Multiple membrane structure and method of manufacture

• US 20030210799A1
• Filed: 05/10/2002
• Published: 11/13/2003
• Est. Priority Date: 05/10/2002
• Status: Abandoned Application

• Current Assignee: Akustica Incorporated
• Original Assignee: Akustica Incorporated
• Inventors: Xie, Huikai, Zhu, Xu, Gabriel, Kaigham J.
• Application Number:
  US10/143,280
• Publication Number:
  US 20030210799A1
• Time in Patent Office: Days
• US Class Current: 381/173
• CPC Class Codes: H04R 1/005 using digitally weighted transducing elements
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 25/00 Deaf-aid sets , i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception electrical stimulation of auditory nerves to promote the auditory function A61N1/36038; optical stimulation of auditory nerves to promote the auditory function A61N5/0622
• CPC Class Codes: H04R 3/005 for combining the signals of two or more microphones specially adapted for hearing aids H04R25/407
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182

Abstract

A direct digital microphone is constructed of a plurality of first membranes each formed by a micro-machined mesh supported by a substrate. Each of the membranes has a first and a second position. A second membrane is supported by the substrate and positioned above the plurality of first membranes to form a chamber between the plurality of first membranes and the second membrane. A pressure sensor is responsive to pressure in the chamber. Drive electronics are responsive to the pressure sensor for controlling the positions of each of the plurality of first membranes. Output electronics are responsive to the positions of the plurality of first membranes to produce a digital output signal. A stacked membrane structure and methods of fabrication and operation are also disclosed.

Claims

1. A structure carried on a substrate, comprising:

a first membrane formed of a micro-machined mesh supported by the substrate; and

a second membrane supported by the substrate and positioned above said first membrane to form a chamber therebetween

2. The structure of claim 1 wherein said first and second membranes are fabricated one above the other to form an integral structure.

3. The structure of claim 1 wherein said second membrane is mechanically connected above said first membrane to form a composite structure.

4. The structure of claim 3 wherein said second membrane is one of a fabricated membrane and a cover membrane.

5. The structure of claim 1 wherein said first membrane is comprised of a first micro-machined mesh and a first material sealing said mesh and wherein said second membrane is comprised of a second micro-machined mesh and a second material sealing said second mesh.

6. The structure of claim 5 wherein said first material and said second material are the same.

7. A structure carried on a substrate, comprising:

a first micro-machined mesh supported by the substrate;

a second micro-machined mesh supported by the substrate and positioned above said first mesh; and

a material for sealing said first and second meshes to form first and second membranes, respectively.

8. The structure of claim 7 wherein said first and second membranes are fabricated one above the other to form an integral structure.

9. The structure of claim 8 wherein the gaps of said second mesh are larger than the gaps of said first mesh.

10. The structure of claim 7 wherein said second membrane is mechanically connected above said first membrane to form a composite structure.

11. A stacked structure comprising at least two membranes, and wherein at least one of said membranes is formed of a micro-machined mesh.

12. The structure of claim 11 wherein said at least two membranes are fabricated one above the other to form an integral structure.

13. The structure of claim 11 wherein a top one of said at least two membranes is mechanically connected to said stack.

14. The structure of claim 13 wherein said top one of said at least two membranes is one of a fabricated membrane and a cover membrane.

15. The structure of claim 11 wherein said at least two membranes are comprised of a first micro-machined mesh and a first material sealing said mesh and a second micro-machined mesh and a second material sealing said second mesh.

16. The structure of claim 15 wherein said first material and said second material are the same.

17. A microphone constructed on a substrate, comprising:

a plurality of first membranes each formed by a micro-machined mesh supported by the substrate, each of said membranes having a first and a second position;

a second membrane supported by the substrate and positioned above said first membrane to form a chamber between said plurality of first membranes and said second membrane;

a pressure sensor responsive to a pressure in said chamber;

drive electronics responsive to said pressure sensor for controlling the positions of each of said plurality of first membranes; and

output electronics responsive to the positions of said plurality of first membranes.

18. The microphone of claim 17 wherein each of said plurality of first membranes is substantially identical in size.

19. The microphone of claim 17 wherein each of said plurality of first membranes is a multiple of a base sized membrane.

20. The microphone of claim 17 wherein said pressure sensor is one of a capacitive sensor and a piezoresistive sensor.

21. The microphone of claim 17 additionally comprising a heater carried by the substrate.

22. The microphone of claim 17 wherein said plurality of first membranes and said second membrane are fabricated one above the other to form an integral structure.

23. The microphone of claim 17 wherein said second membrane is mechanically connected above said plurality of first membranes to form a composite structure.

24. The microphone of claim 23 wherein said second membrane is one of a fabricated membrane and a cover membrane.

25. The microphone of claim 17 wherein each membrane of said plurality of first membranes is comprised of a first micro-machined mesh and a first material sealing said mesh and wherein said second membrane is comprised of a second micro-machined mesh and a second material sealing said second mesh.

