Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture
First Claim
Patent Images
1. A circuit element comprising:
- a substrate;
a coating disposed on the substrate, the coating comprising;
a pigment; and
a hydrophobic binder; and
a conductive trace adjacent to the coating.
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Abstract
Disclosed is a circuit element including a substrate, a coating disposed on the substrate, and a conductive trace adjacent to the coating. The coating includes both pigment and hydrophobic binder. Also disclosed is a method for forming a circuit element. The method includes the steps of providing a substrate, disposing a coating that includes both a pigment and a hydrophobic binder on the substrate, and printing a conductive trace on the coating.
125 Citations
23 Claims
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1. A circuit element comprising:
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a substrate;
a coating disposed on the substrate, the coating comprising;
a pigment; and
a hydrophobic binder; and
a conductive trace adjacent to the coating. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of forming a circuit element, the method comprising the steps of:
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providing a substrate;
disposing a coating on the substrate, the coating comprising;
a pigment; and
a hydrophobic binder; and
printing a conductive ink on the substrate. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification