Latching micro-magnetic switch with improved thermal reliability

• US 20030222740A1
• Filed: 03/18/2003
• Published: 12/04/2003
• Est. Priority Date: 03/18/2002
• Status: Abandoned Application

• Current Assignee: Magfusion, Inc. (Schneider Electric SE)
• Original Assignee: Microlab, Inc.
• Inventors: Shen, Jun, Ruan, Meichun, Tam, Gordon
• Application Number:
  US10/390,164
• Publication Number:
  US 20030222740A1
• Time in Patent Office: Days
• US Class Current: 335/78
• CPC Class Codes: H01H 2050/007 Relays of the polarised type, e.g. the MEMS relay beam having a preferential magnetisation direction
• CPC Class Codes: H01H 50/005 using micromechanics

Abstract

A micro-magnetic switch includes a permanent magnet and a supporting device having contacts coupled thereto and an embedded coil. The supporting device can be positioned proximate to the magnet. The switch also includes a cantilever coupled at a central point to the supporting device. The cantilever has a conducting material coupled proximate an end and on a side of the cantilever facing the supporting device and having a soft magnetic material coupled thereto. During thermal cycling the cantilever can freely expand based on being coupled at a central point to the supporting device, which substantially reduces coefficient of thermal expansion differences between the cantilever and the supporting device.

Claims

1. A micro-magnetic switch comprising:

a permanent magnet;

a supporting device having contacts coupled thereto and an embedded coil, the supporting device being positioned proximate to the magnet; and

a cantilever coupled to the supporting device at a location approximately at a central point of the cantilever, the cantilever having a conducting material coupled proximate an end and on a side of the cantilever facing the supporting device and having a soft magnetic material coupled thereto,

wherein during thermal cycling the cantilever can freely expand based on being coupled at a central point to the supporting device, which substantially reduces coefficient of thermal expansion differences between the cantilever and the supporting device.

2. The switch of claim 1, further comprising:

a metal layer coupled to the supporting device; and

an insulating layer formed on the metal layer, wherein the central point of the cantilever is coupled to the insulating layer.

3. The switch of claim 1, further comprising:

a high permeability layer formed between the metal layer and the supporting device.

4. The switch of claim 1, wherein the contacts comprise first and second spaced input contacts and first and second spaced output contacts, such that the conducting material interacts with both contacts substantially simultaneously, which balances an external actuation force.

5. The switch of claim 1, wherein the cantilever comprises a spring between the central point and first and second end points.

6. The switch of claim 1, wherein the cantilever comprises two springs between the central point and each of first and second end points.

7. The switch of claim 1, wherein the cantilever is coupled via first and second spaced areas of the central point to the supporting structure.