Miniaturized imaging device including utility aperture and SSID

• US 20030220574A1
• Filed: 03/17/2003
• Published: 11/27/2003
• Est. Priority Date: 03/18/2002
• Status: Active Grant

• Current Assignee: SARCOS LC (Sarcos Technology & Robotics Corp.)
• Original Assignee: Sarcos Investments LC
• Inventors: Markus, David T., Jacobsen, Stephen C., Pensel, Ralph W.
• Granted Patent: US 7,787,939 B2
• Time in Patent Office: Days
• US Class Current: 600/466
• CPC Class Codes: A61B 1/05 characterised by the image sensor, e.g. camera, being in the distal end portion
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes

Abstract

The present invention is drawn toward miniaturized imaging devices. In one embodiment, the device can include a utility guide having at least one aperture configured for supporting utilities, and an SSID carried by the utility guide. The SSID can include an imaging array on a top surface, and a conductive element on a side surface, wherein the imaging array is electrically coupled to the conductive element. Further, a lens can be optically coupled to the imaging array, and an umbilical, including a conductive line, can be carried by the at least one aperture. The conductive line can be electrically coupled to the conductive element on the side surface of the SSID. Alternatively, the device can include an SSID having, as an integral structure, an imaging array electrically coupled to a conductive pad, wherein the SSID further includes at least one utility aperture passing therethrough. Further, a lens can be optically coupled to the imaging array, and an umbilical, including a conductive line carried by the at least one aperture, can be configured such that the conductive line is directly electrically coupled to the conductive pad.

Claims

1. A miniaturized imaging device, comprising:

(a) a utility guide having at least one aperture configured for supporting utilities;

(b) an SSID carried by the utility guide, said SSID including

i) an imaging array on a top surface, and

ii) a conductive element on a side surface, said imaging array being electrically coupled to the conductive element;

(c) a lens optically coupled to the imaging array; and

(d) an umbilical, including a conductive line, carried by the at least one aperture, said conductive line electrically coupled to the conductive element on the side surface of the SSID.

2. A miniaturized imaging device as in claim 1, wherein the conductive element is a metal trace, said metal trace being electrically coupled to the imaging array through a conductive pad on the top surface.

3. A miniaturized imaging device as in claim 1, wherein the utility guide and the SSID are a single integrated component.

4. A miniaturized imaging device as in claim 1, wherein the conductive line is connected to the conductive element through a direct bonding joint rather than wire bonding.

5. A miniaturized imaging device as in claim 1, further comprising a light source carried by the utility guide.

6. A miniaturized imaging device as in claim 1, wherein the utility guide is configured to carry at least one member selected from the group consisting of electrical wires, temperature sensors, force sensors, fluid irrigation or aspiration members, pressure sensors, fiber optics, microforceps, material retrieval tools, drug delivery devices, radiation emitting devices, laser diodes, electric cauterizers, and electric stimulators.

7. A miniaturized imaging device as in claim 1, further comprising a processor and a monitor remote from the SSID, enabling real-time viewing of an image obtained by the SSID.

8. A miniaturized imaging device as in claim 1, wherein the conductive line of the umbilical includes power, ground, clock signal, and output signal.

9. A miniaturized imaging device as in claim 1, further comprising an optical insert positioned optically between the lens and the imaging array.

10. A miniaturized imaging device as in claim 9, wherein the optical insert is a color filter insert configured for providing multiple colors from a monochromatic camera image.

11. A miniaturized imaging device as in claim 1, wherein the SSID is a CCD imaging device.

12. A miniaturized imaging device as in claim 1, wherein the SSID is a CMOS imaging device.

13. A miniaturized imaging device as in claim 1, wherein the SSID is a CID imaging device.

14. A miniaturized imaging device as in claim 1, wherein the lens is a GRIN lens.

15. A method of operating a microcamera, comprising:

(a) optically coupling a lens to an SSID;

(b) defining a plurality of conductive paths, at least one of said conductive paths being configured along multiple non-coplanar surfaces of the SSID;

(c) powering the SSID through a first of the conductive paths; and

(d) receiving signal from the SSID through a second of the conductive paths.

16. A method as in claim 15, further comprising the step of illuminating an area around the lens.

17. A method as in claim 15, wherein the step of optically coupling includes the step of directly attaching the lens to an imaging array of the SSID.

18. A method as in claim 15, wherein the step of optically coupling includes the step of interposing an optical insert between the lens and an imaging array of the SSID.

19. A method as in claim 15, wherein the step of defining a plurality of conductive paths includes defining at least four conductive paths.

20. A method as in claim 19, further comprising providing ground and control to the SSID through a third conductive path and a fourth conductive path, respectively, of the at least four conductive paths.

