Projection print engine and method for forming same

• US 20030218666A1
• Filed: 05/22/2002
• Published: 11/27/2003
• Est. Priority Date: 05/22/2002
• Status: Abandoned Application

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Thoughtbeam, Inc.
• Inventors: Holm, Paige M., Richard, Fred V.
• Application Number:
  US10/151,950
• Publication Number:
  US 20030218666A1
• Time in Patent Office: Days
• US Class Current: 347/130
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Semiconductor print engine structures (304) are formed by growing high quality epitaxial layers (26) of monocrystalline materials overlying monocrystalline substrates (22) such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. The compliant substrate includes an accommodating buffer layer (24) including a layer of monocrystalline oxide spaced apart from a silicon wafer (22) by an amorphous interface layer (28) of silicon oxide. The amorphous interface layer (28) dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer (24).

Claims

1. A projection print engine comprising:

a microelectronic chip comprising

a monocrystalline silicon substrate,

an amorphous oxide material overlying the monocrystalline silicon substrate,

an accommodating buffer material overlying the amorphous oxide material, and

an array of light emitting devices formed overlying the accommodating buffer layer material, and

a photoconductive drum configured to receive light emitted from the microelectronic chip.

2. The projection print engine of claim 1, further comprising an electronic circuit formed within the silicon substrate.

3. The projection print engine of claim 2, wherein the electronic circuit comprises a multiplexing circuit.

4. The projection print engine of claim 2, wherein the electronic circuit comprises a demultiplexing circuit.

5. The projection print engine of claim 2, wherein the electronic circuit comprises a circuit to control the output of the intensity of the a light emitting device within the array of light emitting devices.

6. The projection print engine of claim 1, wherein the accommodating buffer layer comprises an oxide selected from the group consisting of alkaline earth metal titanates, alkaline earth metal zirconates, alkaline earth metal hafniates, alkaline earth metal tantalates, alkaline earth metal ruthenates, and alkaline earth metal niobates.

7. The projection print engine of claim 1, wherein the accommodating buffer layer is at least partially amorphous.

8. The projection print engine of claim 1, wherein the accommodating buffer layer is monocrystalline.

9. The projection print engine of claim 1, wherein the array of light emitting devices comprises a plurality of light emitting diodes.

10. The projection print engine of claim 1, wherein the array of light emitting devices comprises a plurality of laser diodes.

11. The projection print engine of claim 1, wherein the array of light emitting devices comprises a plurality of vertical cavity surface emitting lasers.

12. The projection print engine of claim 1, wherein array of light emitting devices comprises a monocrystalline material layer of a first type epitaxially formed overlying the accommodating buffer layer and a monocrystalline material layer of a second type epitaxially formed overlying the monocrystalline material layer of a first type.

13. The projection print engine of claim 1, further comprising a photodetector configured to detect at least a portion of light emitted from the array of light emitting devices.

14. The projection print engine of claim 13, wherein the photodetector is formed using a portion of the silicon substrate.

15. The projection print engine of claim 1, wherein the accommodating buffer material comprises Sr_xBa_1-xTiO₃ where x is between 0 and 1.

16. The projection print engine of claim 1 wherein array of light emitting devices comprises a material selected from the group consisting of:

GaAs, AlGaAs, InP, InGaAsP, InGaAs, InGaP, ZnSe, and ZnSeS, GaN, and InGaAlN.

17. The projection print engine of claim 1, further comprising a plurality of input/output pads coupled to the array of light emitting devices.

18. The projection print engine of claim 1, wherein the array of light emitting devices comprises a plurality of double heterostructure AlGaAs devices.

19. The projection print engine of claim 1, wherein the at least one of the devices of the array of light emitting devices comprises a first wide bandgap material layer, an active region layer overlying the first wide bandgap material layer, and a second wide bandgap material layer overlying the active region layer.

20. The projection print engine of claim 19, wherein the at least one of the devices of the array of light emitting devices comprises an N+ GaAs layer, an N type AlGaAs layer overlying the N+ GaAs layer, an unintentionally doped AlGaAs layer overlying the N+ GaAs layer, a P type AlGaAs material layer overlying the unintentionally doped AlGaAs layer, and a P+ GaAs layer overlying the P type AlGaAs material layer.

21. The projection print engine of claim 20, wherein the thickness of the N+ GaAs layer is about 500 nm.

22. The projection print engine of claim 20, wherein the thickness of the N type AlGaAs layer is about 250 nm.

23. The projection print engine of claim 20, wherein the thickness of the unintentionally doped AlGaAs layer is about 100 nm.

