Substrate processing apparatus

• US 20030217695A1
• Filed: 04/30/2003
• Published: 11/27/2003
• Est. Priority Date: 05/23/2002
• Status: Active Grant

• Current Assignee: SCREEN Holdings Co., Ltd.
• Original Assignee: SCREEN Holdings Co., Ltd.
• Inventors: Fukutomi, Yoshiteru, Inagaki, Yukihiko, Yoshioka, Katsushi
• Granted Patent: US 6,752,543 B2
• Time in Patent Office: Days
• US Class Current: 118/666
• CPC Class Codes: H01L 21/67017 Apparatus for fluid treatment H01L21/67126, H01L21/6715 take precedence

Abstract

A manifold communicatively connects a plurality of coating processing units with an air conditioning unit. The manifold is formed by branching a common pipe into a plurality of distributing pipes. The air conditioning unit performs temperature control to set air passing through a branch point of the manifold to a temperature slightly lower than a target temperature in processing units. Secondary heaters secondarily heat air passing through joints between the distributing pipes and the processing units to the target temperature thereby supplying accurately temperature-controlled air to processing parts. Air from the air conditioning unit is diverted thereby suppressing the height of the overall apparatus. Thus, a substrate processing apparatus capable of inhibiting the height of the overall apparatus from remarkable increase also when vertically stacking processing parts in multiple stages and supplying temperature-controlled air to the processing parts with sufficient accuracy.

Claims

1. A substrate processing apparatus comprising n (n:

natural number of at least two) processing parts processing a substrate, comprising;

a temperature-controlled air supply part adjusting the temperature of air and delivering said temperature-controlled air;

a manifold formed by branching a common pipe into n distributing pipes for communicatively connecting said common pipe to said temperature-controlled air supply part while communicatively connecting said n distributing pipes to said n processing parts in one-to-one correspondence; and

n correction temperature control parts provided in one-to-one correspondence to said n distributing pipes for temperature-controlling air passing through said distributing pipes.

2. The substrate processing apparatus according to claim 1, further comprising:

a first temperature measuring element provided on said common pipe for measuring the temperature of air passing through said common pipe, and

n second temperature measuring elements provided in one-to-one correspondence to said n distributing pipes for measuring the temperature of air passing through said distributing pipes, wherein

said temperature-controlled air supply part performs temperature control on the basis of a result of measurement of said first temperature measuring element to set air passing through said common pipe to a first target temperature, and

each of said n correction temperature control parts performs temperature control on the basis of a result of measurement of said second temperature measuring element provided on said distributing pipe corresponding to said correction temperature control part to set air passing through said distributing pipe to a second target temperature.

3. The substrate processing apparatus according to claim 2, wherein

said first temperature measuring element measures the temperature of air passing through a branch point of said manifold, and

each of said n second temperature measuring elements measures the temperature of air passing through a joint between said distributing pipe corresponding to said second temperature measuring element and said processing part communicatively connected with said distributing pipe.

4. The substrate processing apparatus according to claim 3, wherein

second target temperatures are individually set as to the respective ones of said n correction temperature control parts.

5. The substrate processing apparatus according to claim 3, wherein

said temperature-controlled air supply part comprises a primary heating part heating air and a cooling part cooling air,

said correction temperature control parts comprise secondary heating parts heating air, and

said second target temperature is set higher than said first target temperature.

6. The substrate processing apparatus according to claim 5, further comprising a humidity measuring element measuring the humidity of air passing through a joint between any of said n distributing pipes and said processing part communicatively connected with said distributing pipe, wherein

said temperature-controlled air supply part further comprises a humidification part humidifying air and performs temperature control and humidification on the basis of a result of measurement of said humidity measuring element to set air passing through said joint to a target humidity.

7. The substrate processing apparatus according to claim 6, wherein

said cooling part cools air humidified by said humidification to a dew point of air comprising the conditions of said second target temperature and said target humidity.

8. The substrate processing apparatus according to claim 6, wherein

said processing parts are coating processing parts coating a substrate with resist.