Optical module

• US 20030219210A1
• Filed: 01/28/2003
• Published: 11/27/2003
• Est. Priority Date: 02/20/2001
• Status: Active Grant

• Current Assignee: RPX Corporation
• Original Assignee: CyberOptics Corporation (Nordson Corporation)
• Inventors: Case, Steven K., Skunes, Timothy A., Mowry, Gregory S.
• Granted Patent: US 7,010,855 B2
• Time in Patent Office: Days
• US Class Current: 385/52
• CPC Class Codes: G02B 6/255 Splicing of light guides, e.g. by fusion or bonding
• CPC Class Codes: G02B 6/2553 Splicing machines, e.g. optical fibre fusion splicer
• CPC Class Codes: G02B 6/2555 Alignment or adjustment devices for aligning prior to splicing
• CPC Class Codes: G02B 6/32 having lens focusing means positioned between opposed fibre ends with lens being an integral part of the single fibre end G02B6/262
• CPC Class Codes: G02B 6/3636 the mechanical coupling means being grooves G02B6/3652 takes precedence
• CPC Class Codes: G02B 6/3652 the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
• CPC Class Codes: G02B 6/3692 with surface micromachining involving etching, e.g. wet or dry etching steps surface micromachining involving subtractive techniques B81C1/00055
• CPC Class Codes: G02B 6/3873 Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls
• CPC Class Codes: G02B 6/4207 with optical elements reducing the sensitivity to optical feedback anti-reflection devices specially adapted for lasers, see H01S3/0064
• CPC Class Codes: G02B 6/4221 involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
• CPC Class Codes: G02B 6/4224 using visual alignment markings, e.g. index methods
• CPC Class Codes: G02B 6/4225 by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
• CPC Class Codes: G02B 6/4226 Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
• CPC Class Codes: G02B 6/4227 Active alignment methods, e.g. procedures and algorithms
• CPC Class Codes: G02B 6/4228 Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements G02B6/4234 takes precedence
• CPC Class Codes: G02B 6/4231 with intermediate elements, e.g. rods and balls, between the elements
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: G02B 6/4236 Fixing or mounting methods of the aligned elements
• CPC Class Codes: G02B 6/4238 Soldering
• CPC Class Codes: G02B 6/4239 Adhesive bonding; Encapsulation with polymer material
• CPC Class Codes: Y10T 29/49004 : including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49131 : by utilizing optical sighting device
• CPC Class Codes: Y10T 29/49144 : by metal fusion

Abstract

An optical module for use in an optical device is provided. The module includes an optical component and relative reference mount. The optical component is fixed spacially relative to a registration feature. The registration feature is configured to couple to a fixed reference mount.

Claims

1. An optical module for use in an optical device, comprising:

an optical component;

a relative reference mount having a registration configured to couple to a reference substrate; and

a bonding material configured to fix the optical component relative to the registration feature of the relative reference mount.

2. The optical module of claim 1 including an optical component mount configured to fixedly couple to the optical component.

3. The optical module of claim 1 wherein the bonding material comprises solder.

4. The optical module of claim 1 wherein the bonding material is electrical conductive.

5. The optical module of claim 2 wherein the optical component mount comprises first and second plates with the optical element secured therebetween.

6. The optical module of claim 1 wherein the optical element has an optical characteristic which varies relative to at least one dimension and wherein the optical characteristic is aligned with a reference defined relative to a registration feature of the relative reference mount.

7. The optical module of claim 1 wherein the bonding material comprises adhesive.

8. The optical module of claim 1 wherein the bonding material provides a fixed spacial orientation between the optical component and the relative reference mount.

9. The optical module of claim 8 wherein the bonding material has a first state in which the spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.

10. The optical module of claim 9 wherein the bonding material is operably coupled to only one of the optical component and the relative reference mount when in a first state.

11. The optical module of claim 10 wherein the bonding material is activated to fill the gap.

12. The optical module of claim 11 wherein application or removal of heat causes a change in state of the bonding material.

13. The optical module of claim 11 wherein application or removal of radiation causes a change in state of the bonding material.

14. The optical module of claim 1 wherein the relative reference mount is substantially planar.

15. The optical module of claim 1 wherein the reference substrate comprises a substantially planar substrate.

16. The optical module of claim 1 wherein the bonding material has a first state in which the optical component can move with up to 6 degrees of freedom relative to the relative reference mount.

17. The optical module of claim 2 including a bonding pad between the optical component mount and the relative reference mount configured to adhere to the bonding material.

18. The optical module of claim 2 wherein the optical component mount includes a registration feature configured to register the optical component.

19. The optical module of claim 2 wherein the optical component is bonded to optical component mount.

20. The optical module of claim 1 wherein the bonding material is heat activated and at least one heater element is thermally coupled to the bonding material.

21. The optical module of claim 2 including a heater element carried on at least one of the relative reference mount and the optical component mount.

