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Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials

  • US 20030211677A1
  • Filed: 04/07/2003
  • Published: 11/13/2003
  • Est. Priority Date: 05/19/2000
  • Status: Active Grant
First Claim
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1. A method for securing at least two semiconductor device components to one another, comprising:

  • applying an adhesive material comprising a pressure sensitive component and a thermoset component to at least a portion of a surface of a first semiconductor component;

    bringing a surface of a second semiconductor device component into contact with said adhesive material to temporarily secure said second semiconductor device component to said first semiconductor device component; and

    heating said adhesive material to cure at least said thermoset component thereof.

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