Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials
First Claim
1. A method for securing at least two semiconductor device components to one another, comprising:
- applying an adhesive material comprising a pressure sensitive component and a thermoset component to at least a portion of a surface of a first semiconductor component;
bringing a surface of a second semiconductor device component into contact with said adhesive material to temporarily secure said second semiconductor device component to said first semiconductor device component; and
heating said adhesive material to cure at least said thermoset component thereof.
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Accused Products
Abstract
A method for securing two or more semiconductor device components to one another. A hybrid adhesive material, including a pressure sensitive component and a thermoset component, is used to at least temporarily secure the semiconductor device components to each other. The pressure sensitive component of the hybrid adhesive material temporarily secures the semiconductor device components to one another. When the semiconductor device components are properly aligned, the hybrid adhesive material may be heated to cure the thermoset component thereof and to more permanently secure the semiconductor device components to one another. The cure temperature may be lower than about 200° C. and as low as about 120° C. or less. A system for effecting the method of the present invention is also disclosed, as well as semiconductor device assemblies that include the hybrid adhesive material.
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Citations
28 Claims
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1. A method for securing at least two semiconductor device components to one another, comprising:
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applying an adhesive material comprising a pressure sensitive component and a thermoset component to at least a portion of a surface of a first semiconductor component;
bringing a surface of a second semiconductor device component into contact with said adhesive material to temporarily secure said second semiconductor device component to said first semiconductor device component; and
heating said adhesive material to cure at least said thermoset component thereof. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for securing at least two semiconductor device components to one another, comprising:
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applying an adhesive material comprising a pressure sensitive component and a thermoset component to at least one of the at least two semiconductor device components;
bringing the at least two semiconductor device components into contact with one another with adhesive material positioned therebetween to at least temporarily secure the at least two semiconductor device components to one another; and
heating at least said adhesive material to permanently secure the at least two semiconductor device components to one another. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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Specification