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IC card and method of manufacturing the same

  • US 20030209362A1
  • Filed: 03/25/2003
  • Published: 11/13/2003
  • Est. Priority Date: 03/27/2002
  • Status: Active Grant
First Claim
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1. An IC card formed by laminating a plurality of substrates, comprising:

  • a sensor that identifies an authorized person;

    a signal processing circuit that processes an identification based on an output from the sensor; and

    a card-shaped card medium containing the sensor and the signal processing circuit, at least the signal processing circuit including a thin film circuit which is sufficiently thinner than the card medium and contains a material which is dissolvable equally to or more than the card medium.

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