Modular mounting arrangement and method for light emitting diodes

• US 20030218878A1
• Filed: 04/16/2003
• Published: 11/27/2003
• Est. Priority Date: 06/29/2001
• Status: Active Grant

• Current Assignee: Permlight Products Inc
• Original Assignee: Permlight Products Inc
• Inventors: Swaris, Jagath, Ness, Scott Van
• Granted Patent: US 6,846,093 B2
• Time in Patent Office: Days
• US Class Current: 362/234
• CPC Class Codes: F21S 4/20 with light sources held by or within elongate supports
• CPC Class Codes: F21V 17/007 with provision for shipment or storage
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G09F 13/0404 the light source being enclosed in a box forming the character of the sign
• CPC Class Codes: G09F 13/22 electroluminescent electroluminescent light sources per se H05B33/00
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/13 the devices being of a type provided for in group H01L33/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10446 Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. A heat conductive adhesive tape connects the LED module to the mount surface. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. A plurality of such LED modules can be pre-wired together in a substantially continuous fashion and provided in a dispenser, such as a roll or box. Thus, to install a plurality of such LED modules, a worker simply pulls modules from the dispenser as needed, secures the appropriate number of modules in place, and connects the assembled modules to a power source.

Claims

1. A method of making an illuminated signage system, comprising:

providing a sign member comprising at least one channel defined by a plurality of surfaces;

providing a plurality of light emitting diode (LED) modules, each of the LED modules comprising;

a plurality of LEDs;

a plurality of electrically conductive contacts, each of the LEDs electrically communicating with at least one of the contacts;

a dielectric layer having a first side and a second side, the contacts being connected to the first side;

a main body layer; and

an adhesive layer, the main body layer being disposed between the dielectric layer and the adhesive layer;

electrically connecting the plurality of LED modules to each other; and

adhering the adhesive layer of each module to at least one of the channel surfaces.

2. The method of claim 1, wherein the adhesive layer comprises a thermally conductive tape.

3. The method of claim 2, wherein the tape comprises a backing, and additionally comprising removing the backing to expose the adhesive layer.

4. The method of claim 2, wherein the tape layer comprises a pair of flexible tape members that extend from opposing edges of the module, and additionally comprising engaging the flexible tape members with the channel surface.

5. The method of claim 2, wherein the thermally conductive tape layer comprises a thin metallic layer.

6. The method of claim 1, wherein the main body has a thermal conductivity greater than about 100 W/mK.

7. The method of claim 6, wherein the channel surface has a thermal conductivity greater than about 100 W/mK.

8. The method of claim 2, wherein the main body is substantially flat.

9. The method of claim 8, wherein at least one channel surface is flat, and additionally comprising adhering at least one of the modules to the flat channel surface.

10. The method of claim 1 additionally comprising adhering at least one module to each of at least two of the channel surfaces.

11. The method of claim 1 additionally comprising providing a translucent lens and attaching the lens to a front of the channel.

12. The method of claim 11 additionally comprising arranging the modules on the channel surfaces so that light from the modules does not shine directly at the lens.

13. The method of claim 1, wherein at least some of the plurality of modules are arranged electrically in parallel.

14. The method of claim 1 additionally comprising electrically connecting the modules to one another before adhering them to the channel surface.

15. The method of claim 14 additionally comprising forming a linear chain of modules by electrically connecting adjacent modules.

16. The method of claim 1, wherein the modules are arranged in a dispenser, and additionally comprising drawing successive modules from the dispenser and adhering them into place in the channel.

17. A lighting system comprising:

a plurality of lighting modules adapted to be mounted on a surface of a heat conductive member, each module comprising;

a plurality of light emitting diodes (LEDs);

a plurality of electrically conductive contacts, each of the LEDs electrically communicating with at least one of the contacts in a manner so that the LEDs are configured in a series array between opposing first and second edges of the module; and

a dielectric layer having a first side and a second side, the contacts being connected to the first side;

a first electrically conductive power trace and a second electrically conductive power trace disposed on the first side of the dielectric layer, a first one of the contacts being electrically connected to the first trace, and a second one of the contacts being electrically connected to the second trace, the first contact being electrically connected to a positive lead of the series array of LEDs, and the second contact being electrically connected to a negative lead of the series array of LEDs;

wherein each of the modules further includes an adhesive layer adapted to fasten the module to a surface of a heat conductive member such that heat from the module is drawn into the heat conductive member through the adhesive, and wherein a plurality of modules are electrically interconnected in a manner so that the first and second power traces of a first module are connected to the first and second power traces of a second module.

18. A lighting system as in claim 17, wherein the first and second modules are connected by a first wire extending between the first traces of the modules and a second wire extending between the second traces of the modules.

19. A lighting system as in claim 17, wherein a connector is disposed on each of the first and second modules in electrical communication with the first and second traces of the respective module, and a pair of wires have a wire connector on each end of the pair of wires, the wire connectors being adapted to matingly engage the module connectors.

20. A lighting system as in claim 17, wherein each of the modules includes a main body layer disposed between the dielectric layer and the adhesive layer.