Dispersible dielectric particles and methods of forming the same

• US 20030215606A1
• Filed: 05/17/2002
• Published: 11/20/2003
• Est. Priority Date: 05/17/2002
• Status: Abandoned Application

• Current Assignee: Cabot Corporation
• Original Assignee: Cabot Corporation
• Inventors: Venigalla, Sridhar, Kerchner, Jeffrey A., Clancy, Donald J.
• Application Number:
  US10/150,761
• Publication Number:
  US 20030215606A1
• Time in Patent Office: Days
• US Class Current: 428/141
• CPC Class Codes: C08J 3/212 and solid additives
• CPC Class Codes: C08K 3/24 Acids; Salts thereof C08K3/16 takes precedence
• CPC Class Codes: H01G 4/1227 based on alkaline earth titanates
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2203/0759 Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
• CPC Class Codes: Y10T 428/24355 Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]

Abstract

Methods of forming dispersible dielectric particles, as well as articles and compositions that include the dispersible dielectric particles, are provided. The methods involve forming an aqueous mixture of dielectric (e.g., barium titanate-based) particles and replacing at least a portion of water in the mixture with a non-aqueous solvent (e.g., ethanol). According to one set of methods, the particles are then dried. The limited, or lack, of water present in the mixture during drying reduces capillary forces that otherwise may draw the particles together to cause formation of strong agglomerates. Thus, particle agglomeration during drying may be reduced which increases particle dispersibility. According to another set of methods of the invention, the particles are not dried after non-aqueous solvent replacement, thus, avoiding formation of agglomerates during drying and increasing dispersibility. In both sets of methods, particles (or mixtures thereof) may be further processed, for example, to form composite layers. As a result of the increased particle dispersibility, the particles are relatively uniformly distributed throughout the polymeric material. This uniform distribution improves properties of the composite layers which may be used as an embedded capacitor in electronic applications including printed circuit boards.

Claims

1. A method of forming a composite structure comprising:

forming an aqueous mixture including barium titanate-based particles and water;

replacing at least a portion of the water in the aqueous mixture with a non-aqueous solvent to form a non-aqueous mixture including the non-aqueous solvent and the barium titanate-based particles;

drying the barium titanate-based particles in the non-aqueous mixture;

mixing the dried barium titanate-based particles with a second non-aqueous solvent and a precursor of polymeric material to form a second non-aqueous mixture; and

removing the second non-aqueous solvent from the second non-aqueous mixture to form a composite structure including barium titanate-based particles distributed in the polymeric material.

2. The method of claim 1, further comprising milling the dried barium titanate-based particles prior to mixing the dried barium titanate-based particles with the second non-aqueous solvent and the precursor of polymeric material.

3. The method of claim 2, comprising hammer milling the dried barium titanate-based particles prior to mixing the dried barium titanate-based particles with the second non-aqueous solvent and the precursor of polymeric material.

4. The method of claim 1, further comprising screening the dried barium titanate-based particles prior to mixing the dried barium titanate-based particles with the second non-aqueous solvent and the precursor of polymeric material.

5. The method of claim 1, further comprising high shear mixing the second non-aqueous mixture prior to removing the second non-aqueous solvent.

6. The method of claim 1, further comprising wet milling the second non-aqueous mixture prior to removing the second non-aqueous solvent.

7. The method of claim 1, wherein the replacing step comprises removing at least a portion of the water from the aqueous mixture followed by adding the non-aqueous solvent to form the non-aqueous mixture.

8. The method of claim 7, comprising removing substantially all of the water from the aqueous mixture.

9. The method of claim 7, wherein the replacing step includes filtering the aqueous mixture to remove at least a portion of the water prior to the addition of the non-aqueous solvent to form the non-aqueous mixture.

10. The method of claim 9, further comprising filtering at least some of the non-aqueous solvent while adding the non-aqueous solvent to form the non-aqueous mixture.

11. The method of claim 1, wherein the aqueous mixture is an aqueous wet cake or an aqueous slurry.

12. The method of claim 1, wherein the non-aqueous mixture is a non-aqueous wet cake or a non-aqueous slurry.

13. The method of claim 1, wherein the non-aqueous mixture includes water.

14. The method of claim 1, wherein the non-aqueous solvent has a surface tension less than the surface tension of water.

15. The method of claim 1, further comprising casting the non-aqueous mixture on a substrate prior to removing the second non-aqueous solvent from the non-aqueous mixture to form the composite structure as a composite layer on the substrate.