22. The optical module of claim 21 including electrical conductors on at least one of the relative reference mount and the optical component mount electrically coupled to the heater element.

23. The optical module of claim 22 including contact pads electrically coupled to the electrical conductors.

24. The optical module of claim 1 including a bonding pad on the relative reference mount configured to adhere to a bonding material coupled to the reference substrate.

25. The optical module of claim 1 wherein the relative reference mount comprises silicon.

26. The optical module of claim 2 wherein the optical component mount comprises silicon.

27. The optical module of claim 2 wherein the optical component mount includes an interface surface and the optical component is flush with the interface surface.

28. The optical module of claim 1 wherein the relative reference mount comprises a semiconductor.

29. The optical module of claim 1 wherein the relative reference mount comprises a ceramic.

30. The optical module of claim 1 wherein the registration feature is configured to provide substantially kinematic registration to a fixed reference mount.

31. An optical module for use in an optical device, comprising:

an optical component;

a substantially planar mount plate coupled to the optical element;

a substantially planar relative reference mount configured to couple to a substantially planar fixed references the reference mount bonded by a bonding material to the component mount plate.

32. The optical module of claim 31 wherein the bonding material comprises solder.

33. The optical module of claim 31 including an optical component mount coupled to the optical component.

34. The optical module of claim 31 wherein the optical element has an optical characteristic which varies relative to at least one dimension and wherein the optical characteristic is aligned with a reference defined relative to a registration feature of the relative reference mount.

35. The optical module of claim 31 wherein the bonding material comprises adhesive.

36. The optical module of claim 31 wherein the bonding material provides a fixed spacial orientation between the optical component and the relative reference mount.

37. The optical module of claim 31 wherein the bonding material has a first state in which the spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.

38. The optical module of claim 37 wherein the bonding material touches only one of the optical component mount and the relative reference mount when in a first state.

39. The optical module of claim 38 wherein application or removal of heat causes a change in state of the bonding material.

40. The optical module of claim 31 including a bonding pad between the optical component mount and the relative reference mount configured to adhere to the bonding material.

41. The optical module of claim 31 wherein the bonding material is heat activated and at least one heating element is thermally coupled to the bonding material.

42. The optical module of claim 31 wherein the relative reference mount comprises silicon.

43. The optical module of claim 34 wherein the registration feature is configured to provide substantially kinematic registration to a fixed reference mount.

44. An optical module for use in an optical device, comprising:

an optical component;

an optical component mount configured to fixedly couple to the optical component;

a relative reference mount configured to couple to a reference substrate; and

a fixed spacial orientation between the optical component mount and the relative reference mount.

45. The optical module of claim 44 including bonding material to fix the relative spacial location.

46. The optical module of claim 45 wherein the bonding material comprises solder.

47. The optical module of claim 46 wherein the optical element has an optical characteristic which varies relative to at least one dimension and wherein the optical characteristic is aligned with a reference defined relative to a registration feature of the relative reference mount.

48. The optical module of claim 47 wherein the registration feature is configured to provide substantially kinematic registration to a fixed reference mount.

49. The optical module of claim 46 wherein the bonding material has a first state in which the spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.

50. The optical module of claim 45 wherein the bonding material touches only one of the optical component mount and the relative reference mount when in a first state.

51. The optical module of claim 50 wherein the bonding material is activated to fix the spacial orientation.

52. The optical module of claim 51 wherein application or removal of heat causes a change in state of the bonding material.

53. The optical module of claim 44 wherein the relative reference mount is substantially planar.

54. The optical module of claim 44 including a bonding pad between the optical component mount and the relative reference mount configured to adhere to the bonding material.

55. The optical module of claim 52 including a heating element carried on at least one of the relative reference mount and the optical component mount.

56. The optical module of claim 44 wherein the optical component mount comprises silicon.

57. An optical module for use in an optical device, comprising:

an optical component;

a relative reference mount having a registration feature configured to couple to a substrate; and

bonding material configured to fixedly secure the optical component at a orientation and position relative to the registration feature of the relative reference mount.

58. The optical module of claim 57 wherein the bonding material comprises solder.

59. The optical module of claim 57 wherein the optical component has an optical characteristic which varies relative to at least one dimension and wherein the optical characteristic is aligned with a reference defined relative to a registration feature of the relative reference mount.

60. The optical module of claim 57 wherein the bonding material provides a fixed spacial orientation between the optical component and the relative reference mount.

61. The optical module of claim 60 wherein the bonding material has a first state in which the. spacial orientation can be adjusted and a second state in which the spacial orientation is fixed.

62. The optical module of claim 61 wherein the bonding material is operably coupled to only one of the optical component mount and the relative reference mount when in a first state.

63. The optical module of claim 62 wherein application or removal of heat causes a change in state of the bonding material.

64. The optical module of claim 57 wherein the bonding material is heat activated and at least one heating element is thermally coupled to the bonding material.

65. The optical module of claim 57 including an optical component mount configured to couple the optical component to the relative reference mount.