24. The projection print engine of claim 20, wherein the thickness the P type AlGaAs material layer is about 250 nm.

25. The projection print engine of claim 20, wherein the thickness the P+ GaAs layer is about 50 nm.

26. The projection print engine of claim 19, wherein the active region comprises a single quantum well.

27. The projection print engine of claim 19, wherein the active region comprises a plurality of quantum wells.

28. The projection print engine of claim 1, further comprising a lens interposed between the silicon substrate and the photoconductive drum.

29. A semiconductor structure for a projection print engine, the structure comprising:

a silicon substrate;

an accommodating buffer layer formed overlying the silicon substrate;

an amorphous interface layer formed between the silicon substrate and the accommodating buffer layer; and

a light emitting structure formed overlying the accommodating buffer layer, the light emitting structure comprising a first wide bandgap material layer, an active region, and a second wide bandgap material layer.

30. The semiconductor structure of claim 29, wherein the first wide bandgap material layer comprises AlGaAs, having a mole fraction of Al of about 0.45.

31. The semiconductor structure of claim 29, wherein the thickness of the first wide bandgap material layer is about 250 nm.

32. The semiconductor structure of claim 29, wherein the first wide bandgap material layer comprises about 10¹⁷ to about 10¹⁸ silicon atoms per cubic centimeter.

33. The semiconductor structure of claim 29, wherein the active region comprises unintentionally doped AlGaAs.

34. The semiconductor structure of claim 33, wherein the unintentionally doped AlGaAs comprises about 12 percent aluminum.

35. The semiconductor structure of claim 29, wherein the active region is about 100 nm thick.

36. The semiconductor structure of claim 29, wherein the second wide bandgap material layer comprises AlGaAs, having a mole fraction of Al of about 0.45.

37. The semiconductor structure of claim 29, wherein the thickness of the second wide bandgap material layer is about 250 nm.

38. The semiconductor structure of claim 29, wherein the second wide bandgap material layer comprises about 5×

10¹⁷ to about 5×

10¹⁸ silicon atoms per cubic centimeter.

39. A print engine including the structure of claim 29.

40. The print engine of claim 39, further comprising a multiplexing and demultiplexing circuit formed within the silicon substrate.

41. A process for fabricating a semiconductor structure for a projection print engine, the process comprising:

providing a monocrystalline silicon substrate;

depositing a monocrystalline accommodating buffer film overlying the monocrystalline silicon substrate, the film having a thickness less than a thickness of the material that would result in strain-induced defects;

forming an amorphous oxide interface layer containing at least silicon and oxygen at an interface between the monocrystalline accommodating buffer film and the monocrystalline silicon substrate;

epitaxially forming a monocrystalline compound semiconductor layer overlying the monocrystalline accommodating buffer film; and

forming a light emitting device using the monocrystalline compound semiconductor layer.

42. The process of claim 41, further comprising the step of forming an electronic device using a portion of the monocrystalline silicon substrate.

43. The process of claim 42, wherein the step of forming an electronic device includes forming a multiplexing and demultiplexing circuit.

44. The process of claim 41, further comprising the step of forming a plurality of input/output pads.

45. The process of claim 41, further comprising the step of forming a light detector device.

46. The process of claim 45, wherein the step of forming a light detector device comprises the step of forming a P/N junction using the monocrystalline silicon substrate.

47. The process of claim 41, wherein the step of forming a light emitting device comprises the steps of:

forming a first wide bandgap material layer overlying the accommodating buffer film;

forming an active region layer overlying the first wide bandgap material layer; and

forming a second wide bandgap material layer overlying the active region material layer.

48. The process of claim 41, further comprising the step of exposing the monocrystalline accommodating buffer film to an anneal process to convert at least a portion of the monocrystalline film from a monocrystalline structure to an amorphous material.

49. A projection print engine comprising:

a monocrystalline silicon substrate having MOS devices formed therein, the MOS devices configured to multiplex and demultiplex electronic information;

an amorphous oxide material overlying the monocrystalline silicon substrate;

an accommodating buffer material overlying the amorphous oxide material;

an array of light emitting devices formed overlying the accommodating buffer layer material;

a photoconductive drum; and

a lens interposed between the photoconductive drum and the silicon substrate.

50. The projection print engine of claim 49, further comprising a photodetector formed using the silicon substrate.