26. The microphone of claim 25 wherein said first material and said second material are the same.

27. A microphone, comprising:

a substrate;

a plurality of first micro-machined meshes supported by said substrate;

a second micro-machined mesh supported by the substrate and positioned above said plurality of first meshes to form a chamber therebetween;

a material for sealing said plurality of first meshes to form a plurality of first membranes and for sealing said second mesh to form a second membrane, each of said plurality of first membranes having first and second positions;

a sensor responsive to said chamber;

drive electronics responsive to said sensor for controlling the positions of each of said plurality of first membranes; and

output electronics responsive to the positions of said plurality of first membranes for producing an output signal.

28. The microphone of claim 27 wherein each of said plurality of first membranes is substantially identical in size.

29. The microphone of claim 27 wherein each of said plurality of first membranes is a multiple of a base sized membrane.

30. The microphone of claim 27 wherein said sensor is one of a capacitive pressure sensor and a piezoresistive pressure sensor.

31. The microphone of claim 27 additionally comprising a heater carried by said substrate.

32. The microphone of claim 27 wherein said plurality of first membranes and said second membrane are fabricated one above the other to form an integral structure.

33. The microphone of claim 27 wherein the gaps of said second mesh are larger than the gaps of said plurality of first meshes.

34. The microphone of claim 27 wherein said second membrane is mechanically connected above said first membrane to form a composite structure.

35. A method, comprising:

fabricating a first micro-machined mesh on a substrate;

sealing said mesh to form a membrane; and

positioning a second membrane above said first membrane.

36. The method of claim 35 wherein said positioning includes mechanically attaching one of a fabricated membrane and cover membrane above said first membrane.

37. A method of fabricating stacked membranes, comprising:

stacking alternating layers of at least two different materials on a substrate, certain of said layers being patterned;

using a top layer as an etch mask to form an upper mesh;

removing said top layer to expose a new top layer;

using said new top layer to protect said upper mesh while said upper mesh is released from said substrate;

removing said new top layer;

using said upper mesh as an etch mask to form and release a lower mesh from said substrate; and

depositing a sealant for sealing said upper and lower meshes.

38. The method of claim 37 wherein said stacking includes forming alternating layers of metal and oxide, and wherein said top layer is a layer of metal.

39. The method of claim 38 wherein a first of said layers of metal is patterned to form said lower mesh, a second of said layers of metal is patterned to define a chamber, and a third of said layers of metal is patterned to form said upper mesh.

40. The method of claim 39 wherein said upper mesh has gaps of a larger size than the gaps of said lower mesh, and wherein said depositing step includes first sealing said lower mesh and then sealing said upper mesh.

41. A method of fabricating stacked layers, comprising:

forming a first layer of a first material;

forming a first layer of a second material;

patterning said first layer of said second material to form a lower mesh;

forming a second layer of said first material;

forming a second layer of said second material;

patterning said second layer of said second material to define a chamber above said lower mesh;

forming a third layer of said first material;

forming a third layer of said second material;

patterning said third layer of said second material to form an upper mesh above said chamber;

forming a fourth layer of said first material;

forming a fourth layer of said second material; and

patterning said fourth layer of said second material to act as an etch mask for forming said upper mesh.

42. The method of claim 41 wherein said first material is an oxide and said second material is a metal.

43. A method, comprising:

forming an upper micro-machined mesh on a substrate;

releasing said upper mesh;

forming and releasing a lower mesh under said upper mesh; and

sealing said lower and upper meshes to form first and second membranes, respectively.

44. The method of claim 43 wherein said sealing includes deposition of a polymer.

45. A method, comprising:

sensing a pressure between an upper membrane and a plurality of lower membranes, each of said plurality of lower membranes having a micro-machined mesh;

controlling the position of each of said plurality of lower membranes in response to said sensing; and

monitoring the positions of said plurality of membranes to provide an output signal.

46. The method of claim 45 wherein each of said plurality of lower membranes has first and second positions, and wherein said monitoring determines the position of each of said plurality of lower membranes.

47. The method of claim 45 wherein said sensing includes sensing pressure changes and wherein said controlling compensates for sensed pressure changes.

48. A method of converting sound waves to a digital signal, comprising:

sensing a pressure in a chamber formed of an upper membrane and a plurality of lower membranes, each of said lower membranes having first and second positions, each of said lower membranes having a micro-machined mesh;

controlling, in response to said sensing, whether each of said plurality of lower membranes is in its first or second position; and

outputting a digital signal responsive to the positions of each of said plurality of lower membranes.

49. The method of claim 48 wherein said plurality of lower membranes are arranged in groups, each group being responsive to produce one bit of the output digital signal.

50. The method of claim 48 wherein said plurality of lower membranes are of various sizes, each size being responsive to produce one bit of the output digital signal.