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Semiconductor device and manufacturing method thereof

  • US 20030230805A1
  • Filed: 04/23/2003
  • Published: 12/18/2003
  • Est. Priority Date: 04/23/2002
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a semiconductor die;

    a first insulation film disposed on a top surface of the semiconductor die;

    a first wiring portion disposed on the first insulation film;

    a holding substrate disposed over the top surface of the semiconductor die and holding the semiconductor die;

    a second insulation film comprising a side film and a back film, the side film being disposed on a side surface of the semiconductor die and the back film being disposed on a back surface of the semiconductor die;

    a second wiring portion disposed on the side film and the back film and connected to the first wiring portion; and

    a conductive terminal formed on the second wiring.

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