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Method for forming a photoresist pattern on a semiconductor substrate

  • US 20030232283A1
  • Filed: 06/18/2002
  • Published: 12/18/2003
  • Est. Priority Date: 06/18/2002
  • Status: Abandoned Application
First Claim
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1. A method for forming photoresist layers on a substrate, comprising the steps of:

  • coating a first photoresist material on the substrate;

    coating a second photoresist material on the first photoresist material before baking the first photoresist material; and

    baking the substrate to simultaneously form a first photoresist layer and a second photoresist layer over the the first photoresist layer.

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