Method for forming bottle trenches

• US 20030216044A1
• Filed: 05/07/2003
• Published: 11/20/2003
• Est. Priority Date: 05/16/2002
• Status: Active Grant

• Current Assignee: Nanya Technology Corporation
• Original Assignee: Nanya Technology Corporation
• Inventors: Lin, Shian-Jyh, Lai, Chao-Sung
• Granted Patent: US 6,716,757 B2
• Time in Patent Office: Days
• US Class Current: 438/689
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 29/66181 Conductor-insulator-semiconductor capacitors, e.g. trench capacitors

Abstract

A method for forming bottle trenches. The method comprises providing a substrate formed with a pad stack layer on the top, and a deep trench with protective layer on the upper portions of sidewalls thereof, implanting ions into the lower portions of sidewalls and bottom of the trench not covered by the protective layer to amorphize the atomic structure of the sidewalls and bottom, oxidizing the amorphous sidewalls and bottom of the trench to form a bottle-shaped oxide layer thereon, and removing the bottle-shaped oxide layer.

Claims

1. A method for forming bottle trenches, comprising:

providing a substrate formed with a pad stack layer on the top, a deep trench and a protective layer on the upper portions of sidewalls of the deep trench;

implanting ions into the lower portions of sidewalls and bottom of the trench not covered by the protective layer to amorphize the atomic structure of the sidewalls and bottom;

oxidizing the amorphous sidewalls and bottom of the trench to form a bottle-shaped oxide layer thereon; and

removing the bottle-shaped oxide layer.

3. The method as claimed in claim 1, wherein the protective layer is insulating material.

5. The method as claimed in claim 1, wherein the ions implanted in step (b) are Si, Ge, or Ar, Ne, or He of inert gas.

9. The method as claimed in claim 1, wherein the pad stack layer comprises a pad oxide layer and a pad nitride layer.

2. A method for forming bottle trenches in a semiconductor substrate, comprising:

providing a substrate formed with a pad stack layer on the top, a deep trench and a protective layer on the upper portions of sidewalls of the deep trench;

implanting ions into the lower portions of sidewalls and bottom of the trench not covered by the protective layer to amorphize the atomic structure of the sidewalls and bottom; and

removing the amorphous sidewalls and bottom of the trench.

4. The method as claimed in claim 2, wherein the protective layer is insulating material.

6. The method as claimed in claim 2, wherein the ions implanted in step (b) are Si, Ge, or Ar, Ne, or He of inert gas.

7. The method as claimed in claim 2, wherein removal the amorphous sidewalls and bottom of the trench is carried out by acid or NH₄OH.

8. The method as claimed in claim 7, wherein the acid is HF/EG, DHF or BHF.

10. The method as claimed in claim 2, wherein the pad stack layer comprises a pad oxide layer and a pad nitride layer.

11. A method for forming a bottle trench, comprising:

providing a semiconductor substrate with an active region;

forming a first pad oxide layer and a first pad nitride layer sequentially on the substrate to form a pad stack layer;

defining the pad stack layer and the substrate to form a trench in the active region;

forming a protective layer on the upper portion of the sidewalls of the trench;

implanting ions into the lower portions of sidewalls and bottom of the trench not covered by the protective layer to amorphize the atomic structure of the sidewalls and bottom; and

removing the amorphous sidewalls and bottom of the trench.

12. The method as claimed in claim 11, wherein the protective layer is insulating material.

13. The method as claimed in claim 11, wherein the ions implanted are Si, Ge, or Ar, Ne, or He of inert gas.

14. The method as claimed in claim 11, wherein definition is carried out by acid or NH₄OH.

15. The method as claimed in claim 14, wherein the acid is HF/EG, DHF or BHF.