging a third set of the plurality of micro-components with the second charge, wherein the first charge and the second charge are opposite charges;

means for charging the predetermined portions of the substrate with a second charge, wherein the first charge and the second charge are opposite;

means for introducing the multiple micro-components to the predetermined charged portions of the substrate, wherein an electrostatic force therebetween attracts the multiple micro-components to the predetermined portions of the substrate; and

means for removing any of the multiple micro-components that are not placed within the predetermined charged portions of the substrate.

7. The method according to claim 6, wherein the first, second, and third sets of micro-components represent each of the three primary colors.

8. The method according to claim 6, wherein the force applied is ultrasonic.

9. The method according to claim 6, wherein the first, second, and third predetermined portions of the substrate are within sockets formed in the substrate.

10. The method according to claim 6, wherein the first, second, and third predetermined portions of the substrate are proximate to a conductor.

11. The method according to claim 9, wherein each of the sockets is proximate to at least one conductor.

12. The method according to claim 6, wherein the micro-components contain a rare gas halide.

13. A system for placing multiple micro-components into predetermined portions of a substrate comprising:

means for charging the multiple micro-components with a first charge;

charging the plurality of micro-components with a second charge, wherein the first charge and the second charge are opposite charges; and

introducing the plurality of charged micro-components to the charged substrate wherein the charged micro-components are electrostatically attracted to the charged predetermined portions of the substrate.

14. The system according to claim 13, wherein the means for charging the multiple micro-components is an electron beam.

15. The system according to claim 13, wherein the means for charging the multiple micro-components is a laser.

16. The system according to claim 13, wherein the means for charging the predetermined portions of the substrate is an electron beam.

17. The system according to claim 13, wherein the means for charging the predetermined portions of the substrate is a laser.

18. The system according to claim 13, wherein the means for charging the predetermined portions of the substrate comprises a laser-charged drum containing a charge pattern, wherein the drum transfers the charge pattern to the predetermined portions of the substrate.

19. The system according to claim 13, wherein the means for introducing the multiple micro-components to the predetermined portions of the substrate is a chute.

20. The system according to claim 13, wherein the means for removing any of the multiple micro-components that are not placed within the predetermined charged portions of the substrate is a force application tool.

21. The system according to claim 13, wherein the electrostatic force attracting the multiple micro-components to the predetermined charged portions is enhanced or replaced by applying a vacuum to the predetermined charged portions.

22. A method for placing micro-components into the sockets of a substrate comprising:

placing a first mask having first holes in predetermined locations over the substrate, wherein the first holes are positioned over a first set of sockets within the substrate;

introducing multiple micro-components for emitting a first color to the mask;

applying force to at least one of the first mask and the substrate in order to facilitate placement of the micro-components into the first set of sockets within the substrate;

placing a second mask having second holes in predetermined locations over the substrate, wherein the second holes are positioned over a second set of sockets within the substrate;

introducing multiple micro-components for emitting a second color to the mask;

applying force to at least one of the second mask and the substrate in order to facilitate placement of the micro-components into the second set of sockets within the substrate;

placing a third mask having third holes in predetermined locations over the substrate, wherein the third holes are positioned over a third set of sockets within the substrate;

introducing multiple micro-components for emitting a third color to the mask; and

applying force to at least one of the third mask and the substrate in order to facilitate placement of the micro-components into the third set of sockets within the substrate.

23. The method according to claim 22, further comprising:

placing an adherent in each of the first, second, and third sets of sockets within the substrate.

24. The method according to claim 22, wherein the multiple micro-components contain a rare gas halide.

25. A continuous process for fabricating a plurality of light-emitting panels comprising:

providing a first continuous line of substrate having a plurality of parallel conductors thereon;

disposing a plurality of micro-components on the plurality of parallel conductors through an electrostatic transfer process;

disposing a second substrate over the first substrate such that the plurality of micro-components are sandwiched between the first substrate and the second substrate; and

cutting the first substrate and the second substrate to form the plurality light-emitting panels.

26. The process according to claim 25, wherein the electrostatic transfer process comprises:

charging the parallel conductors with a first charge;

charging the plurality of micro-components with a second charge, wherein the first charge and the second charge are opposite charges; and

introducing the plurality of charged micro-components to the charged parallel conductors wherein the charged micro-components are electrostatically attracted to the charged parallel conductors.

27. The process according to claim 25, wherein the electrostatic transfer process comprises:

charging a first portion of the parallel conductors with a first charge;

charging a first set of the plurality of micro-components with a second charge, wherein the first charge and the second charge are opposite charges;

introducing the first set of charged micro-components to the first charged portion of the substrate wherein the first set of charged micro-components is electrostatically attracted to the first portion of the parallel conductors;

applying force to the substrate in order to remove micro-components from the first set of charged micro-components that did not adhere to the first portion of the parallel conductors;

charging a second portion of the parallel conductors with the first charge;

charging a second set of the plurality of micro-components with the second charge, wherein the first charge and the second charge are opposite charges;

introducing the second set of charged micro-components to the second portion of the parallel conductors wherein the second set of charged micro-components is electrostatically attracted to the second portion of the parallel conductors;

applying force to the substrate in order to remove micro-components from the second set of charged micro-components that did not adhere to the second portion of the parallel conductors;

charging a third portion of the parallel conductors with the first charge;

charging a third set of the plurality of micro-components with the second charge, wherein the first charge and the second charge are opposite charges;

introducing the third set of charged micro-components to the third portion of the parallel conductors wherein the third set of charged micro-components is electrostatically attracted to the third portion of the parallel conductors; and

applying force to the substrate in order to remove micro-components from the third set of charged micro-components that did not adhere to the third portion of the parallel conductors.

28. A continuous process for fabricating a plurality of light-emitting panels comprising:

providing a first continuous line of substrate having a plurality of parallel conductors thereon;

passing the substrate within printing view of a first insertion tool containing an adherent;

depositing portions of the adherent onto areas of the parallel conductors;

passing the substrate having the portions of adherent thereon within printing view of a second insertion tool containing multiple micro-components; and

depositing the multiple micro-components onto the portions of adherent located on the parallel conductors;

disposing a second substrate over the first substrate such that the plurality of micro-components are sandwiched between the first substrate and the second substrate; and

cutting the first substrate and the second substrate to form the plurality light-emitting panels.

29. A continuous process for fabricating a plurality of light-emitting panels comprising:

providing a first substrate in a continuous moving line having micro-components removably adhered thereto;

providing a second substrate in a continuous moving line parallel to the first substrate, wherein the first substrate and the second substrate are forcibly contacted to one another at at least one point during the continuous moving line, such that the micro-components form sockets in the second substrate and are removed from the first substrate and remain in the formed sockets.