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Multichip wafer-level package and method for manufacturing the same

  • US 20030214029A1
  • Filed: 03/21/2003
  • Published: 11/20/2003
  • Est. Priority Date: 05/17/2002
  • Status: Active Grant
First Claim
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1. A multichip wafer-level package comprising:

  • a first chip having a semiconductor device, a first bonding pad ring surrounding the semiconductor device, a plurality of internal bonding pads disposed within the first bonding pad ring and electrically connected to the semiconductor device, and a plurality of external bonding pads disposed outside the first bonding pad ring and electrically connected to the semiconductor device for electrically connecting to an external circuit;

    a second chip having an electronic device, a plurality of bonding pads electrically connected to the electronic device and corresponding to the internal bonding pads of the first chip, and a second bonding pad ring corresponding to the first bonding pad ring of the first chip;

    a bump ring disposed between the first bonding pad ring of the first chip and the second bonding pad ring of the second chip for bonding the first and the second chips so as to form a cavity for accommodating the semiconductor device; and

    a plurality of bumps electrically connecting the internal bonding pads of the first chip to the bonding pads of the second chip.

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