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Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods

  • US 20030230802A1
  • Filed: 07/17/2002
  • Published: 12/18/2003
  • Est. Priority Date: 06/18/2002
  • Status: Active Grant
First Claim
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1. A module including a plurality of semiconductor devices in stacked arrangement comprising:

  • a first function level comprising;

    a first semiconductor device including a first pattern of outer connectors exposed at a peripheral edge thereof; and

    a carrier substrate underlying said first semiconductor device and including conductive sites arranged correspondingly to said first pattern and electrically connected thereto;

    a second function level comprising;

    a second semiconductor device including a second pattern of outer connectors exposed at a peripheral edge thereof; and

    a first intermediate substrate underlying said second semiconductor device and at least partially overlying said first semiconductor device, said first intermediate substrate including conductive connectors, at least some of which are arranged in a third pattern and positioned along a peripheral edge of said first intermediate substrate, said third pattern conforming at least partially to said first pattern; and

    others of which conductive connectors are arranged in a fourth pattern and positioned along a peripheral edge of said first intermediate substrate, said third pattern conforming at least partially to said second pattern, conductive connectors of said first intermediate substrate being electrically connected to corresponding outer connectors of said first and second patterns.

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