Conductive material patterning methods
First Claim
1. A patterning method comprising:
- providing a first material;
transforming at a least a surface region of the first material to a second material;
converting one or more portions of the second material to one or more converted portions of first material while one or more portions of the second material remain; and
removing one or more portions of the remaining second material selectively relative to converted portions of first material.
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Abstract
A patterning method includes providing a first material (e.g., copper) and transforming at a least a surface region of the first material to a second material (e.g., copper oxide). One or more portions of the second material (e.g., copper oxide) are converted to one or more converted portions of first material (e.g., copper) while one or more portions of the second material (e.g., copper oxide) remain. One or more portions of the remaining second material (e.g., copper oxide) are removed selectively relative to converted portions of first material (e.g., copper). Further, a thickness of the converted portions may be increased. Yet further, a diffusion barrier layer may be used for certain applications.
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Citations
75 Claims
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1. A patterning method comprising:
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providing a first material;
transforming at a least a surface region of the first material to a second material;
converting one or more portions of the second material to one or more converted portions of first material while one or more portions of the second material remain; and
removing one or more portions of the remaining second material selectively relative to converted portions of first material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A patterning method comprising:
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providing a layer on a substrate, the layer comprising a first chemical composition;
treating the layer comprising the first chemical composition to transform at least a region of the layer to a second chemical composition;
patterning the layer, wherein patterning the layer comprises;
converting one or more portions of the transformed region comprising the second chemical composition to one or more converted portions comprising the first chemical compositions with one or more portions comprising the second chemical composition remaining, and removing the one or more remaining portions comprising the second chemical composition selectively relative to the one or more converted portions comprising the first chemical composition. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
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23. A patterning method comprising:
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providing metal oxide comprising material on a substrate;
transforming one or more regions of the metal oxide comprising material to one or more regions of an elemental metal comprising material while leaving one or more remaining regions of the metal oxide comprising material; and
removing one or more of the remaining regions of the metal oxide comprising material selectively relative to the one or more regions of the elemental metal comprising material to form conductors on the substrate. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
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34. A patterning method comprising:
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providing a metal oxide comprising material on a substrate;
exposing one or more regions of the metal oxide comprising material to radiation to transform the exposed regions to one or more regions of elemental metal comprising material while leaving one or more remaining regions of metal oxide comprising material; and
removing one or more of the remaining regions of metal oxide comprising material selectively relative to the one or more regions of elemental metal comprising material. - View Dependent Claims (35, 36, 37, 38, 39)
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40. A metal conductor patterning method comprising:
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providing a layer of copper on a substrate;
transforming at least a surface region of the copper to a copper oxide;
converting one or more portions of the copper oxide to one or more converted portions of copper while at least other portions of the copper oxide remain; and
removing substantially all of the portions of the copper oxide remaining relative to the copper resulting in copper conductors on the substrate. - View Dependent Claims (41, 42, 43, 44, 45, 46, 47)
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48. A patterning method comprising:
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forming diffusion barrier material on a substrate;
forming a first material on at least a portion of the diffusion barrier material;
transforming at least a surface region of the first material to a second material;
converting one or more portions of the second material to one or more converted portions of first material while at least one or more portions of the second material overlying diffusion barrier material remain;
removing one or more of the remaining portions of second material selectively relative to the one or more converted portions of first material exposing diffusion barrier material thereunder; and
removing the exposed diffusion barrier material selectively relative to the one or more converted portions of first material. - View Dependent Claims (49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60)
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61. A conductor patterning method comprising:
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forming a diffusion barrier material comprising cobalt, tungsten, and phosphorous on a silicon-containing region of a substrate;
forming a first material comprising copper on the diffusion barrier material;
oxidizing at least a surface region of the first material comprising copper to a second material comprising copper oxide;
converting one or more portions of the second material comprising copper oxide to one or more converted portions of first material comprising copper while leaving at least one or more portions of the second material comprising copper oxide remaining over underlying portions of the diffusion barrier material;
removing one or more of the remaining portions of second material comprising copper oxide selectively relative to the first material comprising copper exposing underlying diffusion barrier material; and
removing the exposed diffusion barrier material. - View Dependent Claims (62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75)
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Specification