Data brokering system for integrated remote tool access, data collection, and control

• US 20030208448A1
• Filed: 03/12/2003
• Published: 11/06/2003
• Est. Priority Date: 03/12/2002
• Status: Abandoned Application

• Current Assignee: ILS Technology LLC
• Original Assignee: ILS Technology LLC
• Inventors: Barboza, Sunil, Perry, Stuart, Wussow, Wendy
• Application Number:
  US10/385,441
• Publication Number:
  US 20030208448A1
• Time in Patent Office: Days
• US Class Current: 705/64
• CPC Class Codes: G05B 19/4183 characterised by data acquisition, e.g. workpiece identification
• CPC Class Codes: G05B 2219/31471 Operator can select a graphical screen at his will as help diagnostic
• CPC Class Codes: G05B 2219/31479 Operator select part of process he wants to see, video image is displayed
• CPC Class Codes: G05B 2219/32034 Electronic market, network broker
• CPC Class Codes: G05B 2219/32142 Define device, module description using xml format file
• CPC Class Codes: G05B 2223/06 Remote monitoring
• CPC Class Codes: G06F 11/2294 by remote test
• CPC Class Codes: G06Q 20/382 insuring higher security of transaction
• CPC Class Codes: H04L 67/14 Session management for real-time applications in data packet communications networks H04L65/1066
• CPC Class Codes: H04L 67/535 Tracking the activity of the user network monitoring arrangements H04L43/00; recording of computer activity G06F11/34
• CPC Class Codes: H04L 69/329 in the application layer [OSI layer 7]
• CPC Class Codes: H04L 9/40 Network security protocols
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

A data brokering system for semiconductor wafer data is presented that comprises: a FAB having at least one automated semiconductor wafer manufacturing tool; a plurality of OEMs, coupled to the FAB via a secure service net; means for providing data about a semiconductor wafer manufactured by the tool to one of the OEMs without revealing information about the tool; and means for collecting fees based on characteristics of the provided data.

Claims

1. A data brokering system for semiconductor wafer data, comprising:

a FAB having at least one automated semiconductor wafer manufacturing tool;

a plurality of OEMS, coupled to said FAB via a secure service net;

means for providing data about a semiconductor wafer manufactured by said tool to one of said OEMs without revealing information about said tool; and

means for collecting fees based on characteristics of said provided data.

2. The system of claim 1, wherein said characteristics of provided data include a size of data, a type of data and a type of wafer.

3. The system of claim 1, wherein said means for providing data is automated by automatically feeding wafer data from a tool at a later part of the manufacturing process to a tool earlier in the manufacturing process.

4. The system of claim 1, wherein said means for collecting fees includes providing a list of available data with a charge for that data.

5. The system of claim 1, wherein said wafer data is stored in XML format.