Die connected with integrated circuit component for electrical signal passing therebetween

• US 20030222337A1
• Filed: 05/31/2002
• Published: 12/04/2003
• Est. Priority Date: 05/24/2002
• Status: Active Grant

• Current Assignee: Northrop Grumman Systems Corporation (Northrop Grumman Corporation)
• Original Assignee: Litton Systems Incorporated (Northrop Grumman Corporation)
• Inventors: Stewart, Robert E.
• Granted Patent: US 6,992,399 B2
• Time in Patent Office: Days
• US Class Current: 257/684
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 7/0054 between other parts not provided for in B81B7/0048 - B81B7/0051
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: B81C 2203/0792 Forming interconnections between the electronic processing unit and the micromechanical structure
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/1433 Application-specific integrated circuit [ASIC]

Abstract

An apparatus in one example includes a die with at least first and second portions, the first portion of the die mechanically and electrically connectable with a circuit board. The apparatus includes an integrated circuit component mechanically and electrically connected with the second portion of the die. Upon operation the die serves to generate one or more electrical signals that are passed to the integrated circuit component.

Claims

1. An apparatus, comprising:

a die with at least first and second portions, the first portion of the die mechanically and electrically connectable with a circuit board; and

an integrated circuit component mechanically and electrically connected with the second portion of the die;

wherein upon operation the die serves to generate one or more electrical signals that are passed to the integrated circuit component.

2. The apparatus of claim 1, wherein the one or more electrical signals comprise one or more first electrical signals;

wherein upon operation the integrated circuit component serves to generate one or more second electrical signals, based upon the one or more first electrical signals, that are passed to the die for output to the circuit board.