Method of cleaning a semiconductor process chamber

• US 20030221708A1
• Filed: 06/04/2002
• Published: 12/04/2003
• Est. Priority Date: 06/04/2002
• Status: Abandoned Application

• Current Assignee: L'Air Liquide SA, STMicroelectronics SA (STMicroelectronics NV)
• Original Assignee: L'Air Liquide SA, STMicroelectronics SA (STMicroelectronics NV)
• Inventors: Ly, Chun-Hao, Campidelli, Yves
• Application Number:
  US10/160,240
• Publication Number:
  US 20030221708A1
• Time in Patent Office: Days
• US Class Current: 134/18
• CPC Class Codes: B08B 7/00 Cleaning by methods not provided for in a single other subclass or a single group in this subclass
• CPC Class Codes: C23C 16/4405 Cleaning of reactor or parts inside the reactor by using reactive gases

Abstract

Provided is a novel method of cleaning a semiconductor process chamber having deposits on an inner surface thereof. The method involves: (a) introducing a cleaning gas comprising hydrogen chloride into the process chamber, wherein the cleaning gas is effective to react with and remove the deposits from the inner surface of the process chamber; (b) removing gas from the process chamber; and (c) monitoring at least a portion of the removed gas for a species indicative of an endpoint of the chamber cleaning. The invention allows for the cleaning of semiconductor process chambers in an efficient manner so as to reduce process down time and improve process throughput. The method can be applied to in-line analysis.

Claims

1. A method of cleaning a semiconductor process chamber having deposits on an inner surface thereof, comprising:

(a) introducing a cleaning gas comprising hydrogen chloride into the process chamber, wherein the cleaning gas is effective to react with and remove the deposits from the inner surface of the process chamber;

(b) removing gas from the process chamber; and

(c) monitoring with a monitoring system at least a portion of the removed gas for a species indicative of an endpoint of the chamber cleaning.

2. The method according to claim 1, further comprising:

(d) automatically controlling one or more functions based on output from the monitoring system.

3. The method according to claim 2, wherein the one or more functions comprise flow of the cleaning gas into the process chamber.

4. The method according to claim 3, wherein the flow of the cleaning gas into the chamber is stopped when the species reaches a predetermined level.

5. The method according to claim 1, wherein the monitoring system is a mass spectrometer system.

6. The method according to claim 5, wherein the monitoring system is a quadrupole mass spectrometer.

7. The method according to claim 1, wherein the cleaning process is conducted at about atmospheric pressure.

8. The method according to claim 1, wherein the cleaning process is conducted under vacuum.

9. The method according to claim 1, wherein the semiconductor process chamber forms part of an epitaxial growth reactor or a chemical vapor deposition reactor for depositing a silicon- or germanium-containing film, the film being doped or undoped.

10. The method according to claim 1, wherein the species being monitored comprises chlorine.

11. The method according to claim 10, wherein the species being monitored is SiCl₄, GeCl₄ or HCl.

12. A method of cleaning a semiconductor process chamber having silicon- or germanium-containing deposits on an inner surface thereof, comprising:

(a) introducing a cleaning gas comprising hydrogen chloride into the process chamber; and

(b) continuously monitoring a reactant or a product of the reaction between the hydrogen chloride and the silicon- or germanium-containing deposits with a mass spectrometer.

13. The method according to claim 12, further comprising:

(c) automatically controlling one or more functions based on output from the mass spectrometer.

14. The method according to claim 13, wherein the one or more functions comprise flow of the cleaning gas into the process chamber.

15. The method according to claim 13, wherein the flow of the cleaning gas into the chamber is stopped when the monitored reactant or product reaches a predetermined level.

16. The method according to claim 12, wherein the monitoring system is a quadrupole mass spectrometer.

17. The method according to claim 12, wherein the semiconductor process chamber forms part of an epitaxial growth reactor for depositing single crystalline silicon or silicon-containing films or a chemical vapor deposition reactor for depositing polysilicon films, the films being doped or undoped.

18. The method according to claim 12, wherein the species being monitored is SiCl₄, GeCl₄ or HCl.

19. The method according to claim 18, wherein the species being monitored is SiCl₄ or HCl.

20. The method according to claim 18, wherein the species being monitored is GeCl₄.