Optical package structure

• US 20030222271A1
• Filed: 07/18/2002
• Published: 12/04/2003
• Est. Priority Date: 05/30/2002
• Status: Active Grant

• Current Assignee: Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hon Hai Precision Industry Co., Ltd.
• Inventors: Huang, Nan Tsung, Mou, Chung Shin
• Granted Patent: US 6,787,890 B2
• Time in Patent Office: Days
• US Class Current: 257/100
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01S 5/02345 Wire-bonding
• CPC Class Codes: H01S 5/4025 Array arrangements, e.g. constituted by discrete laser diodes or laser bar H01S5/42 takes precedence

Abstract

An optical package structure (2) includes a cover (21) with a lens part (22), and a base member (23) which combines with the cover to define a closed space in which to package optical components. The base member has a bottom panel (232) and a substrate (234). A plurality of solder pads (231, 237) is provided on a top and bottom surfaces (2321, 2342) of the bottom panel and of the substrate. The solder pads on the top surface electrically connect with the optical components. A plurality of inner conductive traces (236, 238) is provided through the bottom panel and the substrate which electrically connect the solder pads on the top surface of the bottom panel with corresponding solder pads on the bottom surface of the substrate via printed circuits (235) on the substrate. Thus, an external electrical connection of the optical components is attained without wires and electrical pins.

Claims

1. An optical package structure comprising:

a cover with a lens part in a top portion of the cover;

a base member combining with the cover to define a closed space to package optical components therein;

wherein a plurality of solder pads is provided on both a top and a bottom surfaces of the base member, and a plurality of inner conductive traces which extends through the base member is provided to electrically connect with the solder pads on the top surface to the solder pads on the bottom surface.

2. The optical package structure as claimed in claim 1, wherein a plurality of optical components are fitted in the optical package structure connecting to the corresponding solder pads and a printed circuit board is provided on which the optical package structure is mounted.

3. The optical package structure as claimed in claim 2, wherein the base member includes a bottom panel and a substrate.

4. The optical package structure as claimed in claim 3, wherein the bottom panel has a first surface, a second surface, and a plurality of inner conductive traces extending through the bottom panel, and a plurality of the solder pads is provided on the first surface to electrically connect with the conductive traces.

5. The optical package structure as claimed in claim 4, wherein the substrate has a top surface with printed circuits thereon, a bottom surface with a plurality of the solder pads thereon, and a plurality of inner conductive traces extending through the substrate to electrically connect the printed circuits with the solder pads.

6. The optical package structure as claimed in claim 5, wherein the substrate combines with the bottom panel so that the conductive traces of the bottom panel electrically connect with respective printed circuits on the substrate.

7. An optical package structure comprising:

a cover defining an aperture in a top portion for transmission of optical signals;

a lens part secured to the cover; and

a base member combining with the cover to define a closed space to package optical components therein;

wherein a plurality of solder pads is provided on both a top and a bottom surfaces of the base member, and a plurality of inner conductive traces extends through the base member and provides an electrical connection of the solder pads on the top surface with the solder pads on the bottom surface.

8. The optical package structure as claimed in claim 7, wherein a plurality of optical components are fitted in the optical package structure connecting to the corresponding solder pads and a printed circuit board is provided on which the optical package structure is mounted.

9. The optical package structure as claimed in claim 8, wherein the optical package structure further includes an engaging part that surrounds the cover for engaging with an optical fiber or other optical components.

10. The optical package structure as claimed in claim 9, wherein the engaging part also has an opening that can make the assembly and disassembly of the engaging part to the cover more easily.

11. The optical package structure as claimed in claim 8, wherein the lens part comprises a lens and a mounting frame to receive the lens therein.

12. The optical package structure as claimed in claim 11, wherein the lens part is secured within the cover with the lens optically focusing through the aperture of the cover.

13. The optical package structure as claimed in claim 8, wherein the base member is formed from a kind of ceramic using Low-Temperature Co-Fired Ceramic technology.

14. An optical package structure comprising:

a cover with a lens part in an upper portion thereof;

a base member fastened to the cover with a space therebetween to receive optoelectronic components therein; and

said base member including a plurality of solder pads on a bottom face thereof;

wherein

said solder pads are electrically connected to said optoelectronic components via circuits extending vertically through said base member and radially horizontally in a plane defined by said base member.