System for evaluating probing networks

• US 20030210033A1
• Filed: 06/11/2003
• Published: 11/13/2003
• Est. Priority Date: 04/14/1995
• Status: Active Grant

• Current Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Original Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Inventors: Gleason, K. Reed, Strid, Eric W., Schappacher, Jerry B., Carlton, Dale E.
• Granted Patent: US 6,803,779 B2
• Time in Patent Office: Days
• US Class Current: 324/158.1
• CPC Class Codes: B82Y 15/00 Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
• CPC Class Codes: G01R 1/06705 Apparatus for holding or moving single probes for moving multiple probe heads or ICs under test G01R31/2886
• CPC Class Codes: G01R 1/06772 High frequency probes
• CPC Class Codes: G01R 1/073 Multiple probes
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: G01R 35/00 Testing or calibrating of apparatus covered by the other groups of this subclass
• CPC Class Codes: G01R 35/005 Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references G01R33/0035, G01R35/002 take precedence

Abstract

An interconnect assembly for evaluating a probe measurement network includes a base, respective inner and outer probing areas in mutually coplanar relationship on the upper face of the base, a reference junction, and a high-frequency transmission structure connecting the probing areas and the reference junction so that high-frequency signals can be uniformly transferred therebetween despite, for example, variable positioning of the device-probing ends of the network on the probing areas. A preferred method for evaluating the signal channels of the network includes connecting a reference unit to the reference junction and successively positioning each device-probing end that corresponds to a signal channel of interest on the inner probing area. Because the transmission structure uniformly transfers signals, the relative condition of the signals as they enter or leave each end will substantially match the condition of the signals as measured or presented by the reference unit, thereby enabling calibration of the network in reference to the device-probing ends. The assembly is particularly well-adapted for the evaluation of probe measurement networks of the type used for testing planar microelectronic devices.

Claims

1. An interconnect assembly for use in evaluating a probing-device, said probing-device having a plurality of device probing ends, the device probing ends each having a width and being separated from each other by a predetermined spacing, said interconnect assembly comprising:

(a) a base having an upper face, said face having a circular conductive pad, and said pad having a diameter substantially equal to the width of each of said probing ends;

(b) said face further including an annular dielectric area surrounding said conductive pad and coplanar therewith;

(c) said face further including an outer conductive area surrounding said annular dielectric area and substantially coplanar therewith; and

(d) said annular dielectric area having a radial width, between said conductive pad and said outer conductive area, substantially equal to said spacing between said device probing ends.

2. The assembly of claim 1 adapted for use when said probe measurement network includes at least three device-probing ends, said outer conductive area being arranged relative to said circular conductive pad such that when any one of said device-probing ends is positioned on said pad, the other ones of said device-probing ends are simultaneously positioned automatically on said outer conductive area.

3. The assembly of claim 2 wherein first and second device-probing ends can be simultaneously placed on said paid and said outer conductive area, respectively, in at least two positions on said face.

4. The assembly of claim 1 further including at least one high-frequency adapter provided adjacent said base, said adapter enabling detachable connection of a reference channel.

5. The assembly of claim 4 wherein said high-frequency adapter includes spaced-apart first and second conductors, said first and second conductors being connected to said circular conductive pad and said outer conductive area, respectively.

6. The assembly of claim 1 including a transmission line extending within said base and wherein said outer conductive area substantially prevents spurious electromagnetic radiation from entering said transmission line.

7. The assembly of claim 1 wherein said circular conductive paid is at least partially embedded in said base.

8. The assembly of claim 1 in combination with a movable member that enables said device-probing ends to be selectively positioned to respective probing positions on a conductive pad and outer conductive area.

9. The assembly of claim 8 wherein said moveable member enables lateral movement of said conductive pad and said outer conductive area with respect to said device-probing ends.