Antenna module whose antenna characteristics are not adversely affected by a mother board

• US 20030210189A1
• Filed: 05/06/2003
• Published: 11/13/2003
• Est. Priority Date: 05/13/2002
• Status: Active Grant

• Current Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Original Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Inventors: Jinushi, Satoru
• Granted Patent: US 6,882,319 B2
• Time in Patent Office: Days
• US Class Current: 343/700MS
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 9/16 with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole H01Q9/44 takes precedence
• CPC Class Codes: H01Q 9/285 Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407

Abstract

A chip-type antenna and a snaked, band-shaped conductor as a pair of radiation elements fed at the center, a circuit unit having a transmission/reception circuit that is connected to respective feeder lines for the radiation elements, and a connector that connects, to an external circuit, lead lines leading from the circuit unit are arranged on an insulative substrate to be mounted on a mother board. The pair of radiation elements extend along two adjoining sides of the insulative substrate so as to generally assume an L-shape in a plan view.

Claims

1. An antenna module comprising:

an insulative substrate to be mounted on a mother board;

a pair of radiation elements that are mounted on the insulative substrate and fed at a center of the pair of radiation elements;

a circuit unit that is mounted on the insulative substrate and has at least one of a reception circuit and a transmission circuit connected to feeder lines for the respective radiation elements; and

a connector that is mounted on the insulative substrate and connects, to an external circuit, lead lines leading from the circuit unit,

wherein at least one of the pair of radiation elements is a snaked, band-shaped conductor that is patterned in meander form on the insulative substrate.

2. The antenna module according to claim 1, wherein the pair of radiation elements are arranged so as to generally assume an L-shape in a plan view.

3. The antenna module according to claim 1, wherein one of the pair of radiation elements is the snaked, band-shaped conductor and the other is a chip-type antenna.

4. The antenna module according to claim 1, wherein the conductor radiation element and the other of the pair of radiation elements are disposed on opposite sides of the same surface of the insulative substrate.

5. The antenna module according to claim 1, wherein the antenna module is a half-wave dipole.

6. An electronic apparatus comprising an antenna module and a mother board, the antenna module including:

an insulative substrate mounted on the mother board;

a plurality of radiation elements mounted on the insulative substrate, at least one of the radiation elements being a meander conductor patterned on the insulative substrate;

a circuit unit mounted on the insulative substrate, the circuit unit having at least one of a reception circuit and a transmission circuit;

feeder lines configured to transmit signals between the circuit unit and the radiation elements, the feeder lines connected to at least a pair of the radiation elements one of which is the meander conductor at a center of the pair of the radiation elements; and

a connector mounted on the insulative substrate that connects lead lines leading from the circuit unit to circuitry external to the antenna module.

7. The electronic apparatus according to claim 6, wherein the pair of radiation elements are arranged so as to generally assume an L-shape in a plan view.

8. The electronic apparatus according to claim 6, wherein one of the pair of radiation elements is the meander conductor and the other is a conductor formed spirally on a surface of a chip-shaped dielectric member.

9. The electronic apparatus according to claim 6, wherein the pair of radiation elements are disposed on opposite sides of the same surface of the insulative substrate.

10. The electronic apparatus according to claim 6, wherein the antenna module is a half-wave dipole.

11. A method of decreasing sensitivity of antenna characteristics of an antenna module to a position of a mother board on which the antenna module is mounted, the method comprising

patterning a meander conductor as a first radiation element on a surface of an insulative substrate;

introducing at least a second radiation element to the surface of an insulative substrate;

mounting a circuit unit of at least one of a reception circuit and a transmission circuit on the surface of the insulative substrate;

connecting feeder lines between the circuit unit and the first and second radiation elements and connecting the feeder lines to the first and second radiation elements at a center of the first and second radiation elements;

providing a connector on the surface of the insulative substrate and connecting lead lines leading from the circuit unit to circuitry external to the antenna module; and

mounting the insulative substrate on the mother board.

12. The method according to claim 11, further comprising decreasing a space factor and increasing miniaturization of the antenna module by arranging the first and second radiation elements in generally an L-shape in a plan view.

13. The method according to claim 11, further comprising mounting a conductor formed spirally on a surface of a chip-shaped dielectric member on the surface of the insulative substrate as the second radiation element.

14. The method according to claim 11, further comprising impedance matching by adjusting a pitch of meander of the conductor to alter capacitance of the conductor while maintaining a length of the conductor.

15. The method according to claim 11, further comprising arranging the first and second radiation elements on opposite sides of the surface of the insulative substrate.

16. The method according to claim 11, further comprising limiting the antenna module to a half-wave dipole-type antenna module.