Semiconductor component with an increased breakdown voltage in the edge area

• US 20030209757A1
• Filed: 03/28/2003
• Published: 11/13/2003
• Est. Priority Date: 03/28/2002
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Hirler, Franz, Zundel, Markus, Rieger, Walter, Krumrey, Joachim, Henninger, Ralf, Polzl, Martin
• Granted Patent: US 6,806,533 B2
• Time in Patent Office: Days
• US Class Current: 257/329
• CPC Class Codes: H01L 29/0696 of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
• CPC Class Codes: H01L 29/407 Recessed field plates, e.g. trench field plates, buried field plates
• CPC Class Codes: H01L 29/4236 within a trench, e.g. trench gate electrode, groove gate electrode
• CPC Class Codes: H01L 29/42368 the thickness being non-uniform
• CPC Class Codes: H01L 29/7811 with an edge termination structure guard regions per se H01L29/0619; field plates per se H01L29/402
• CPC Class Codes: H01L 29/7813 with trench gate electrode, e.g. UMOS transistors trench gate electrodes per se H01L29/4236

Abstract

A semiconductor component has a cell array formed in a semiconductor body with a number of identical transistor cells and at least one edge cell formed at an edge of the cell array. Each of the transistor cells has a control electrode, which is formed in a trench, and the edge cell has a field plate, which is formed in a trench, with a distance between the trench of the edge cell and the trench of the immediately adjacent transistor cell being less than the distance between a trench of a transistor cell and the trench of an immediately adjacent transistor cell in the cell array.

Claims

1. A semiconductor component, comprising:

a semiconductor body having a front face, a rear face, and trenches formed therein, said trenches disposed at a distance from one another in a horizontal direction of said semiconductor body and extend in a vertical direction of said semiconductor body; and

a cell array formed in said semiconductor body and having an edge area, a number of identically formed transistor cells, and at least one edge cell formed at said edge area of said cell array, each of said transistor cells having;

a first connection zone of a first conductivity type disposed in an area of said rear face of said semiconductor body;

a second connection zone of said first conductivity type disposed in an area of said front face of said semiconductor body;

a channel zone of a second conductivity type disposed between said first connection zone and said second connection zone;

at least one control electrode disposed in a respective one of said trenches extending in the vertical direction into said semiconductor body; and

a first insulation layer insulating said control electrode from said semiconductor body;

said edge cell including;

a field plate disposed in another one of said trenches being an edge trench extending in the vertical direction into said semiconductor body; and

a second insulation layer insulating said field plate from said semiconductor body, a first distance between said edge trench of said edge cell and said respective trench of an immediately adjacent one of said transistor cells being less than a second distance between said respective trench of said immediately adjacent one of said transistor cells and a further respective trench of a further immediately adjacent one of said transistor cells in said cell array.

2. The semiconductor component according to claim 1, further comprising connections each disposed between two of said trenches and each extending through said second connection zone into said channel zone.

3. The semiconductor component according to claim 2, wherein a respective connection disposed between said edge trench of said edge cell and said respective trench of said immediately adjacent one of said transistor cells is formed symmetrically between said edge trench and said respective trench.

4. The semiconductor component according to claim 2, wherein a respective connection between said edge trench of said edge cell and said respective trench of said immediately adjacent one of said transistors cell is disposed closer to said edge trench of said edge cell than to said further trench.

5. The semiconductor component according to claim 1, wherein said control electrode of each of said transistor cells tapers in the vertical direction underneath said channel zone, and said first insulation layer has a thickness increasing in an area underneath said channel zone.

6. The semiconductor component according to claim 1, wherein a third distance between at least two of said trenches in said cell array on a side facing away from a respectively associated transistor cell is less than the second distance between said trenches of two immediately adjacent ones of said transistor cells in said cell array.

7. The semiconductor component according to claim 6, further comprising a component having connections disposed in an area of said front face of said semiconductor body integrated between two of said trenches that are closer together.

8. The semiconductor component according to claim 7, wherein said component is a transistor selected from the group consisting of horizontal bipolar transistors and horizontal MOS transistors.

9. A semiconductor component, comprising:

a semiconductor body having a front face, a rear face, and trenches formed therein extending in a vertical direction in said semiconductor body;

a cell array formed in said semiconductor body and having a number of identically formed transistor cells, each of said transistor cells including;

a first connection zone of a first conductivity type disposed in an area of said rear face of said semiconductor body;

a second connection zone of said first conductivity type disposed in an area of said front face of said semiconductor body;

a channel zone of a second conductivity type disposed between said first connection zone and said second connection zone;

a control electrode disposed in one of said trenches; and

an insulation layer insulating said control electrode from said semiconductor body, said trenches of said transistor cells disposed at a distance from one another in a horizontal direction of said semiconductor body;

a first distance between at least two of said trenches in said cell array on a side facing away from respectively associated cell is less than a second distance between said trenches of two immediately adjacent ones of said transistor cells in said cell array; and

a component having connections disposed in an area of said front face of said semiconductor body between said two trenches being closer together.

10. The semiconductor component according to claim 9, wherein said control electrode of each of said transistor cells tapers in the vertical direction underneath said channel zone, and said insulation layer has a thickness increasing in an area underneath said channel zone.