21. A miniaturized imaging device, comprising:

(a) an SSID including, as an integral structure, an imaging array electrically coupled to a conductive pad, said SSID further including at least one utility aperture passing therethrough;

(b) a lens optically coupled to the imaging array; and

(c) an umbilical, including a conductive line carried by the at least one aperture, said conductive line being directly electrically coupled to the conductive pad.

22. A miniaturized imaging device as in claim 21, wherein the conductive line is directly electrically coupled to the conductive pad by a bonding joint rather than wire bonding.

23. A miniaturized imaging device as in claim 21, further comprising a plurality of apertures through the SSID.

24. A miniaturized imaging device as in claim 23, further comprising at least one of a light source and a fluid source carried by at least one of the plurality of apertures.

25. A miniaturized imaging device as in claim 23, wherein the plurality of apertures is further configured to carry at least one member selected from the group consisting of temperature sensors, force sensors, fluid irrigation or aspiration members, pressure sensors, fiber optics, microforceps, material retrieval tools, drug delivery devices, radiation emitting devices, laser diodes, electric cauterizers, and electric stimulators.

26. A miniaturized imaging device as in claim 21, further comprising a processor and a monitor remote from the SSID, enabling real-time viewing of an image obtained by the SSID.

27. A miniaturized imaging device as in claim 21, wherein the conductive line includes power, ground, clock signal, and output signal.

28. A miniaturized imaging device as in claim 21, further comprising an optical insert positioned optically between the lens and the imaging array.

29. A miniaturized imaging device as in claim 28, wherein the optical insert is a color filter insert configured for providing multiple colors from a monochromatic camera image.

30. A miniaturized imaging device as in claim 21, wherein the SSID is a CCD imaging device.

31. A miniaturized imaging device as in claim 21, wherein the SSID is a CMOS imaging device.

32. A miniaturized imaging device as in claim 21, wherein the SSID is a CID imaging device.

33. A miniaturized imaging device as in claim 21, wherein the lens is a GRIN lens.

34. A method of operating a microcamera, comprising:

(a) optically coupling a lens to an SSID, said SSID including an imaging array;

(b) powering the SSID through a first conductive path, said first conductive path defined by a first conductive umbilical wire, a first conductive pad, and a first bonding joint directly coupling a terminal end of the first conductive umbilical wire to the first conductive pad; and

(c) transmitting signal from the imaging array for viewing along a second conductive path, said second conductive path defined by a second conductive pad, a second conductive umbilical wire, and a second bonding joint directly coupling the second conductive pad to a terminal end of the second conductive umbilical wire.

35. A method as in claim 34, further comprising the step of illuminating an area around the lens.

36. A method as in claim 34, wherein the step of optically coupling includes the step of directly attaching the lens to an imaging array of the SSID.

37. A method as in claim 34, wherein the step of optically coupling includes the step of interposing an optical insert between the lens and an imaging array of the SSID.

38. A method as in claim 34, further comprising defining at least two additional conductive paths.

39. A method as in claim 34, further comprising providing ground and control to the SSID through the at least two additional conductive paths, respectively.

40. A method of making an SSID, comprising:

(a) forming features within a predetermined area of a manufacture substrate having a thickness, said features including a conductive pad electrically coupled to an imaging array;

(b) removing portions of the manufacture substrate outside of the predetermined area such that the thickness outside the predetermined area is reduced, thereby forming an SSID attached to a thinned manufacture substrate, said SSID having a top surface including the conductive pad, and a side surface adjacent to the top surface;

(c) three-dimensionally masking the SSID such that the conductive pad and the side surface are exposed; and

(d) applying a conductive material to the conductive pad and the side surface to electrically couple the conductive pad and the side surface.

41. A method as in claim 40, wherein the step of removing portions of the manufacture substrate is accomplished by masking the predetermined area with a first photoresist material to protect the predetermined area from manufacture substrate removal.

42. A method as in claim 41, further comprising the step of removing the first photoresist material prior to the step of three-dimensionally masking the SSID.

43. A method as in claim 40, comprising a subsequent step of removing the SSID from the thinned manufacture substrate after the conductive material has been applied.

44. A method as in claim 40, wherein the step of three-dimensionally masking the SSID is with a second photoresist material.

45. A method as in claim 44, further comprising the step of removing the second masking material after the step of applying the conductive material.

46. A method of making an SSID, comprising:

(a) forming features within a predetermined area of a manufacture substrate having a thickness, said features including a conductive pad electrically coupled to an imaging array;

(b) removing portions of the manufacture substrate outside of the predetermined area such that the thickness outside the predetermined area is reduced, thereby forming an SSID attached to a thinned manufacture substrate;

(c) forming utility apertures through the SSID; and

(d) removing the SSID from the thinned manufacture substrate.