16. The method of claim 15, wherein the substrate is conductive and further comprising forming a conductive layer on the composite layer to form a sandwich structure.

17. The method of claim 16, wherein the sandwich structure is processed to form a printed circuit board.

18. The method of claim 1, wherein the non-aqueous mixture is not subjected to a settling step prior to removing the second non-aqueous solvent.

19. The method of claim 1, wherein the precursor of polymeric material is dissolved in the second non-aqueous solvent.

20. The method of claim 1, wherein the polymeric material is an epoxy.

21. The method of claim 1, wherein the second non-aqueous solvent is removed by evaporation.

22. The method of claim 1, further comprising forming the barium titanate-based particles in a hydrothermal process.

23. The method of claim 22, wherein the barium titanate-based particles are maintained in water after the hydrothermal process to form the aqueous mixture.

24. The method of claim 1, wherein the barium titanate-based particles are uncoated.

25. The method of claim 1, wherein the non-aqueous solvent is ethanol.

47. The method of claim 1, wherein the barium titanate-based particles are uncoated.

26. A method of forming a composite structure comprising:

forming an aqueous mixture including barium titanate-based particles and water;

replacing at least a portion of the water in the aqueous mixture with a non-aqueous solvent to form a non-aqueous mixture including the non-aqueous solvent and the barium titanate-based particles;

adding a precursor of a polymeric material to the non-aqueous mixture; and

removing the non-aqueous solvent from the non-aqueous mixture to form a composite structure including barium titanate-based particles distributed in the polymeric material.

27. The method of claim 26, further comprising high shear mixing the non-aqueous mixture prior to removing the non-aqueous solvent.

28. The method of claim 26, further comprising wet milling the non-aqueous mixture prior to removing the non-aqueous solvent.

29. The method of claim 26, wherein the replacing step comprises removing at least a portion of the water from the aqueous mixture followed by adding the non-aqueous solvent to form the non-aqueous mixture.

30. The method of claim 29, comprising removing substantially all of the water from the aqueous mixture.

31. The method of claim 29, wherein the replacing step includes filtering the aqueous mixture to remove at least a portion of the water prior to the addition of the non-aqueous solvent to form the non-aqueous mixture.

32. The method of claim 31, further comprising filtering at least some of the non-aqueous solvent while adding the non-aqueous solvent to form the non-aqueous mixture.

33. The method of claim 27, wherein the aqueous mixture is an aqueous wet cake or an aqueous slurry.

34. The method of claim 27, wherein the non-aqueous mixture is a non-aqueous wet cake or a non-aqueous slurry.

35. The method of claim 27, wherein the non-aqueous mixture includes water.

36. The method of claim 27, wherein the non-aqueous solvent has a surface tension less than the surface tension of water.

37. The method of claim 27, further comprising casting the non-aqueous mixture on a substrate prior to removing the non-aqueous solvent from the non-aqueous mixture to form the composite structure as a composite layer on the substrate.

38. The method of claim 37, wherein the substrate is conductive and further comprising providing a conductive layer on the composite layer to form a sandwich structure.

39. The method of claim 38, wherein the sandwich structure is processed to form a printed circuit board.

40. The method of claim 39, wherein the non-aqueous mixture is not subjected to a settling step prior to removing the non-aqueous solvent.

41. The method of claim 27, wherein the precursor of polymeric material is dissolved in the second non-aqueous solvent.

42. The method of claim 27, wherein the polymeric material is an epoxy.

43. The method of claim 27, wherein the second non-aqueous solvent is removed by evaporation.

44. The method of claim 27, further comprising forming the barium titanate-based particles in a hydrothermal process.

45. The method of claim 44, wherein the barium titanate-based particles are maintained in water after the hydrothermal process to form the aqueous mixture.

46. The method of claim 45, wherein the barium titanate-based particles are not dried after the hydrothermal process and prior to removing the second non-aqueous solvent.

48. A composite layer including barium titanate-based particles distributed in a polymeric material, the barium titanate-based particles being present in an amount of at least 50 percent by weight of the total composite layer, the composite layer having a surface roughness of less than about 500 nm.

49. The composite layer of claim 48, wherein the composite layer has a surface roughness of less than about 100 nm.

50. The composite layer of claim 48, wherein the composite layer has a surface roughness of less than about 50 nm.