Electronic circuit device

• US 20030227025A1
• Filed: 04/22/2003
• Published: 12/11/2003
• Est. Priority Date: 04/26/2002
• Status: Active Grant

• Current Assignee: Panasonic Semiconductor Solutions Co., Ltd. (Winbond Electronics Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Ochi, Takao, Takata, Takashi
• Granted Patent: US 7,268,417 B2
• Time in Patent Office: Days
• US Class Current: 257/100
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/564 Details not otherwise provided for, e.g. protection against moisture getters H01L23/26
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group

Abstract

A electronic circuit device is provided with an electronic component provided with an electrode, a substrate having an upper surface on which the electronic component is mounted, external electrode that is formed near the electronic component mounted on the upper surface of the substrate and that is connected to the electrode, an insulating protrusion that is provided across the upper surface of the external electrode, and a sealing resin that seals the electronic component without covering the external electrode. The upper surface of the external electrode is partitioned by the protrusion into a first area that is located on the sealing resin side and a second area that is located the side opposite to the first area. The adherence of fine particles such as flakes of the sealing resin to the external electrode is suppressed, so that a stable electric connection between the external electrode and the electric equipment can be maintained.

Claims

1. An electronic circuit device comprising:

an electronic component provided with an electrode;

a substrate having an upper surface on which the electronic component is mounted;

an external electrode that is formed on the upper surface of the substrate, and that is connected to the electrode;

an insulating protrusion that is provided across the upper surface of the external electrode; and

a sealing resin that seals the electronic component without covering the external electrode;

wherein the upper surface of the external electrode is partitioned by the protrusion into a first area that is located on the sealing resin side and a second area that is located on the side opposite to the first area.

2. The electronic circuit device according to claim 1, wherein a height of the protrusion is at least 10 μ

m.

3. The electronic circuit device according to claim 1, wherein a plurality of protrusions are formed in an area ranging from the end on the sealing resin side of the external electrode to the end on the substrate outer edge side of the external electrode.

4. The electronic circuit device according to claim 1, wherein a slit is formed in an area of the substrate between the sealing resin and the protrusion.

5. The electronic circuit device according to claim 3, wherein a slit is formed in an area of the substrate between the sealing resin and the protrusion that is closest to the sealing resin.

6. The electronic circuit device according to claim 1, wherein a second protrusion is formed on the upper surface of an end portion of the external electrode on the side of the sealing resin, or on the upper surface of the substrate adjacent to the end portion, and a slit is formed in an area of the substrate between the sealing resin and the second protrusion.

7. The electronic circuit device according to claim 1, wherein the protrusion is made of a solder resist, a painting material, or a screen printing material.

8. The electronic circuit device according to claim 7, wherein the protrusion is formed by photolithography using a solder resist.

9. The electronic circuit device according to claim 1, wherein a plurality of external electrodes are formed, and the protrusion is formed in a straight line across the plurality of external electrodes.

10. The electronic circuit device according to claim 1, wherein the electric component is a semiconductor chip, and the substrate is card-shaped.