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Die connected with integrated circuit component for electrical signal passing therebetween

  • US 20030222337A1
  • Filed: 05/31/2002
  • Published: 12/04/2003
  • Est. Priority Date: 05/24/2002
  • Status: Active Grant
First Claim
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1. An apparatus, comprising:

  • a die with at least first and second portions, the first portion of the die mechanically and electrically connectable with a circuit board; and

    an integrated circuit component mechanically and electrically connected with the second portion of the die;

    wherein upon operation the die serves to generate one or more electrical signals that are passed to the integrated circuit component.

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